Examples of synchronized parallel tile computation techniques for large area lithography simulation are disclosed herein for solving tile boundary issues. An exemplary method for integrated circuit (IC) fabrication comprises receiving an IC design layout, partitioning the IC design layout into a plurality of tiles, performing a simulated imaging process on the plurality of tiles, generating a modified IC design layout by combining final synchronized image values from the plurality of tiles, and providing the modified IC design layout for fabricating a mask. Performing the simulated imaging process comprises executing a plurality of imaging steps on each of the plurality of tiles. Executing each of the plurality of imaging steps comprises synchronizing image values from the plurality of tiles via data exchange between neighboring tiles.

A method for determining a metric of a feature on a substrate obtained by a semiconductor manufacturing process involving a lithographic process, the method including: obtaining an image of at least part of the substrate, wherein the image includes at least the feature; determining a contour of the feature from the image; determining a plurality of segments of the contour; determining respective weights for each of the plurality of segments; determining, for each of the segments, an image-related metric; and determining the metric of the feature in dependence on the weights and the calculated image-related metric of each of the segments.

An electron beam irradiation device includes an electron gun, a housing, and an electron beam emission window. A rod portion of the housing includes a first tubular member, a second tubular member, a cooling gas flow space, and a wall member. The window is provided at an end portion on a distal end side of the first tubular member. The second tubular member surrounds the first tubular member. The cooling gas flow space includes at least a cooling gas flow path provided between an outer wall surface of the first tubular member and an inner wall surface of the second tubular member. The wall member is provided so as to perform partition between an electron beam emission space and the cooling gas flow space. The wall member is provided with a cooling gas ejection hole. The hole has a flow path sectional area smaller than a flow path sectional area of the cooling gas flow path.

A radiation irradiating apparatus includes a radiation generator that generates radiation and a switch that controls emission of the radiation from the radiation generator. The radiation generator and the switch are constituted by separate housings. The radiation generator and the switch are attachable and detachable to and from each other via a surface of a portion of each of the housings thereof.

Examples of synchronized parallel tile computation techniques for large area lithography simulation are disclosed herein for solving tile boundary issues. An exemplary method for integrated circuit (IC) fabrication comprises receiving an IC design layout, partitioning the IC design layout into a plurality of tiles, performing a simulated imaging process on the plurality of tiles, generating a modified IC design layout by combining final synchronized image values from the plurality of tiles, and providing the modified IC design layout for fabricating a mask. Performing the simulated imaging process comprises executing a plurality of imaging steps on each of the plurality of tiles. Executing each of the plurality of imaging steps comprises synchronizing image values from the plurality of tiles via data exchange between neighboring tiles.

Presented systems and methods facilitate efficient and effective generation and delivery of radiation. A radiation generation system can comprise: a particle beam gun, a high energy dissipation anode target (HEDAT); and a liquid anode control component. In some embodiments, the particle beam gun generates an electron beam. The HEDAT includes a solid anode portion (HEDAT-SAP) and a liquid anode portion (HEDAT-LAP) that are configured to receive the electron beam, absorb energy from the electron beam, generate a radiation beam, and dissipate heat. The radiation beam can include photons that can have radiation characteristics (e.g., X-ray wavelength, ionizing capability, etc.). The liquid anode control component can control a liquid anode flow to the HEDAT. The HEDAT-SAP and HEDAT-LAP can cooperatively operate in radiation generation and their configuration can be selected based upon contribution of respective HEDAT-SAP and the HEDAT-LAP characteristics to radiation generation.

A nail lamp has a removable, rechargeable battery pack and a translucent shell formed by double-injection molding. The lamp is portable can be operated cordlessly using the battery pack. The translucent shell glows when the lamp's treatment chamber is on. Surface-mounted light emitting diodes (LEDs) illuminate the treatment chamber with multiple wavelengths ultraviolet (UV) light. The battery pack has a USB port which allows a customer to conveniently charge a device (e.g., smartphone) while the customer's nails are being worked on. The battery pack has a battery gauge, which indicates a charge level remaining for the battery. When the battery pack is low on charge, the battery pack can be swapped with a charged battery pack. A battery pack can be charged while inserted in the lamp or removed from the lamp. The LEDs of the nail lamp are passively cooled.

Presented systems and methods facilitate efficient and effective generation and delivery of radiation. A radiation generation system can comprise: a particle beam gun, a high energy dissipation anode target (HEDAT); and a liquid anode control component. In some embodiments, the particle beam gun generates an electron beam. The HEDAT includes a solid anode portion (HEDAT-SAP) and a liquid anode portion (HEDAT-LAP) that are configured to receive the electron beam, absorb energy from the electron beam, generate a radiation beam, and dissipate heat. The radiation beam can include photons that can have radiation characteristics (e.g., X-ray wavelength, ionizing capability, etc.). The liquid anode control component can control a liquid anode flow to the HEDAT. The HEDAT-SAP and HEDAT-LAP can cooperatively operate in radiation generation and their configuration can be selected based upon contribution of respective HEDAT-SAP and the HEDAT-LAP characteristics to radiation generation.

An apparatus includes a support and a radioactive source on the support. The radioactive source includes nuclei. An excitation element is coupled to the support. Upon activation of the excitation element, radiation emission from the radioactive source is reduced. The excitation element includes a vibration source. Excitation is transferred from nuclei of the radioactive source to nuclei of the support. The excitation transfer occurs in bulk from multiple nuclei of the radioactive source. The excitation transfer causes emissions from the support.

An apparatus includes a support and a radioactive source on the support. The radioactive source includes nuclei. An excitation element is coupled to the support. Upon activation of the excitation element, radiation emission from the radioactive source is reduced. The excitation element includes a vibration source. Excitation is transferred from nuclei of the radioactive source to nuclei of the support. The excitation transfer occurs in bulk from multiple nuclei of the radioactive source. The excitation transfer causes emissions from the support.