H01B13/00

Engineering reversible elasticity in ductile or brittle thin films and products resulting from said engineering

The present disclosure relates to how to engineer reversible elasticity in thin films and/or layers and/or substrates, using a repeated Y-shaped motif, which is cut out through the film and/or layer and/or substrate. As an example, using a 75 μm thick polyimide (PI) foil, macroscopic dog-bone shaped structures with a range of geometrical parameters of the Y shape have been prepared according to an embodiment of the present disclosure. The tensile strain response of the film at its point of fracture was then recorded. The structures were also confirmed using finite element modeling. Upon stretching, the PI ligaments locally deflect out of plane, allowing the foil to macroscopically stretch.

COPPER-ALUMINUM COMPOSITE ELECTRIC ENERGY TRANSMISSION SYSTEM AND PROCESSING METHOD THEREFOR
20230112646 · 2023-04-13 ·

A copper-aluminum composite electric energy transmission system and a processing method therefor are disclosed. The system includes a copper terminal (1) and an aluminum cable (6). The aluminum cable (6) includes an aluminum conductor (2) and an insulation layer (3) cladding a periphery of the aluminum conductor (2). The system further includes an electric energy transmission aluminum piece (4), in which a section of the aluminum conductor (2) with the insulation layer (3) stripped from the aluminum cable is pressed to form a connecting piece. The electric energy transmission aluminum piece (4) and a front end of the aluminum conductor (2) form a molten layer (5). An end of the copper terminal (1) for being welded to the electric energy transmission aluminum piece (4) is provided with a welding platform (11). The molten layer (5) dads the welding platform (11) to form a transition layer (12) with metal atoms penetrating into or combined with each other. By reducing an internal stress between copper and aluminum, the mechanical property of a copper-aluminum welding joint is improved. Copper-aluminum compounds in the transition layer (12) are reduced, and the electrical property of the copper-aluminum welding joint is improved. Meanwhile, a path of the transition layer (12) to resist an erosion from an external environment is extended, thereby solving the metal corrosion problem of the copper-aluminum welding joint, and prolonging the service life.

CONDUCTIVE FILM, MANUFACTURING METHOD OF CONDUCTIVE FILM, AND DISPLAY DEVICE
20230113605 · 2023-04-13 ·

The present application provides a conductive film, a manufacturing method of the conductive film, and a display device. The present application prevents refracted light by using a first metal layer to fully cover a second metal layer of a middle layer, thereby fundamentally solving black level stripes caused by lateral etching of the second metal layer.

POLYIMIDE PRECURSOR, RESIN COMPOSITION, INSULATED ELECTRIC WIRE, AND FLEXIBLE SUBSTRATE

Provided is a polyimide precursor including a polyimide precursor obtained by a reaction between a diamine compound and a tetracarboxylic dianhydride compound, in which the diamine compound contains at least one type selected from the group consisting of an aromatic diamine and an alicyclic diamine, the tetracarboxylic dianhydride compound contains at least one type selected from the group consisting of an aromatic tetracarboxylic dianhydride and an alicyclic tetracarboxylic dianhydride, and the total amount of the alicyclic diamine and the alicyclic tetracarboxylic dianhydride is 5.0 mol% or more and 70.0 mol% or less with respect to the total amount of constituent monomers of the polyimide precursor.

METAL MATERIAL, CONNECTION TERMINAL, AND METHOD FOR PRODUCING METAL MATERIAL
20230116303 · 2023-04-13 ·

Provided is a metal material including a substrate and an Ag—Sn covering layer that covers a surface of the substrate, in which the Ag—Sn covering layer contains Ag and Sn and has an Ag—Sn alloy exposed on a surface thereof, and an average crystal grain size in a cross section in parallel with a surface of the Ag—Sn covering layer is less than 0.28 μm. Provided is also a metal material, produced by forming a metal layer including Ag and Sn, on a surface of a substrate, and heating the resultant at a temperature equal to or more than the melting point of Sn, and including an Ag—Sn covering layer containing Ag and Sn and having an Ag—Sn alloy exposed on a surface thereof, on the surface of the substrate.

FLAT ELECTRIC WIRE AND METHOD FOR MANUFACTURING FLAT ELECTRIC WIRE
20230116494 · 2023-04-13 · ·

The present disclosure relates to a flat electric wire and a method for manufacturing a flat electric wire. The flat electric wire includes a plurality of conductors arranged in parallel in a width direction and having substantially a same cross-sectional area with each other, resin films provided on one side and the other side of the plurality of conductors in a thickness direction orthogonal to the width direction, and an insulator covering the plurality of conductors together with the resin films. Each of the resin films have a Young's modulus of 2 GPa or more and a film thickness of 200 μm or more.

Method for producing transparent electrode
11469011 · 2022-10-11 · ·

A transparent electrode or a transparent heat trace is manufactured by transferring a silver nanowire formed on a glass substrate to a polymer and a flexible film. When the silver nanowire transferred to the polymer and the flexible film is processed with an iodine mixture, a surface of the silver nanowire is discolored.

Method for manufacturing busbar and manufacturing busbar through the same
11465320 · 2022-10-11 · ·

According to an embodiment of the present disclosure, provided is a method for manufacturing a bus bar in which a frame including a sensing part and a body part connected to the sensing part is prepared, the frame is inserted into and fixed to an injection molding mold, and an enhanced part enhancing the strength at a position where fatigue is concentrated by an enhancing injection material injected into the injection molding mold is formed in the frame.

Method for manufacturing transparent conductive film
11624109 · 2023-04-11 · ·

A method of manufacturing a transparent conductive film comprising preparing a substrate; and forming a thin film comprising—a compound of Chemical Formula 1 on the substrate:
Ba.sub.pLa.sub.qSn.sub.mO.sub.n  Formula 1
wherein p, q, m and n are atomic content ratios, p, m and n each are independently more than 0 and less than or equal to 6, and q is 0 or 1, wherein the forming of the thin film is performed by an RF sputtering process at a temperature of 250° C. or lower.

CONDUCTIVE MATERIAL, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
20220336120 · 2022-10-20 ·

The present disclosure provides a conductive material, a method for manufacturing the conductive material and an electronic device, and relates to the technical field of new materials. The conductive material provided by the present disclosure includes: a first component and a second component. The first component includes a liquid metal having a melting point below room temperature, a coating material, and a first solvent. The coating material coats liquid metal droplets formed by the liquid metal. The second component includes a base resin and a conductive powder. The first component and the second component are weighed in proportion, and are uniformly mixed to obtain the conductive material. The technical solution of the present disclosure can obtain a wire having better flexibility.