A memory unit with an asymmetric group-modulated input scheme and a current-to-voltage signal stacking scheme for a plurality of non-volatile computing-in-memory applications is configured to compute a plurality of multi-bit input signals and a plurality of weights. A controller splits the multi-bit input signals into a plurality of input sub-groups and generates a plurality of switching signals according to the input sub-groups, and the input sub-groups are sequentially inputted to the word lines. The current-to-voltage signal stacking converter converts the bit-line current from a plurality of non-volatile memory cells into a plurality of converted voltages according to the input sub-groups and the switching signals, and the current-to-voltage signal stacking converter stacks the converted voltages to form an output voltage. The output voltage is corresponding to a sum of a plurality of multiplication values which are equal to the multi-bit input signals multiplied by the weights.

A memory unit with an asymmetric group-modulated input scheme and a current-to-voltage signal stacking scheme for a plurality of non-volatile computing-in-memory applications is configured to compute a plurality of multi-bit input signals and a plurality of weights. A controller splits the multi-bit input signals into a plurality of input sub-groups and generates a plurality of switching signals according to the input sub-groups, and the input sub-groups are sequentially inputted to the word lines. The current-to-voltage signal stacking converter converts the bit-line current from a plurality of non-volatile memory cells into a plurality of converted voltages according to the input sub-groups and the switching signals, and the current-to-voltage signal stacking converter stacks the converted voltages to form an output voltage. The output voltage is corresponding to a sum of a plurality of multiplication values which are equal to the multi-bit input signals multiplied by the weights.

A memory unit with an asymmetric group-modulated input scheme and a current-to-voltage signal stacking scheme for a plurality of non-volatile computing-in-memory applications is configured to compute a plurality of multi-bit input signals and a plurality of weights. A controller splits the multi-bit input signals into a plurality of input sub-groups and generates a plurality of switching signals according to the input sub-groups, and the input sub-groups are sequentially inputted to the word lines. The current-to-voltage signal stacking converter converts the bit-line current from a plurality of non-volatile memory cells into a plurality of converted voltages according to the input sub-groups and the switching signals, and the current-to-voltage signal stacking converter stacks the converted voltages to form an output voltage. The output voltage is corresponding to a sum of a plurality of multiplication values which are equal to the multi-bit input signals multiplied by the weights.

A semiconductor device includes a ferroelectric field-effect transistor (FeFET), wherein the FeFET includes a substrate; a source region in the substrate; a drain region in the substrate; and a gate structure over the substrate and between the source region and the drain region. The gate structure includes a gate dielectric layer over the substrate; a ferroelectric film over the gate dielectric layer; and a gate electrode over the ferroelectric film.

A non-volatile memory device includes a first and a second memory regions including first and second memory cells and first and second analog circuits, respectively; a control logic circuit determining on/off states of the analog circuits, and converting an external power supply voltage into an internal operating voltage for operation of each of the memory cells; and input/output circuit selecting an input/output memory region for performing input/output of data using the internal operating voltage, wherein input/output of data for the first and second memory cells are sequentially performed, and at least one of the each of the first and second analog circuits are turned on together while the input/output of data for the first memory cells is performed.

An analog content addressable memory cell includes a match line, a high side, and a low side. The high side encodes a high bound on a range of values and includes a first three terminal memory device. The first three terminal memory device includes a first gate that sets a high voltage bound of the first three terminal memory device. Specifically, an input voltage applied at the first gate of the first memory device, if higher than the high voltage bound, turns the first memory device ON which discharges the match line. Similarly, the low side encodes a lower bound on a range of values and includes a second three terminal memory device. The second three terminal memory device includes a second gate that sets a low voltage bound of the second three terminal memory device. Specifically, an input voltage applied at the second gate of the second memory device, if lower than the low voltage bound, turns the first memory device ON which discharges the match line.

A non-volatile memory device includes a first and a second memory regions including first and second memory cells and first and second analog circuits, respectively; a control logic circuit determining on/off states of the analog circuits, and converting an external power supply voltage into an internal operating voltage for operation of each of the memory cells; and input/output circuit selecting an input/output memory region for performing input/output of data using the internal operating voltage, wherein input/output of data for the first and second memory cells are sequentially performed, and at least one of the each of the first and second analog circuits are turned on together while the input/output of data for the first memory cells is performed.

A compute cell for in-memory multiplication of a digital data input and a balanced ternary weight, and an in-memory computing device including an array of the compute cells, are provided. In one aspect, the compute cell includes a set of input connectors for receiving modulated input signals representative of a sign and a magnitude of the data input, and a memory unit configured to store the ternary weight. A logic unit connected to the set of input connectors and the memory unit receives the data input and the ternary weight. The logic unit selectively enables one of a plurality of conductive paths for supplying a partial charge to a read bit line during a compound duty cycle of the set of input signals as a function of the respective signs of data input and ternary weight, and disables each of the plurality of conductive paths if at least one of the ternary weight and data input have zero magnitude.

Memory cells and methods of forming and operating the same include forming a doped crystalline semiconductor memory layer on a first electrode. The doped crystalline semiconductor memory layer has a programmable dopant activation level that determines a resistance of the doped crystalline semiconductor memory layer. A second electrode is formed on the doped crystalline semiconductor memory layer.

An in-memory computing device includes a plurality of synaptic layers including a first type of synaptic layer and a second type of synaptic layer. The first type of synaptic layer comprises memory cells of a first type of memory cell and the second type of synaptic layer comprises memory cells of a second type, the first type of memory cell being different than the second type of memory cell. The first and second types of memory cells can be different types of memories, have different structures, different memory materials, and/or different read/write algorithms, any one of which can result in variations in the stability or accuracy of the data stored in the memory cells.