A ReRAM device includes a dielectric layer, a bottom electrode, a data storage layer, a metal covering layer, and a top electrode. The dielectric layer has a recess. At least a portion of the bottom electrode is exposed through the recess. The data storage layer is disposed on a sidewall and a bottom surface of the recess, electrically contacts with the bottom electrode, and has a top portion lower than an opening of the recess. The metal covering layer blanket covers the data storage layer, has an extension portion covering the top portion, and connects to the sidewall of the recess. The top electrode is disposed in the recess, and is electrically contact with the metal covering layer.

One or more memory systems, architectural structures, and/or methods of storing information in memory devices is disclosed to improve the data bandwidth and or to reduce the load on the communication links. The system may include one or more memory devices, one or more memory control circuits and one or more data buffer circuits. The memory system, architectural structure and/or method improves the ability of the communications links to transfer data downstream to the data buffer circuits. The memory control circuit receives a store command and a store data tag (Host tag) from a Host and sends the store data command and the store data tag to the data buffer circuits. No store data tag or control signal is sent over the communication links between the Host and the data buffer circuits, only data is sent over the communication links between the Host and the data buffer circuits.

Apparatuses, memories, and methods for decoding memory addresses for selecting access lines in a memory are disclosed. An example apparatus includes an address decoder circuit coupled to first and second select lines, a polarity line, and an access line. The first select line is configured to provide a first voltage, the second select line is configured to provide a second voltage, and the polarity line is configured to provide a polarity signal. The address decoder circuit is configured to receive address information and further configured to couple the access line to the first select line responsive to the address information having a combination of logic levels and the polarity signal having a first logic level and further configured to couple the access line to the second select line responsive to the address information having the combination of logic levels and the polarity signal having a second logic level.

A device includes an electronic component, and the electronic component includes a first pad, a second pad, and a strip connecting the first pad and the second pad. The device further includes a first electrode in contact with the first pad and a second electrode in contact with the second pad. The electronic component is made of a phase change material. At least one of the first electrode and the second electrode is coated with a material that is configured to increase a difference in workfunction between the first electrode and the second electrode.

Methods, systems, and devices for operating a ferroelectric memory cell or cells are described. A cell may be written with a value that is intended to convey a different logic state than may typically be associated with the value. For example, a cell that has stored a charge associated with one logic state for a time period may be re-written to store a different charge, and the re-written cell may still be read to have the originally stored logic state. An indicator may be stored in a latch to indicate whether the logic state currently stored by the cell is the intended logic state of the cell. A cell may, for example, be re-written with an opposite value periodically, based on the occurrence of an event, or based on a determination that the cell has stored one value (or charge) for a certain time period.

A memory device is provided in which blocks of memory cells are divided into separate portions or sub-blocks with respective sets of word line switching transistors. The sub-blocks can be arranged on a substrate on opposite sides of a dividing line, where a separate set of bit lines is provided on each side of the dividing line. Each block has a row decoder which provides a common word line voltage signal to each sub-block of the block. However, each sub-block can have an independent set of word line switching transistors so that the common word line voltage signal can be passed or blocked independently for each sub-block. The blocks of memory cells can be provided on a first die which is inverted and bonded to a second die which includes the sets of word line switching transistors.

A reducing peak current consumption in a memory device when performing a word line voltage refresh operation or a read operation. When a word line voltage refresh operation or read operation is performed for the first time after a memory device powers up, the operation is performed with a power-saving technique such as reducing a ramp up rate of a voltage pulse, ramping up the voltage pulse in multiple steps, initiating the ramp up for different groups of word lines in a block at different times, initiating the ramp up for different blocks of word lines at different times, and reducing the number of blocks which are refreshed concurrently. When an additional word line voltage refresh operation or read operation is subsequently performed, the power-saving technique can be omitted.

Subject matter disclosed herein relates to management of a memory device.

A resistive element array circuit includes word lines, bit lines, resistive elements, a selector, a differential amplifier, and a ground terminal. The word lines are coupled to a power supply. The resistive elements are each disposed at an intersection of corresponding one of the word lines and corresponding one of the bit lines. The selector is configured to select one word line and one bit line. The differential amplifier includes a positive input terminal configured to be coupled to the selected one of the bit lines which is selected by the selector, a negative input terminal configured to be coupled to non-selected one of the bit lines which is not selected by the selector and to non-selected one of the word lines which is not selected by the selector, an output terminal being coupled to the negative input terminal. The ground terminal is coupled to the positive input terminal.

A memory circuit configured to perform multiply-accumulate (MAC) operations for performance of an artificial neural network includes a series of synapse cells arranged in a cross-bar array. Each cell includes a memory transistor connected in series with a memristor. The memory circuit also includes input lines connected to the source terminal of the memory transistor in each cell, output lines connected to an output terminal of the memristor in each cell, and programming lines coupled to a gate terminal of the memory transistor in each cell. The memristor of each cell is configured to store a conductance value representative of a synaptic weight of a synapse connected to a neuron in the artificial neural network, and the memory transistor of each cell is configured to store a threshold voltage representative of a synaptic importance value of the synapse connected to the neuron in the artificial neural network.