An embodiment in the application may include an analog memory structure, and methods of writing to such a structure, including a volatile memory element in series with a non-volatile memory element. The analog memory structure may change resistance upon application of a voltage. This may enable accelerated writing of the analog memory structure.

Memory devices have an array of elements in two or more dimensions. The memory devices use multiple access lines arranged in a grid to access the memory devices. Memory cells are located at intersections of the access lines in the grid. Drivers are used for each access line and configured to transmit a corresponding signal to respective memory cells of the plurality of memory cells via a corresponding access line. The memory devices also include compensation circuitry configured to determine which driving access lines driving a target memory cell of the plurality of memory cells has the most distance between the target memory cell and a respective driver. The plurality of access lines comprise the driving access lines. The compensation circuitry also is configured to output compensation values to adjust the voltages of the driving access lines based on a polarity of the voltage of the longer driving access line.

A memory includes: a first electrode comprising a top boundary and a sidewall; a resistive material layer, disposed above the first electrode, that comprises at least a first portion and a second portion coupled to a first end of the first portion, wherein the resistive material layer presents a variable resistance value; and a second electrode disposed above the resistive material layer.

Embodiments of the disclosure are drawn to apparatuses and methods for staggering the timing of skipped refresh operations on a memory. Memory cells of memories may need to periodically perform refresh operations. In some instances, auto-refresh operations may be periodically skipped when charge retention characteristics of the memory cells of the memory exceed the auto-refresh frequency. To reduce peak current draw during refresh operations, the skipped refresh operations may be staggered across different portions of the memory. In one example, the skipped refresh operation may be staggered in time among memory dies of the memory to limit a number of memory dies that are performing an auto-refresh operation to a maximum number. In another example, the skipped refresh operation may be staggered in time among memory banks of a single memory array to limit a number of memory banks that are performing an auto-refresh operation to a maximum number.

According to one embodiment, a magnetic storage device includes a nonvolatile magnetic memory including a magnetoresistance effect element capable of storing data. A magnetic sensor is configured to measure the magnitude of an external magnetic field. A controller is configured to detect errors in the data at first time intervals when the measured magnitude of the external magnetic field is less than a threshold value and to detect errors in the data at second time intervals shorter than the first time interval when the measured magnitude of the external magnetic field is equal to or greater than the threshold value.

The present invention is directed to a nonvolatile memory device including a plurality of memory cells arranged in rows and columns, a plurality of word lines with each connected to a respective row of the memory cells along a row direction, a plurality of bit lines with each connected to a respective column of the memory cells along a column direction; a column decoder connected to the bit lines; a plurality of sense amplifiers connected to the column decoder; and a plurality of sense amplifier control circuits. Each of the sense amplifiers is connected to a unique one of the sense amplifier control circuits. Each of the sense amplifier control circuits includes a current detector circuit for detecting a sensing current, a current booster circuit for boosting the sensing current, and a timer circuit for providing a delayed trigger for a respective one of the sense amplifiers connected thereto.

A system and method of secure communication between computing devices based on physical unclonable functions such as memories having dissolvable conductive paths is provided. The method involves enrolling a client device, the client device having a PUF such as a pristine ReRAM. The PUF is enrolled in a secure environment by reading and storing the resistances of the PUF's addressable memory cells. The cells are categorized into “rugged” and “vulnerable” categories on the basis of their resistance, the vulnerable cells being those more likely to be permanently altered during the generations of PUF responses. The rugged cells are used for the generation of PUF responses for cryptographic key generation, but the vulnerable cells may be inspected to detect unauthorized 3rd party access to the PUF.

A system includes a memory device having multiple dice and a processing device operatively coupled to the memory device. The processing device is to perform operations, including receiving a memory operation to program a set of pages of data across at least a subset of the plurality of dice. The operations further include partitioning the set of pages into a set of partitions, programming the set of partitions to the plurality of dice, and storing, in a metadata table, at least one bit to indicate that the set of pages is partitioned.

According to one embodiment, a memory device includes a nonvolatile memory, a volatile memory, a controller, and a board. The nonvolatile memory stores data. The volatile memory holds a part of the data stored in the nonvolatile memory. The memory controller controls the volatile memory and the nonvolatile memory. The nonvolatile memory, the volatile memory, and the memory controller are provided on the board. The memory controller transmits an interrupt signal to a request source, when the volatile memory does not have any data corresponding to an address which the request source requests to access.

An integrated circuit (IC) device may include a single substrate that includes a single chip, and a plurality of memory cells spaced apart from one another on the substrate and having different structures. Manufacturing the IC device may include forming a plurality of first word lines in a first region of the substrate, and forming a plurality of second word lines in or on a second region of the substrate. Capacitors may be formed on the first word lines. Source lines may be formed on the second word lines. An insulation layer that covers the plurality of capacitors and the plurality of source lines may be formed in the first region and the second region. A variable resistance structure may be formed at a location spaced apart from an upper surface of the substrate by a first vertical distance, in the second region.