The present disclosure describes methods of manufacture and implementations of hybrid separators for data cables having conductive and non-conductive or metallic and non-metallic portions, and data cables including such hybrid separators. A hybrid separator comprising one or more conductive portions and one or more non-conductive portions may be positioned within a data cable between adjacent pairs of twisted insulated and shielded or unshielded conductors so as to provide physical and electrical separation of the conductors. The position and extent (laterally and longitudinally) of each conductive portion and each non-conductive portion may be selected for optimum performance of the data cable, including attenuation or rejection of cross talk, reduction of return loss, increase of stability, and control of impedance.

The present invention relates to a detection device for detecting a position of a conductor, a wire processing equipment, and a method for detecting a position of a conductor in wire processing. The detection device has: a bracket; and a plurality of conductive probes provided on the bracket and spaced from each other. The conductive probes have a detection position, and the detection device is configured to determine whether the detected conductor is at a predetermined position by detecting whether the conductive probes at the detection position are electrically connected through the conductor; when at least two conductive probes are electrically connected with each other through the detected conductor, the detected conductor is determined in the predetermined position; when no two conductive probes are electrically connected with each other through the detected conductor, the detected conductor is determined not in the predetermined position. The detection device for detecting the position of the conductor, the wire processing equipment and the method for detecting the position of the conductor in the wire processing of the invention can automatically detect whether the conductor is in the designated position, which provides a basis for further automatic processing of the wire.

The present invention relates to methods of preparing nanowire networks, as well as to nanowire networks prepared thereby. The method comprises (a) providing a substrate coated with a film of a first polymer; (b) depositing nanofibers of a second polymer onto the film to form a patterned layer comprising a nanofibre network structure; (c) depositing a layer of a first metal onto the patterned layer; (d) performing a solvent development step to selectively remove the nanofibers leaving a negative pattern exposing the first polymer film; (e) performing an etching step to remove the exposed polymer film; (f) depositing a second metal or oxide thereof onto the negative pattern to form a tem plated nanowire network; and (g) performing a lift-off step to expose the nanowire network.

A Metal-Clad (MC) cable assembly is provided. In one approach, the MC cable assembly includes a core having a plurality of conductors laid parallel to one another, each of the plurality of conductors including an electrical conductor and insulation, with or without a jacket layer. The MC cable assembly further includes a metal sheath disposed over the core. In some approaches, the MC cable assembly further includes an assembly tape disposed around the plurality of conductors. In some approaches, the MC cable assembly further includes a subassembly having a set of conductors, and an assembly jacket layer disposed over the subassembly. In some approaches, a polymeric protective layer is provided over an insulation layer of one or more of the plurality of conductors and the subassembly. In some approaches, a bonding/grounding conductor may also be cabled with the plurality of conductors.

Provided is a method of producing a solid electrolyte having high ionic conductivity using a liquid phase method, including a first step of mixing two or more compounds satisfying (1) and a complexing agent 1 satisfying (2), and a second step of further mixing in a complexing agent 2 satisfying (3) after the first step. (1) A compound containing one or more selected from a group consisting of a lithium element, a sulfur element, a phosphorus element and a halogen element. (2) A complexing agent capable of forming a complex containing Li.sub.3PS.sub.4 and a halogen element. (3) A complexing agent other than the complexing agent 1, capable of forming a complex containing Li.sub.3PS.sub.4.

A conductive film that includes: particles of a layered material including one or more layers, wherein each of the one or more layers includes a layer body represented by: M.sub.mX.sub.n, wherein M is at least one metal of Group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1 to 4, m is greater than n and 5 or less, a modification or termination T is present on a surface of the layer body, where the T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, or a hydrogen atom; and a phosphorus atom in an amount of 0.001% by mass to less than 0.09% by mass.

Embodiments are directed to a method for manufacturing a product comprising: establishing, by a computing device comprising a processor, at least one parameter of a particular instance of a component to be used in the product, adapting, by the computing device, a baseline model of the component based on the at least one parameter to accommodate use of the particular instance of the component, growing a structure based on the adapted model to accommodate the particular instance of the component using an additive manufacturing technique, coupling the structure to the particular instance of the component, growing an electrical harness by using additive printing to establish an electrical cable, and assembling the product by coupling the electrical harness to the particular instance of the component.

Embodiments are directed to a method for manufacturing a product comprising: establishing, by a computing device comprising a processor, at least one parameter of a particular instance of a component to be used in the product, adapting, by the computing device, a baseline model of the component based on the at least one parameter to accommodate use of the particular instance of the component, growing a structure based on the adapted model to accommodate the particular instance of the component using an additive manufacturing technique, coupling the structure to the particular instance of the component, growing an electrical harness by using additive printing to establish an electrical cable, and assembling the product by coupling the electrical harness to the particular instance of the component.

In a method of manufacturing a semiconductor device, a mask layer and a first layer may be sequentially formed on a substrate. The first layer may be patterned by a photolithography process to form a first pattern. A silicon oxide layer may be formed on the first pattern. A coating pattern including silicon may be formed on the silicon oxide layer. The mask layer may be etched using a second pattern as an etching mask to form a mask pattern, and the second pattern may includes the first pattern, the silicon oxide layer and the coating pattern. The mask pattern may have a uniform size.

A conductive line stitching method is disclosed, in which a metal line is arranged in a protection layer to form a conductive line, which is subjected to the steps of forming conductive line, disposing cloth, conducting stitching, combining device, and connecting conductive line to have the conductive line located in edging parts to facilitate a subsequent operation for connection with a device, thereby achieving effect of being processed with a one-time process and concealing the conductive line.