A semiconductor memory device includes a memory cell array including a plurality of cell cores which include a first cell core corresponding to a first channel that is a normal channel and a second cell core corresponding to a second channel that is a failed channel; and an access circuit configured to perform address remapping by converting a first address of at least a first failed cell in the first cell core into a second address of at least a second cell in the second cell core, and to transmit data of at least the second cell through the first channel.

A semiconductor memory device includes a memory cell array including a plurality of cell cores which include a first cell core corresponding to a first channel that is a normal channel and a second cell core corresponding to a second channel that is a failed channel; and an access circuit configured to perform address remapping by converting a first address of at least a first failed cell in the first cell core into a second address of at least a second cell in the second cell core, and to transmit data of at least the second cell through the first channel.

A bank control circuit includes an implicit signal generation unit suitable for activating an implicit signal when a first active signal corresponding to a bank which is in an activated state bank, among a plurality of banks; and a delay unit suitable for delaying the implicit signal by a predetermined time, wherein the bank corresponding to the first active signal is precharged based on the implicit signal and activated again based on the delayed implicit signal.

A memory channel includes a dual channel double data rate (DDR) memory device having a first bank of memory accessed by a first data bus and a first command/address (C/A) bus, and a second bank of memory accessed by a second data bus and a second C/A bus, and a memory controller configured to train the first and second C/A busses with both the first and second C/A busses active, and to train one of the first and second C/A busses with the other of the first and second C/A busses idle.

A three-dimensional memory device includes an alternating stack of insulating layers and electrically conductive word line layers located over a substrate, and a plurality of vertical memory strings. Each vertical memory string includes a series connection of a memory stack structure and a selector element. Each of the memory stack structures extends through the alternating stack and includes a respective memory film and a respective vertical semiconductor channel. Each of the selector elements includes a two terminal device that is configured to provide at least two different resistivity states.

A semiconductor memory instance is provided that includes an array of memory cells. The array includes a plurality of semiconductor memory cells arranged in at least one column and at least one row. Each of the semiconductor memory cells includes a floating body region configured to be charged to a level indicative of a state of the memory cell. Further includes are a plurality of buried well regions, wherein each of the buried well regions can be individually selected, and a decoder circuit to select at least one of the buried well regions.

A method for reducing current consumption of a memory is disclosed, wherein the memory includes a controller and a plurality of banks, and each bank of the plurality of banks includes a plurality of segments. The method includes the controller enabling an activating command corresponding to a first row address and an address of a first bank of the plurality of banks; a word line switch of a segment of the first bank corresponding to the first row address being turned on according to the activating command; the controller enabling an access command corresponding to an address of the segment; a plurality of bit switches corresponding to the segment being turned on according to the access command; and the controller enabling a pre-charge command corresponding to an address of a following segment and the address of the first bank after the access command is disabled.

According to one embodiment, electrodes are provided in stacked M (M is an integer of 2 or more) semiconductor chips, a transmission units are provided for the semiconductor chips and, based on a chip identification information on a semiconductor chip in the present stage, transmits the chip identification information on a semiconductor chip in the next stage via the electrodes, or transmit a data for setting the chip identification information, and the direction in which an external signal is sent via the electrodes is opposite to the direction in which the chip identification information is transmitted via the electrodes.

A memory controller for dual-channel DDR DIMMs comprises a first memory channel configured to execute a first memory transaction with a first memory device of a dual-channel DDR DIMM, and a second memory channel configured to execute a second memory transaction with a second memory device of the dual-channel DDR DIMM. The memory controller is configured to determine that the first memory channel is experiencing a degraded performance level in executing the first memory transaction with the first device, and to prevent read-write memory transactions and write-read memory transactions on the first and second memory channels in response to determining that the first memory channel is experiencing the degraded performance level.

Electronic devices and methods including a printed circuit board configured to accept CPUs and memory modules are described. One apparatus includes a printed circuit board that includes a first row of elements including a first CPU positioned between first and second groups of dual in-line memory modules (DIMMs). The printed circuit board also includes a second row of elements including a second CPU positioned between third and fourth groups of DIMMs. The apparatus also includes a third row of elements including a fifth group of DIMMs, wherein the second row of elements is positioned between the first row of elements and the third row of elements. Other embodiments are described and claimed.