A memory device includes a plurality of memory cells each including a switching device and a storage device having a phase change material, a decoder circuit including a first bias circuit inputting a first bias voltage to a selected word line connected to a selected memory cell, a second bias circuit inputting a second bias voltage to a selected bit line, a first selection switching device and a first non-selection switching device connected between the first bias circuit and the selected word line, and a second selection switching device and a second non-selection switching device connected between an adjacent word line and the first bias circuit, a control logic sequentially turning off the first selection switching device and the second non-selection switching device, and a sense amplifier comparing a voltage of the selected word line with a reference voltage to determine data of a read operation.

Signal edge sharpener circuitry is operably connected to the word lines in a memory array to pull up a rising edge of a signal on the word line and/or to pull down a falling edge of the signal on the word line. Pulling the signal up and/or down reduces the amount of time the word line is asserted and reduces the amount of time between precharge operations.

In some examples, an inactive word line voltage control (IWVC) circuit may be configured to provide a respective subword driver associated with a memory bank of a plurality of memory banks a non-active potential from a default off-state word line voltage (VNWL) to a reduced voltage VNWL lower than the default VNWL following a time duration after activating the memory bank. The IWVC circuit may also be configured to provide the respective subword driver with the default VNWL responsive to precharging the memory bank. The IWVC circuit may include a multiplexer coupled to the subword driver and configured to provide the default VNWL or the reduced voltage VNWL to the respective subword driver responsive to a VNWL control signal. The IWVC circuit may also include a time control circuit configured to provide the VNWL control signal responsive to a clock signal and a time control signal.

Methods, systems, and devices for delay calibration oscillators for a memory device are described. In some examples, a memory device may include a delay chain operable (e.g., for a calibration operation) in a ring oscillator configuration that includes a pulse generator. The pulse generator may be configured to output a pulse signal responsive to a transition of an input signal. By generating a pulse signal in a feedback loop of a ring oscillator, the ring oscillator may support a cycle that does not rely on both a first transition propagation pass (e.g., a rising edge propagation) and a responsive, opposite transition propagation pass (e.g., a falling edge propagation) through the delay chain, which may support a ring oscillator cycle time (e.g., period) that more closely represents aspects of the delay chain that are meant to be calibrated.

The present disclosure discloses a memory access interface device. The clock generation circuit thereof generates reference clocks. Each of the DDR access signal transmission circuits thereof, under a DDR mode, adjusts a phase and a duty cycle of one of DDR access signals according to one of DDR reference clock signals to generate one of output access signals to access the memory device. The data signal transmission circuit thereof, under an SDR mode, applies a minimum latency on an SDR data signal according to the command and address reference clock signal to generate an output SDR data signal to access the memory device. The command and address signal transmission circuit thereof, under either the DDR or SDR mode, applies a programmable latency on a command and address signal according to the command and address reference clock signal to generate an output command and address signal to access the memory device.

A semiconductor memory instance is provided that includes an array of memory cells. The array includes a plurality of semiconductor memory cells arranged in at least one column and at least one row. Each of the semiconductor memory cells includes a floating body region configured to be charged to a level indicative of a state of the memory cell. Further includes are a plurality of buried well regions, wherein each of the buried well regions can be individually selected, and a decoder circuit to select at least one of the buried well regions.

Techniques for a non-volatile memory module are provided. In an example, an apparatus can include a first memory device comprising a first type of memory media, a second memory device comprising a second type of memory media, and a controller. The controller can transfer data from the first memory device to the second memory device based at least in part on loss of system power to the apparatus while operating on power provided by a backup power source, restore the data from the second memory device to the first memory device based at least in part on the system power to the apparatus being re-established, identity chip failure of the second memory device, the chip failure based at least in part on restoring the data from the second memory device to the first memory device, and operate the apparatus based at least in part on the chip failure identified.

Techniques for a non-volatile memory module are provided. In an example, an apparatus can include a first memory device comprising a first type of memory media, a second memory device comprising a second type of memory media, and a controller. The controller can transfer data from the first memory device to the second memory device based at least in part on loss of system power to the apparatus while operating on power provided by a backup power source, restore the data from the second memory device to the first memory device based at least in part on the system power to the apparatus being re-established, identity chip failure of the second memory device, the chip failure based at least in part on restoring the data from the second memory device to the first memory device, and operate the apparatus based at least in part on the chip failure identified.

The present disclosure includes apparatuses and methods to transfer data between banks of memory cells. An example includes a plurality of banks of memory cells and a controller coupled to the plurality of subarrays configured to cause transfer of data between the plurality of banks of memory cells via internal data path operations.

The present disclosure includes apparatuses and methods to transfer data between banks of memory cells. An example includes a plurality of banks of memory cells and a controller coupled to the plurality of subarrays configured to cause transfer of data between the plurality of banks of memory cells via internal data path operations.