There are provided a silver powder, which is able to form an electrically conductive film having a lower resistance value than that of conventional electrically conductive films when the silver powder is used as the material of an electrically conductive paste which is fired to form the electrically conductive film, and a method for producing the same. A first silver powder having one peak or more, at each of which a frequency is a local maximum value in a volume-based particle size distribution obtained by measuring the first silver powder in a dry process by means of a laser diffraction particle size analyzer, is mixed with a second silver powder having two peaks or more, at each of which a frequency is a local maximum value in a volume-based particle size distribution obtained by measuring the second silver powder in a dry process by means of a laser diffraction particle size analyzer, to produce a silver powder having three peaks or more, at each of which a frequency is a local maximum value in a volume-based particle size distribution obtained by measuring the silver powder in a dry process by means of a laser diffraction particle size analyzer, the silver powder having one peak, at which a frequency is a local maximum value in a volume-based particle size distribution obtained by measuring the silver powder in a wet process by means of a laser diffraction scattering particle size analyzer.

A mixed silver powder and a conductive paste comprising the powder are disclosed. The mixed silver powder is obtained by mixing two or more spherical silver powders having different properties from each other. The mixed powder may minimize the disadvantages of the respective types of the two or more powders and maximize the advantages thereof, thereby improving the characteristics of products. In addition, by comprehensively controlling the particle size distribution of surface-treated mixed silver powder and the particle diameter and specific gravity of primary particles, a high-density conductor pattern, a precise line pattern, and the suppression of aggregation over time can be simultaneously achieved.

Provided herein are composite electrolytes that include inorganic conductors and polar polymers. By providing the polar polymers as structures such as microspheres in a suspension in a non-polar solvent, the polar polymers can be used as binders in composites that include sulfide electrolytes. The resulting composites have high room temperature conductivities and good mechanical properties. Also provided are composites that include inorganic conductors and other polymers that are insoluble in non-polar solvents. Also provides methods of forming composite electrolytes using suspensions of polymer microstructures in a processing solvent and the resulting composite electrolytes.

The present invention to provide a highly proton conducting metal organic material constituting of phosphate ester based ligand immobilized via gelation with Fe.sup.3 ion in DMF which is used as conducting electrolyte in PEFMCs.

The technology subject of the present application concerns a novel class of fused nanocrystal molecules having unique electronic properties. The application further contemplates methods for their preparation and methods of their use.

The present invention provides a silver paste containing at least a silver powder, a binder resin, and an organic solvent, wherein the silver powder contains a first silver powder having a D50 of 3.50 to 7.50 μm and a second silver powder having a D50 of 0.80 to 2.00 μm, where D50 represents a 50% value of a volume-based cumulative fraction obtained by laser diffraction particle size distribution measurement; a copper content of the whole silver powder is 10 to 5000 ppm by mass; a copper content of the second silver powder is 80 ppm by mass or more; and the first silver powder contains substantially no copper. The present invention provides a silver paste containing a powder in a high concentration and excellent in printability, and provides a silver conductor film that has a high filling factor, a high film density, high electrical conductivity, and excellent migration resistance.

Electrical, mechanical, computing, and/or other devices that include components formed of extremely low resistance (ELR) materials, including, but not limited to, modified ELR materials, layered ELR materials, and new ELR materials, are described.

Electrical, mechanical, computing, and/or other devices that include components formed of extremely low resistance (ELR) materials, including, but not limited to, modified ELR materials, layered ELR materials, and new ELR materials, are described.

The present invention provides a silver paste, containing at least a silver powder, a binder resin, and an organic solvent, in which a content of the silver powder based on the silver paste is 80.00 to 97.00% by mass, D10 is 1.00 to 3.00 μm and D50 is 3.00 to 7.00 μm, where D10 and D50 respectively represent a 10% value and a 50% value of a volume-based cumulative fraction obtained by laser diffraction particle size distribution measurement of the silver powder, the silver powder has a specific surface area of 0.10 to 0.30 m.sup.2/g, the silver powder has a copper content of 10 to 5000 ppm by mass, a content of the binder resin based on the silver powder is 0.430 to 0.750% by mass, and the silver paste has a dry film density of 7.50 g/cm.sup.3 or more.

There is provided an electrically conductive paste which can prevent the increase of the volume resistivity of an electrically conductive film formed from the electrically conductive paste even if the electrically conductive film is heated to a soldering temperature of about 380° C. when the electrically conductive paste is a resin type electrically conductive paste using a silver powder and a silver-coated copper powder. In an electrically conductive paste containing a resin, a silver powder and a silver-coated copper powder having a copper powder, the surface of which is coated with a silver layer, the resin is an epoxy resin having a naphthalene skeleton, and there is added a dicarboxylic acid, preferably a dicarboxylic acid having a rational formula of HOOC—(CH.sub.2).sub.n—COOH (n=1-8), and more preferably a dicarboxylic acid having a rational formula of HOOC—(CH.sub.2).sub.n—COOH (n=4-7).