A wire splicing method including: disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other; disposing solder to straddle the first wire and the second wire; disposing a connection wire on the solder; pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder; keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

A wire splicing method including: disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other; disposing solder to straddle the first wire and the second wire; disposing a connection wire on the solder; pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder; keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

The present invention relates to a superconducting wire having improved electrical and physical properties.

In various embodiments, superconducting wires incorporate diffusion barriers composed of Ta alloys that resist internal diffusion and provide superior mechanical strength to the wires.

An oxide superconducting thin film wire includes a metal substrate, a laminate, and a Cu stabilizing layer. The metal substrate includes a supporting base material and a conductive layer located on the supporting base material. The conductive layer includes a Cu layer serving as an internal layer and a biaxially orientated surface layer. The laminate includes a buffer layer, an oxide superconducting layer, and a Ag stabilizing layer stacked on the metal substrate in this order from the metal substrate. The Cu stabilizing layer is formed so as to surround the laminate and the metal substrate. At least one of the Cu stabilizing layer and the Ag stabilizing layer is formed so as to be in contact with at least a portion of the conductive layer of the metal substrate and be electrically conductive with the conductive layer of the metal substrate.

Reinforced materials for high temperature superconducting tape. More specifically reinforcement materials for significantly reducing the amount of required reinforcement and attaining much higher stress tolerances at practical conductor dimensions are described herein.

A superconducting cable includes a core part, in which the core part includes a former including a plurality of copper wires, a superconducting conductor layer including a plurality of superconducting wires connected in parallel to each other, an insulating layer, and a superconducting shield layer including a plurality of superconducting wires are sequentially arranged. A conducting layer formed of a metal having a current-carrying property at room temperature is provided on opposite surfaces of each of the superconducting wires of the superconducting conductor layer to reinforce mechanical rigidity of each of superconducting wires of the superconducting conductor layer, and the former has a cross-sectional area which is smaller than that of a former of a superconducting cable in which the conducting layer is not added to superconducting wires and which is designed on an assumption that all fault current flows to the former.

An infrared sensor with a microstructure has a multiplicity of sensor rods protruding from a sensor base and arranged axially parallel to one another. Each of the sensor rods is designed as a thermocouple, in that a first rod end, arranged on the sensor base, is electrically connected to an opposite free second rod end by both a first and a second electrically conductive rod element. The two rod elements have a different Seebeck coefficient, and the first rod element is formed as a hollow profile and the second rod element is arranged in the first rod element such that each thermocouple is formed as a single rod with a small standing area on the sensor base.

A superconducting coil device includes at least one coil winding, including at least one first and one second superconducting strip conductor, the first and second strip conductors each having a superconducting layer and a contact side provided with a contact layer; at least one first contact electrically connecting the contact side of the first strip conductor to an external circuit via a first contact piece; at least one second contact electrically connecting the contact side of the second strip conductor to the external circuit via a second contact piece; and a third contact electrically connecting the first and second strip conductors via the contact layer of the first and the second strip conductor within the coil winding, wherein the contact side of the first strip conductor has a different orientation relative to a center of the coil winding than the contact side of second strip conductor.

A method of connecting prefabricated pieces of an HTS cable onsite is disclosed. This quick and reliable procedure of connecting pieces of HTS cable adds to the flexibility of designing and installing power transmission and distribution grids. The joint can also be dissembled such that it can be dismantled for replacing the cable on one side of the connection. The joint can then be reassembled with a new cable in its place. This facilitates repairing the electrical grid in case of local damage to the cable, as well as reconfiguring the grid in case this is required. The complexity of creating demountable HTS cable joints is due to the necessity to create and maintain continuity of several media across the joint along the length of the cable. Various combinations of design options satisfying these requirements are possible.