H01B5/00

Transfer method for manufacturing conductor structures by means of nano-inks

A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.

Transfer method for manufacturing conductor structures by means of nano-inks

A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.

Transfer method for manufacturing conductor structures by means of nano-inks

A method for equipping a film material with at least one electrically conductive conductor structure, wherein a dispersion containing metallic nanoparticles in the form of a conductor structure is applied to a thermostable transfer material and the metallic nanoparticles are sintered to form an electrically conductive conductor structure. The electrically conductive conductor structure of sintered metallic nanoparticles is then transferred from the thermostable transfer material to the non-thermostable film material. A method for producing a laminate material using the film material using at least one electrically conductive conductor structure, and to the corresponding film material and laminate material are described.

METHOD FOR PRODUCING SILVER NANOWIRES, SILVER NANOWIRES, DISPERSION, AND TRANSPARENT CONDUCTIVE FILM

In order to provide a method for producing silver nanowires in which a local maximum of optical absorption in the plasmon absorption band can be shifted toward the short wavelength side without making the wire diameter smaller, a method for producing silver nanowires includes a step of heating a mixed liquid of a dispersion of silver nanowires and metal ions of a transition metal that is different from silver, and reducing the metal ions, thereby intermittently precipitating clumps of the transition metal on a surface of the silver nanowires. The thus produced silver nanowires have metal clumps intermittently along the length direction, and a local maximum of optical absorption in the plasmon absorption band of the silver nanowires has been shifted toward the short wavelength side.

Nanoconductor smart wearable technology and electronics
11299827 · 2022-04-12 ·

A wearable, nanoconductor technology for smart electronic applications. A novel nano-scale geometry is achieved for nanoconductor circuits on the order of the size of a single thread or smaller, which are easily integrated with clothing and provide smart applications for wearable electronics. The nano-scale fibers provide improved material characteristics and the fixed geometry and orientation of the nanoconductor structures allow easier interface of nanoconductor electronics integrated with the clothing or with electronics external to the weave of the clothing. Novel electronic circuits based on the size and fixed geometries of the nanoconductor fibers which allow configurable functions that can be employed for different uses through logic circuit configuration or serial programming during wear are disclosed.

CONDUCTIVE FOAM TAPE AND DISPLAY PANEL
20210335518 · 2021-10-28 ·

A conductive foam tape and a display panel are provided. The conductive foam tape includes a conductive foam and a conductive cloth layer disposed on an outside of the conductive foam. The conductive cloth layer has an extension portion protruding out of the conductive foam at least one end of the conductive foam tape.

CONDUCTIVE FOAM TAPE AND DISPLAY PANEL
20210335518 · 2021-10-28 ·

A conductive foam tape and a display panel are provided. The conductive foam tape includes a conductive foam and a conductive cloth layer disposed on an outside of the conductive foam. The conductive cloth layer has an extension portion protruding out of the conductive foam at least one end of the conductive foam tape.

Cable routing system

A cable routing system is provided. The cable routing system comprises a flexible flat band being able to be deformed from its stretched out shape without assuming a permanent changed form and several attaching devices in intervals along a longitudinal direction of the band for attaching a cable to the band in a sliding manner.

CONDUCTIVE PARTICLES AND TEST SOCKET HAVING THE SAME
20210319928 · 2021-10-14 · ·

Proposed is a conductive particle used for a testing socket electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device to be tested and the test board, wherein the conductive particle has a predetermined depth d and has a length l that is greater than a width w, the conductive particle having a body part in a pillar shape, a first convex part having an upper surface, formed in a top of the body part, and a second convex part having a lower surface, formed in a bottom of the body part.

CONDUCTIVE PARTICLES AND TEST SOCKET HAVING THE SAME
20210319928 · 2021-10-14 · ·

Proposed is a conductive particle used for a testing socket electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device to be tested and the test board, wherein the conductive particle has a predetermined depth d and has a length l that is greater than a width w, the conductive particle having a body part in a pillar shape, a first convex part having an upper surface, formed in a top of the body part, and a second convex part having a lower surface, formed in a bottom of the body part.