A memory device includes a memory die containing memory elements, a support die containing peripheral devices and bonded to the memory die, and an electrically conductive path between two of the peripheral devices which extends at least partially through the memory die. The electrically conductive path is electrically isolated from the memory elements.

A memory device includes a memory array comprising a plurality of planes and a plurality of independent plane driver circuits. The memory device further includes control logic to track a status of the plurality of independent plane driver circuits and detect an occurrence of a quiet event associated with a first independent plane driver circuit of the plurality of independent plane driver circuits. The control logic is further to determine whether a high noise event associated with a second independent plane driver circuit of the plurality of independent plane driver circuits is concurrently occurring. Responsive to determining that the high noise event associated with the second independent plane driver circuit is concurrently occurring, the control logic is to determine whether the first independent plane driver circuit has a higher priority than the second independent plane driver circuit. Responsive to determining that the first independent plane driver circuit has a higher priority than the second independent plane driver circuit, the control logic is to suspend the high noise event associated with the second independent plane driver circuit and permitting the quiet event associated with the first independent plane driver circuit to occur.

Some embodiments include an assembly having a stack of alternating dielectric levels and conductive levels. Channel material pillars extend through the stack. Some of the channel material pillars are associated with a first sub-block, and others of the channel material pillars are associated with a second sub-block. Memory cells are along the channel material pillars. An insulative level is over the stack. A select gate configuration is over the insulative level. The select gate configuration includes a first conductive gate structure associated with the first sub-block, and includes a second conductive gate structure associated with the second sub-block. The first and second conductive gate structures are laterally spaced from one another by an intervening insulative region. The first and second conductive gate structures have vertically-spaced conductive regions, and have vertically-extending conductive structures which electrically couple the vertically-spaced conductive regions to one another. Some embodiments include methods of forming assemblies.

A private key of a public-private key pair with a corresponding identity is written to an integrated circuit including a processor, a non-volatile memory, and a cryptographic engine coupled to the processor and the non-volatile memory. The private key is written to the non-volatile memory. The integrated circuit is implemented in complementary metal-oxide semiconductor 14 nm or smaller technology. The integrated circuit is permanently modified, subsequent to the writing, such that further writing to the non-volatile memory is disabled and such that the private key can be read only by the cryptographic engine and not off-chip. Corresponding integrated circuits and wafers are also disclosed.

A private key of a public-private key pair with a corresponding identity is written to an integrated circuit including a processor, a non-volatile memory, and a cryptographic engine coupled to the processor and the non-volatile memory. The private key is written to the non-volatile memory. The integrated circuit is implemented in complementary metal-oxide semiconductor 14 nm or smaller technology. The integrated circuit is permanently modified, subsequent to the writing, such that further writing to the non-volatile memory is disabled and such that the private key can be read only by the cryptographic engine and not off-chip. Corresponding integrated circuits and wafers are also disclosed.

A system includes a memory device and a processing device, operatively coupled with the memory device. The processing device is configured to perform operations that include determining a verify reference voltage associated with a logic state of a memory cell of the memory device, the verify reference voltage defining a target voltage level of a threshold voltage associated with the logic state; determining an amount of voltage compensation based on a thermal profile associated with a heat to be applied to the memory device, the thermal profile comprising a temperature associated with the heat and a period of time the heat is to be applied to the memory device; and updating the verify reference voltage using the amount of voltage compensation for an expected shift in the threshold voltage of the memory cell after the heat is applied to the memory device.

The present invention discloses a memory device and operation method thereof. The operation method comprises: programming a plurality of first strings of a plurality of string pairs representing a finite state machine (FSM) to an in-memory-searching (IMS) array of a memory device; programming a plurality of second strings of the string pairs to a working memory of the memory device; and programming a string representing a starting state of the FSM to a buffer of the memory device.

The present invention discloses a memory device and operation method thereof. The operation method comprises: programming a plurality of first strings of a plurality of string pairs representing a finite state machine (FSM) to an in-memory-searching (IMS) array of a memory device; programming a plurality of second strings of the string pairs to a working memory of the memory device; and programming a string representing a starting state of the FSM to a buffer of the memory device.

A memory array and its operation method are provided. The array includes plural sets of word lines; plural bit lines; and plural memory cell each arranged at intersection of the plural sets of word lines and the plural bit lines. Each memory cell has first and second conductive filament component and a switch circuit, and one ends of the first and the second conductive filament components are coupled to corresponding bit lines and the other ends thereof are coupled to the switch circuit. In the differential mode, read is performed based on the reading currents of the first and the second conductive filament components. In the single-ended mode, read is performed based on a reference current and a reading current of the first or the second conductive filament component that is formed successfully.

A memory device includes a first receive circuit to receive a control signal of a memory access request from a memory controller. A second receive circuit receives a timing signal from the memory controller. The memory device includes circuitry to transmit, during a calibration mode of operation, feedback to the memory controller along a data path, the feedback indicative of a phase relationship been the control signal and the timing signal.