Highly uniform and thin silver nanowires are described having average diameters below 20 nm and a small standard deviation of the diameters. The silver nanowires have a high aspect ratio. The silver nanowires can be characterized by a small number of nanowires having a diameter greater than 18 nm as well as with a blue shifted narrow absorption spectrum in a dilute solution. Methods are described to allow for the synthesis of the narrow uniform silver nanowires. Transparent conductive films formed from the thin, uniform silver nanowires can have very low levels of haze and low values of ΔL*, the diffusive luminosity, such that the transparent conductive films can provide little alteration of the appearance of a black background.

Highly uniform and thin silver nanowires are described having average diameters below 20 nm and a small standard deviation of the diameters. The silver nanowires have a high aspect ratio. The silver nanowires can be characterized by a small number of nanowires having a diameter greater than 18 nm as well as with a blue shifted narrow absorption spectrum in a dilute solution. Methods are described to allow for the synthesis of the narrow uniform silver nanowires. Transparent conductive films formed from the thin, uniform silver nanowires can have very low levels of haze and low values of ΔL*, the diffusive luminosity, such that the transparent conductive films can provide little alteration of the appearance of a black background.

There is provided a copper powder containing an organic compound containing carbon and nitrogen. The powder has a ratio of carbon content PC (mass %) to specific surface area SSA (m.sup.2/g), PC/SSA, of 0.005 to 0.1 and a ratio of nitrogen content PN (mass %) to specific surface area SSA (m.sup.2/g), PN/SSA, of 0.001 to 0.05. The organic compound preferably contains two or more of nitrogen atom per molecule and is preferably capable of forming a five-membered ring complex with copper. The organic compound preferably includes one or more of dimethyl glyoxime, ethylenediamine, and polyethyleneimine.

There is provided a copper powder containing an organic compound containing carbon and nitrogen. The powder has a ratio of carbon content PC (mass %) to specific surface area SSA (m.sup.2/g), PC/SSA, of 0.005 to 0.1 and a ratio of nitrogen content PN (mass %) to specific surface area SSA (m.sup.2/g), PN/SSA, of 0.001 to 0.05. The organic compound preferably contains two or more of nitrogen atom per molecule and is preferably capable of forming a five-membered ring complex with copper. The organic compound preferably includes one or more of dimethyl glyoxime, ethylenediamine, and polyethyleneimine.

A method for producing an anisotropic conductive film, which includes: a preparation step wherein a base material that has a plurality of recesses and solder fine particles are prepared; an accommodation step wherein at least some of the solder fine particles are accommodated in the recesses; a fusing step wherein the solder fine particles accommodated in the recesses are fused, thereby forming solder particles within the recesses; a transfer step wherein an insulating resin material is brought into contact with the recess opening side of the base material that includes the solder particles in the recesses, thereby obtaining a first resin layer on which the solder particles have been transferred; and a layering step wherein a second resin layer that is configured from an insulating resin material is formed on the surface of the first resin layer, on which the solder particles have been transferred, thereby obtaining an anisotropic conductive film.

The present invention relates to solder particles, each of which partially has a flat portion in the surface. By using these solder particles, electrodes facing each other are able to be appropriately connected, thereby achieving an anisotropic conductive material that exhibits excellent conduction reliability and excellent insulation reliability.

There are provided a conductive nonwoven fabric and a manufacturing method thereof, the conductive nonwoven fabric including: a plated felt portion including a felt portion formed of a plurality of first fibers that extend in irregular directions and that are stacked, and a metal plating applied to the first fibers of the felt portion; and at least one plated warp including a warp formed of a plurality of second fibers and the metal plating applied to the second fibers of the warp. The at least one plated warp is formed to extend in a specific direction with respect to the plated felt portion, and a density of the second fibers is higher than a density of the first fibers.

There are provided a conductive nonwoven fabric and a manufacturing method thereof, the conductive nonwoven fabric including: a plated felt portion including a felt portion formed of a plurality of first fibers that extend in irregular directions and that are stacked, and a metal plating applied to the first fibers of the felt portion; and at least one plated warp including a warp formed of a plurality of second fibers and the metal plating applied to the second fibers of the warp. The at least one plated warp is formed to extend in a specific direction with respect to the plated felt portion, and a density of the second fibers is higher than a density of the first fibers.

Embodiments of the presently disclosed system include a thin thermoplastic or thermosetting polymer film loaded with non-polymeric inclusions that are susceptible to heating under a time-varying magnetic field. Insertion of this additional heating layer into a structural or semi-structural heterogeneous laminate provides an on-demand de-bonding site for laminate deconstruction. For example, in some embodiments when the heating layer is inserted between a cured Carbon-Fiber Reinforced Plastic (CFRP) layer and a Polymeric/Metallic film stackup layer, the heating layer can be selectively heated above its softening point (e.g., by using energy absorbed from a locally-applied time-varying magnetic field) to allow for ease of applique separation from the CFRP layer.

Embodiments of the presently disclosed system include a thin thermoplastic or thermosetting polymer film loaded with non-polymeric inclusions that are susceptible to heating under a time-varying magnetic field. Insertion of this additional heating layer into a structural or semi-structural heterogeneous laminate provides an on-demand de-bonding site for laminate deconstruction. For example, in some embodiments when the heating layer is inserted between a cured Carbon-Fiber Reinforced Plastic (CFRP) layer and a Polymeric/Metallic film stackup layer, the heating layer can be selectively heated above its softening point (e.g., by using energy absorbed from a locally-applied time-varying magnetic field) to allow for ease of applique separation from the CFRP layer.