A resistive random access memory (RRAM) and a method for operating the RRAM are disclosed. The RRAM includes at least two successively stacked conductive layers and a resistive switching layer situated between every adjacent two conductive layers, wherein a migration interface with an interface effect is formed at each interface between one conductive layer and the resistive switching layer in contact therewith, wherein the migration interface regulates, by the interface effect, vacancies formed in the resistive switching layer under the effect of an electrical signal. The regulation includes at least one of absorption, migration and diffusion.

A phase-change memory (PCM) cell is provided to include a first electrode, a second electrode, and a phase-change feature disposed between the first electrode and the second electrode. The phase-change feature is configured to change its data state based on a write operation performed on the PCM cell. The write operation includes a reset stage and a set stage. In the reset stage, a plurality of reset current pulses are applied to the PCM cell, and the reset current pulses have increasing current amplitudes. In the set stage, a plurality of set current pulses are applied to the PCM cell, and the set current pulses exhibit an increasing trend in current amplitude. The current amplitudes of the set current pulses are smaller than those of the reset current pulses.

In a memory module according to an embodiment of the present disclosure, a controller, upon reception of a read command including a logical address, converts the logical address included in the read command into a physical address using address lookup information. The controller further inputs a first physical address, which is a portion of the physical address obtained by the conversion, to a non-volatile memory via a first address bus terminal, and then inputs a second physical address, which is a rest of the physical address obtained by the conversion, to the non-volatile memory via a second address bus terminal, to thereby read data corresponding to the physical address obtained by the conversion from the non-volatile memory.

The present disclosure relates to methods of writing data in nucleic acid chains and methods of reading data written in nucleic acid chains. The present disclosure also relates to a kit for writing and reading data in nucleic acid chains.

A semiconductor memory device disposed over a substrate includes a common electrode, a selector material layer surrounding the common electrode, and a plurality of phase change material layers in contact with the selector material layer.

An in-memory computing system for computing vector-matrix multiplications includes an array of resistive memory devices arranged in columns and rows, such that resistive memory devices in each row of the array are interconnected by a respective word line and resistive memory devices in each column of the array are interconnected by a respective bitline. The in-memory computing system also includes an interface circuit electrically coupled to each bitline of the array of resistive memory devices and computes the vector-matrix multiplication between an input vector applied to a given set of word lines and data values stored in the array. For each bitline, the interface circuit receives an output in response to the input being applied to the given wordline, compares the output to a threshold, and increments a count maintained for each bitline when the output exceeds the threshold. The count for a given bitline represents a dot-product.

In an example, a multiplexer is provided. The multiplexer may include one or more first strings controlling access to source-lines of the memory, wherein a first string of the one or more first strings includes a first set of two high voltage transistors and a first plurality of low voltage transistors. The multiplexer may include one or more second strings controlling access to bit-lines of the memory, wherein a second string of the one or more second strings includes a second set of two high voltage transistors and a second plurality of low voltage transistors. A method for operating such multiplexer is provided.

A programmable resistive memory element and a method of adjusting a resistance of a programmable resistive memory element are provided. The programmable resistive memory element includes at least one resistive memory element. Each resistive memory element includes an Indium-Gallium-Zinc-Oxide (IGZO) resistive layer, a first electrical contact and a second electrical contact. The first and second electrical contacts are disposed on the IGZO resistive layer in the same plane. The programmable resistive memory element includes a voltage generator coupled to the first and second electrical contacts, constructed and arranged to apply a thermal treatment to the resistive memory element to adjust a resistance of the resistive memory element.

Techniques are provided for accessing two memory cells of a memory tile concurrently. A memory tile may include a plurality of self-selecting memory cells addressable using a row decoder and a column decoder. A memory controller may access a first self-selecting memory cell of the memory tile using a first pulse having a first polarity to the first self-selecting memory cell. The memory controller may also access a second self-selecting memory cell of the memory tile concurrently with accessing the first self-selecting memory cell using a second pulse having a second polarity different than the first polarity. The memory controller may determine characteristics of the pulses to mitigate disturbances of unselected self-selecting memory cells of the memory tile.

A chalcogenide material may include germanium (Ge), arsenic (As), selenium (Se) and from 0.5 to 10 at % of at least one group 13 element. A variable resistance memory device may include a first electrode, a second electrode, and a chalcogenide film interposed between the first electrode and the second electrode and including from 0.5 to 10 at % of at least one group 13 element. In addition, an electronic device may include a semiconductor memory. The semiconductor memory may include a column line, a row line intersecting the column line, and a memory cell positioned between the column line and the row line, wherein the memory cell comprises a chalcogenide film including germanium (Ge), arsenic (As), selenium (Se), and from 0.5 to 10 at % of at least one group 13 element.