H01B5/00

Surface modifier for transparent oxide electrode, surface-modified transparent oxide electrode, and method for producing surface-modified transparent oxide electrode

A surface modifier for a transparent oxide electrode contains a reactive silyl compound represented by General Formula (1):
RfX-A-SiR.sup.1.sub.3-n(OR.sup.2).sub.n(1)
in which, Rf is an aryl group having 10 or fewer carbon atoms that may have an alkyl substituent having 1 to 5 carbon atoms, wherein at least one hydrogen atom is replaced with a fluorine atom, X represents a divalent group selected from O, NH, C(O)O, C(O)NH, OC(O)NH, NHC(O)NH, or a single bond, A represents a straight chain, branched chain or cyclic aliphatic divalent hydrocarbon group having 1 to 10 carbon atoms, an aromatic divalent hydrocarbon group, or a single bond, a surface-modified transparent oxide electrode formed by coating with the surface modifier. A method for producing a surface-modified transparent oxide electrode is also provided.

ELECTRIC FENCE AND RELATED MANUFACTURING METHOD
20200221665 · 2020-07-16 · ·

An electric fence and its manufacturing method. The electric fence includes multiple warp cords and multiple weft cords raschel knitted together using a raschel knitting machine to form the electric fence having multiple rectangular holes. The warp cords include a top warp cord, a bottom warp cord, and multiple middle warp cords between the top and bottom warp cords. The middle warp cords include electrically charged middle warp cords and electrically uncharged middle warp cords, the charged middle warp cords being interlaced among the uncharged middle warp cords. The bottom warp cord and the uncharged middle warp cords are formed of synthetic fibers, and the top warp cord and the charged middle warp cords are formed of synthetic fibers and at least one metal wire in each cord. The manufacturing method increases productivity and reduces production cost, and the electric fence is suitable for low temperature environment.

SILVER POWDER, PASTE COMPOSITION, AND METHOD OF PRODUCING SILVER POWDER
20200219633 · 2020-07-09 ·

A silver powder is produced by reducing silver carboxylate and a particle size distribution of primary particles comprises a first peak of a particle size in a range of 20 nm to 70 nm and a second peak of a particle size in a range of 200 nm to 500 nm, organic matters are decomposed in an extent of 50 mass % or more at 150 C., gases generated in heating at 100 C. are: gaseous carbon dioxide; evaporated acetone; and evaporated water.

SILVER POWDER, PASTE COMPOSITION, AND METHOD OF PRODUCING SILVER POWDER
20200219633 · 2020-07-09 ·

A silver powder is produced by reducing silver carboxylate and a particle size distribution of primary particles comprises a first peak of a particle size in a range of 20 nm to 70 nm and a second peak of a particle size in a range of 200 nm to 500 nm, organic matters are decomposed in an extent of 50 mass % or more at 150 C., gases generated in heating at 100 C. are: gaseous carbon dioxide; evaporated acetone; and evaporated water.

Copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing copper powder

Provided is a copper powder which can be suitably utilized in applications such as an electrically conductive paste and an electromagnetic wave shield. A copper powder according to the present invention has a dendritic shape having a linearly grown main stem and a plurality of branches separated from the main stem, the main stem and the branches are constituted as flat plate-shaped copper particles having a cross-sectional average thickness of from 0.02 m to 5.0 m to be determined by scanning electron microscopic SEM observation gather, the average particle diameter D50 of the copper powder is from 1.0 m to 100 m, and the maximum height in the vertical direction with respect to the flat plate-shaped surface of the copper particles is 1/10 or less with respect to the maximum length in the horizontal direction of the flat plate-shaped surface of the copper particles.

Copper powder, copper paste using same, conductive coating material, conductive sheet, and method for producing copper powder

Provided is a copper powder which can be suitably utilized in applications such as an electrically conductive paste and an electromagnetic wave shield. A copper powder according to the present invention has a dendritic shape having a linearly grown main stem and a plurality of branches separated from the main stem, the main stem and the branches are constituted as flat plate-shaped copper particles having a cross-sectional average thickness of from 0.02 m to 5.0 m to be determined by scanning electron microscopic SEM observation gather, the average particle diameter D50 of the copper powder is from 1.0 m to 100 m, and the maximum height in the vertical direction with respect to the flat plate-shaped surface of the copper particles is 1/10 or less with respect to the maximum length in the horizontal direction of the flat plate-shaped surface of the copper particles.

Fabrication of Solid-State Battery Cells and Solid-State Batteries
20200194773 · 2020-06-18 ·

At least one embodiment relates to a method fabricating a solid-state battery cell. The method includes forming a plurality of spaced electrically conductive structures on a substrate. Forming the plurality of spaced electrically conductive structures on the substrate includes transforming at least part of a valve metal layer into a template that includes a plurality of spaced channels aligned longitudinally along a first direction. Transforming at least part of the valve metal layer into the template includes a first anodization step, a second anodization step, an etching step in an etching solution, and a deposition step. The method also includes forming a first layer of active electrode material on the plurality of spaced electrically conductive structures, depositing an electrolyte layer over the first layer of active electrode material, and forming a second layer of active electrode material over the electrolyte later.

BONDING WASHER
20200182284 · 2020-06-11 ·

A bonding washer for making electrical connection between two metal pieces that are to be mechanically fastened together. The washer, to be interposed between the two metal pieces, may be constructed so as to fasten to one of the pieces before the two pieces are joined. Teeth on the washer, positioned at right angles to the plane of the washer, are forced into each of the two metal pieces when the fastener is tightened, making electrical connection between the two metal pieces.

CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE FILM, DISPLAY DEVICE, AND METHOD FOR FABRICATING THE SAME

Disclosed are a conductive particle, an anisotropic conductive film, a display device, and a method for fabricating the same so as to detect the extent to which the conductive particles are cracked in a heating and pressurizing process, to thereby improve the ratio of finished products while the display device is being manufactured. A core of the conductive particle is a fluorescent resin core. In the conductive particle according to this disclosure, the core of the conductive particle is a fluorescent resin core, and the extent to which the conductive particle is cracked can be detected by detecting varying fluorescence in a heating and pressuring process, to thereby alleviate such a phenomenon from taking place that the conductive particle has a poor electrical conductivity due to an insufficient pressure, or the conductive particle is cracked, and thus loses its electrical conductivity, due to an excessive pressure.

Forming a Layer of Functional Material on an Electrically Conductive Substrate
20200181789 · 2020-06-11 ·

At least one embodiment relates to a method for forming a layer of functional material on an electrically conductive substrate. The method includes depositing an interlayer on the substrate. The interlayer includes a transition metal oxide, a noble metal, or a noble-metal oxide. The interlayer has a thickness between 0.5 nm and 30 nm. The method also includes depositing a functional material precursor layer on the interlayer. Further, the method includes activating the functional material precursor layer by annealing to form the layer of functional material.