A bonding method in which applied is a prescribed conductive bonding material, which contains a molded article of a metal powder. The metal powder is one or more selected from the group consisting of a gold powder, a silver powder, a platinum powder, and a palladium powder, and has a purity of 99.9% by mass or more, and an average particle size of 0.005 .Math.m to 1.0 .Math.m, and the conductive bonding material has a compressive deformation rate M, represented by the following expression, of 5 % or more and 30% or less when compressed with a compression pressure of 5 MPa. [Expression 1] M = {(h1 - h2)/h1} x 100, wherein h1 represents an average thickness of the conductive bonding material before compression, and h2 represents an average thickness of the conductive bonding material after the compression.

A silver powder is produced by reducing silver carboxylate and a particle size distribution of primary particles comprises a first peak of a particle size in a range of 20 nm to 70 nm and a second peak of a particle size in a range of 200 nm to 500 nm, organic matters are decomposed in an extent of 50 mass % or more at 150° C., gases generated in heating at 100° C. are: gaseous carbon dioxide; evaporated acetone; and evaporated water.

A silver powder is produced by reducing silver carboxylate and a particle size distribution of primary particles comprises a first peak of a particle size in a range of 20 nm to 70 nm and a second peak of a particle size in a range of 200 nm to 500 nm, organic matters are decomposed in an extent of 50 mass % or more at 150° C., gases generated in heating at 100° C. are: gaseous carbon dioxide; evaporated acetone; and evaporated water.

Provided is photo-sintering nano ink. The photo-sintering nano ink includes a photo-sintering precursor including a conductive nano particle and an oxide film surrounding the conductive nano particle, polymer binder resin, and an adhesive.

A noble metal fine particle herein disclosed includes a noble metal element as a main constituent metal element. An imine compound is held on a surface, and an amine/imine ratio (A/I ratio) of an area ratio of a peak area of the imine compound and a peak area of an amine compound determined in pyrolysis GCMS analysis with a pyrolysis temperature of 300° C. is 1 or less.

A hybrid actuation device including a first plate and a second plate coupled to the first plate, a shape memory alloy wire coupled to the first plate and the second plate, a bladder positioned between the first plate and the second plate, the bladder housing a fluid, a first fixed electrode coupled to the second plate, and a flexible electrode coupled to the first plate and extending along the first fixed electrode.

A hybrid actuation device including a first plate and a second plate coupled to the first plate, a shape memory alloy wire coupled to the first plate and the second plate, a bladder positioned between the first plate and the second plate, the bladder housing a fluid, a first fixed electrode coupled to the second plate, and a flexible electrode coupled to the first plate and extending along the first fixed electrode.

A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt.% gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.

A deformable yet mechanically resilient microcapsule having electrical properties, a method of making the microcapsules, and a circuit component including the microcapsules. The microcapsule containing a gallium liquid metal alloy core having from about 60 to about 100 wt.% gallium and at least one alloying metal, and a polymeric shell encapsulating the liquid core, said polymeric shell having conductive properties.

Provided is a solder composition containing Sn. The composition comprises: 1.0% by mass or more and 5.0% by mass or less of Cu; 0.1% by mass or more and 0.5% by mass or less of Ni; and more than 0.01% by mass and 0.5% by mass or less of Ge.