To provide a novel conductive film having two regions differing in the light transmittance, an optoelectronic device having such a conductive film, and a method for producing a conductive film by which such a conductive film can readily be produced.

A conductive film, which has a first region and a second region having a light transmittance higher than the first region,

the conductive film having a first film formed of a conductive material as a material and a resin film formed of a fluorinated polymer as a material,

the first film being disposed to overlap with at least the first region among the first region and the second region,

the resin film being disposed to overlap with the second region, and

the fluorinated polymer satisfying the following (1) and (2):

(1) when the temperature is increased at a temperature-increasing rate of 2° C./min under a pressure of 1×10.sup.−3 Pa, the temperature at which the thermogravimetric loss rate substantially reaches 100% is 400° C. or lower;

(2) when the temperature is increased at a temperature-increasing rate of 2° C./min under a pressure of 1×10.sup.−3 Pa, the temperature width from a temperature at which the thermogravimetric loss rate is 10% to a temperature at which it is 90%, is within 200° C.

A cable such as a server cable may have a tapered termination portion that when connected to other information handling system components reduces the loss of signal between the cable and the information handling system component. A method of making a cable with a tapered termination portion comprising heating a wire having an end and a body portion, the body portion having a first diameter; pulling the end relative to the body portion, for example with a clamp coupled to the end under tension, to obtain a location between the end and the body portion having a second diameter smaller than the first diameter; and cutting the wire at the location.

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

Thin-film devices, for example electrochromic devices for windows, and methods of manufacturing are described. Particular focus is given to methods of patterning optical devices. Various edge deletion and isolation scribes are performed, for example, to ensure the optical device has appropriate isolation from any edge defects. Methods described herein apply to any thin-film device having one or more material layers sandwiched between two thin film electrical conductor layers. The described methods create novel optical device configurations.

Electrochromic devices and methods may employ the addition of a defect-mitigating insulating layer which prevents electronically conducting layers and/or electrochromically active layers from contacting layers of the opposite polarity and creating a short circuit in regions where defects form. In some embodiments, an encapsulating layer is provided to encapsulate particles and prevent them from ejecting from the device stack and risking a short circuit when subsequent layers are deposited. The insulating layer may have an electronic resistivity of between about 1 and 10.sup.8 Ohm-cm. In some embodiments, the insulating layer contains one or more of the following metal oxides: aluminum oxide, zinc oxide, tin oxide, silicon aluminum oxide, cerium oxide, tungsten oxide, nickel tungsten oxide, and oxidized indium tin oxide. Carbides, nitrides, oxynitrides, and oxycarbides may also be used.

Electrochromic devices and methods may employ the addition of a defect-mitigating insulating layer which prevents electronically conducting layers and/or electrochromically active layers from contacting layers of the opposite polarity and creating a short circuit in regions where defects form. In some embodiments, an encapsulating layer is provided to encapsulate particles and prevent them from ejecting from the device stack and risking a short circuit when subsequent layers are deposited. The insulating layer may have an electronic resistivity of between about 1 and 10.sup.8 Ohm-cm. In some embodiments, the insulating layer contains one or more of the following metal oxides: aluminum oxide, zinc oxide, tin oxide, silicon aluminum oxide, cerium oxide, tungsten oxide, nickel tungsten oxide, and oxidized indium tin oxide. Carbides, nitrides, oxynitrides, and oxycarbides may also be used.

A conductive two-dimensional particle of a layered material comprising one layer or one layer and plural layers, wherein the layer includes a layer body represented by: M.sub.mX.sub.n, and a modifier or terminal T exists on a surface of the layer body, wherein T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, or a hydrogen atom; and a monovalent metal ion, wherein the conductive two-dimensional particle does not contain an amine, a total content of chlorine and bromine in the conductive two-dimensional particle is 1,500 ppm by mass or less, and an average value of a major diameter of a two-dimensional surface of the conductive two-dimensional particle is 1.0 μm to 20 μm.

A transparent film including: a transparent substrate; and a conducting fiber-containing layer that is stacked on at least one main surface of the transparent substrate material and contains conducting fibers substantially evenly dispersed in a plane view and a binder resin. The transparent film has a high resistance part in which an undercoat layer is provided between the transparent substrate material and the conducting fiber-containing layer, and a low resistance part in which the undercoat layer is not provided between the transparent substrate material and the conducting fiber-containing layer. The relationship between a sheet resistance value R.sub.H of the high resistance part and a sheet resistance value R.sub.L of the low resistance part is expressed as R.sub.H/R.sub.L>100. The undercoat layer contains a resin having at least one group or boding part having (—NH—).

A solid electrolyte composition includes: an inorganic solid electrolyte; binder particles having an average particle size of 1 nm to 10 μm; and a dispersion medium, in which the binder particles include a polymer that includes a component derived from a polymerizable compound having a molecular weight of lower than 1,000, and the component includes at least one of an aliphatic hydrocarbon chain to which 10 or more carbon atoms are bonded or a siloxane structure as a side chain of the polymer. The solid electrolyte composition is used in the sheet for an all-solid state secondary battery, the electrode sheet for an all-solid state secondary battery, the all-solid state secondary battery, the method of manufacturing a sheet for an all-solid state secondary battery, and the method of manufacturing an all-solid state secondary battery.

A method of extending the usable length of a power-over-ethernet cable includes the steps of providing twisted pairs of wires with the conductor of each wire being a 20 AWG or 22 AWG conductor and terminating the cable at an RJ-45 style connector. The connector for the 20 AWG conductors has an insert therein with holes that can accommodate 20 AWG conductors. FEP, PVC or PP insulation may surround each conductor.