A process for producing an electrical conductor structure that involves embedding at least one metallic conductor track and at least one heating conductor in an electrically insulating substrate, and producing an electric current in the heating conductor so that a first layer of the substrate and a second layer of the substrate fuse in an area surrounding the heating conductor, to seal an interface between the two layers. A conductor structure is also disclosed, in particular in the form of an implantable electrode lead.

A bundling device comprises a frame, and a wire bending device and a wire twisting device each mounted to the frame. The wire bending device bends a bundling wire into an open ring to partially surround an object to be bundled, and guide the bundling wire into the wire twisting device. The wire twisting device twists two opposite end segments of the bundling wire together to bundle the object.

The present method includes graphene, preferably in the form of flat graphene oxide flakes with, by mass, preferably between 0.5% and 35% PAN. The graphene oxide and conductive-polymer PAN is in a co-suspension in water and is co-deposited on a surface. The deposited PAN with a high-percentage graphene-oxide layer is dried. Our tests have produced electrical conductivities 1000 times more conductive than the PAN by itself. Our testing indicates that using flakes that are flat is essential to getting very high conductivity, and that controlled oxidation is very important in suspending graphene oxide in water.

An electric connector is disposed between a connection terminal of a first device and a connection terminal of a second device, and electrically connects these connection terminals. The electric connector includes a resin layer, and a plurality of metal wires extending through the resin layer in a thickness direction, and having a rectangular shape on surfaces to be connected to the connection terminals. At least first sides of the rectangular shapes of the metal wires are arranged at equal intervals along the same direction. The length of short sides of the rectangular shapes are less than 5 μm.

An electric connector is disposed between a connection terminal of a first device and a connection terminal of a second device, and electrically connects these connection terminals. The electric connector includes a resin layer, and a plurality of metal wires extending through the resin layer in a thickness direction, and having a rectangular shape on surfaces to be connected to the connection terminals. At least first sides of the rectangular shapes of the metal wires are arranged at equal intervals along the same direction. The length of short sides of the rectangular shapes are less than 5 μm.

Provided are a flexible flat cable and a method of producing the same. The flexible flat cable includes a plate-shaped first insulation portion comprising an insulating material; a first ground, a second ground, and a third ground disposed at predetermined intervals on the first insulation portion; at least one first signal transmission line positioned between the first ground and the second ground and disposed on the first insulation portion; at least one second signal transmission line positioned between the second ground and the third ground and disposed on the first insulation portion; a first second insulation portion disposed on at least a portion of the first ground and at least a portion of the at least one first signal transmission line and the second ground; a second insulation portion disposed on at least a portion of the second ground and at least a portion of the at least one second signal transmission line, and the third ground; a conductive adhesive layer configured to enclose the first insulation portion, the first second insulation portion, and the second insulation portion; and a shielding portion comprising a shielding material adhered to an outside of the conductive adhesive layer. Therefore, by improving shielding efficiency of a plurality of signal transmission lines, while having good electromagnetic interference and crosstalk characteristics, a plurality of signals can be simultaneously transmitted.

A device (1) and a method for producing enameled wires, comprises an application device (3) for applying at least one enamel coating, a furnace (4) for solidifying the enamel coating and an exhaust gas purification device (7) for removing at least nitrogen oxides from an exhaust gas (9) of the furnace (4). The exhaust gas purification device (7) has a unit (13) for the selective catalytic reduction of nitrogen oxides in the exhaust gas (9) of the furnace and a feeding apparatus (11) for feeding a reducing agent, preferably an ammonia-containing compound, in particular a urea solution, into the exhaust gas (9) of the furnace (4). The feeding apparatus (11) has at least one outlet opening, which is designed in such a way that the reducing agent exits from the outlet opening substantially in the flow direction of the exhaust gas (9).

A method is provided for producing a silver powder which has a smaller particle size distribution than the conventional one without changing the type of surface treatment agent, and also for enabling a low resistance when the silver powder is made into a paste to form an electrode. The method for producing a silver powder includes adding an O/W-type emulsion containing micelles of a surface treatment agent having a volume-based cumulative 50% particle diameter D.sub.50 obtained by a laser diffraction particle size distribution analysis of 1.5 μm or less to a slurry of a silver powder. The dispersibility of the silver powder in the slurry containing the silver powder is then improved.

Electrochromic devices and methods may employ the addition of a defect-mitigating insulating layer which prevents electronically conducting layers and/or electrochromically active layers from contacting layers of the opposite polarity and creating a short circuit in regions where defects form. In some embodiments, an encapsulating layer is provided to encapsulate particles and prevent them from ejecting from the device stack and risking a short circuit when subsequent layers are deposited. The insulating layer may have an electronic resistivity of between about 1 and 10.sup.8 Ohm-cm. In some embodiments, the insulating layer contains one or more of the following metal oxides: aluminum oxide, zinc oxide, tin oxide, silicon aluminum oxide, cerium oxide, tungsten oxide, nickel tungsten oxide, and oxidized indium tin oxide. Carbides, nitrides, oxynitrides, and oxycarbides may also be used.

Electrochromic devices and methods may employ the addition of a defect-mitigating insulating layer which prevents electronically conducting layers and/or electrochromically active layers from contacting layers of the opposite polarity and creating a short circuit in regions where defects form. In some embodiments, an encapsulating layer is provided to encapsulate particles and prevent them from ejecting from the device stack and risking a short circuit when subsequent layers are deposited. The insulating layer may have an electronic resistivity of between about 1 and 10.sup.8 Ohm-cm. In some embodiments, the insulating layer contains one or more of the following metal oxides: aluminum oxide, zinc oxide, tin oxide, silicon aluminum oxide, cerium oxide, tungsten oxide, nickel tungsten oxide, and oxidized indium tin oxide. Carbides, nitrides, oxynitrides, and oxycarbides may also be used.