The embodiments provide a process for easily producing an electrode having low resistance, easily subjected to post-process and hardly impairing the device; and also provide, as its application, a production process for a photoelectric conversion device. The process comprises the steps of: coating a hydrophobic substrate directly with a dispersion of metal nanomaterial, to form a metal nanomaterial layer, coating the surface of the metal nanomaterial layer with a dispersion of carbon material, to form a carbon material layer and thereby to form an electrode layer comprising a laminate of the metal nanomaterial layer and the carbon material layer, pressing the carbon material layer onto a hydrophilic substrate so that the surface of the carbon material layer may be directly fixed on the hydrophilic substrate, and peeling away the hydrophobic substrate so as to transfer the electrode layer onto the hydrophilic substrate.

The embodiments provide a process for easily producing an electrode having low resistance, easily subjected to post-process and hardly impairing the device; and also provide, as its application, a production process for a photoelectric conversion device. The process comprises the steps of: coating a hydrophobic substrate directly with a dispersion of metal nanomaterial, to form a metal nanomaterial layer, coating the surface of the metal nanomaterial layer with a dispersion of carbon material, to form a carbon material layer and thereby to form an electrode layer comprising a laminate of the metal nanomaterial layer and the carbon material layer, pressing the carbon material layer onto a hydrophilic substrate so that the surface of the carbon material layer may be directly fixed on the hydrophilic substrate, and peeling away the hydrophobic substrate so as to transfer the electrode layer onto the hydrophilic substrate.

A power cable 1 according to the present invention contains a propylene-based resin in a specific range as an insulating layer 13, and has a specific relationship between the cooling rate X at the time of manufacturing the interface portion in the insulating layer 13 with an inner semiconductive layer 12 and the cooling rate Y at the time of manufacturing the central portion of the insulating layer 13. Thus, not only the surface of the insulating layer 13 but also the inside of the insulating layer 13, the interface portion in the insulating layer 13 with the inner semiconductive layer 12, and the inside thereof are reliably cooled and cured. Therefore, the metal conductor 11 is not displaced from the center of the power cable 1 due to its own weight, and uneven thickness is less likely to occur.

A sulfide solid electrolyte, which is able to adjust the morphology unavailable traditionally, or is readily adjusted so as to have a desired morphology, the sulfide solid electrolyte having a volume-based average particle diameter measured by laser diffraction particle size distribution measurement of 3 μm or more and a specific surface area measured by the BET method of 20 m.sup.2/g or more; and a method of treating a sulfide solid electrolyte including the sulfide solid electrolyte being subjected to at least one mechanical treatment selected from disintegration and granulation.

A solid electrolyte (10) of the present disclosure includes porous silica (11) having a plurality of pores (12) interconnected mutually and an electrolyte (13) coating inner surfaces of the plurality of pores (12). The electrolyte (13) includes 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide represented by EMI-FSI and a lithium salt dissolved in the EMI-FSI. A molar ratio of the EMI-FSI to the porous silica (11) is larger than 1.0 and less than 3.5.

An insulated conductor of the present invention is an insulated conductor having a conductor and an insulating film provided on a surface of the conductor, in which the insulating film has a low-concentration fluorine layer disposed on a surface side of the conductor and a high-concentration fluorine layer disposed on at least a part of an outside surface of the low-concentration fluorine layer, the low-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively lower than that of the high-concentration fluorine layer, and the high-concentration fluorine layer includes a cured product of a thermosetting resin and a fluororesin and has a fluorine atom content relatively higher than that of the low-concentration fluorine layer.

An electrode or wiring, an electrode pair, and a method for manufacturing the electrode or wiring. The electrode or wiring includes: particles of a layered material including one or more layers; and metal particles or a sintered metal. The one or plural layers include a layer body represented by M.sub.mX.sub.n, wherein M is at least one metal belonging to group 3, 4, 5, 6, or 7, X is a carbon atom, a nitrogen atom, or a combination thereof, n is 1-4, and m is greater than n and at most 5, and a modification or terminal T (T being at least one of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, and a hydrogen atom) is present on the surface of the layer body.

Provided is a conductive laminate including a base material and a conductive ink film provided on the base material, in which a region that extends from a position being away from a first main surface toward a second main surface by a distance equivalent to 50% of a thickness of the conductive ink film to the second main surface has a first void ratio of 15% to 50%, and a second void ratio in a region that extends from the first main surface toward the second main surface to a position being away from the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film has a second void ratio which is smaller than the first void ratio.

Provided is a conductive laminate including a base material and a conductive ink film provided on the base material, in which a region that extends from a position being away from a first main surface toward a second main surface by a distance equivalent to 50% of a thickness of the conductive ink film to the second main surface has a first void ratio of 15% to 50%, and a second void ratio in a region that extends from the first main surface toward the second main surface to a position being away from the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film has a second void ratio which is smaller than the first void ratio.

Provided is a conductive laminate including a base material and a conductive ink film provided on the base material, in which a region that extends from a first main surface toward a second main surface to a position being away from the first main surface by a distance equivalent to 50% of a thickness of the conductive ink film has a first void ratio of 15% to 50%, a region that extends from a position being away from the second main surface toward the first main surface by a distance equivalent to 10% of the thickness of the conductive ink film to the second main surface has a second void ratio which is smaller than the first void ratio, and the conductive ink film comprises at least one metal selected from the group consisting of silver, gold, platinum, nickel, palladium, and copper.