A winding insulation system includes a set of insulated conductors, main wall insulation provided around the conductors, corona shield tape provided around the main wall insulation, stress grading tape provided around the corona shield tape, and sealing tape provided around the stress grading tape. The main wall insulation includes inner, intermediate, and outer sections. The inner section includes polyimide mica paper reinforced with any combination of the group consisting of: glass cloth, polyester film, and polyester mat, the inner section being provided in half-lap layer(s). The intermediate section includes mica paper reinforced with any combination of the group consisting of: glass cloth, polyester film, and polyester mat, the intermediate section being provided in half-lap layer(s). The outer section includes mica tape backed with aramid and reinforced with any combination of the group consisting of: glass cloth, polyester film, and polyester mat, the outer section being provided in half-lap layer(s).

A jacket for an elongated assembly is disclosed. The jacket, which may be a tubular shape or sheet, comprises a film layer to surround a core member of the elongated assembly, wherein the film layer has a first surface to be arranged abutting the core member in a non-bonded relationship; a braided, woven, or warp-knit layer comprising high-melt filament having a titer from 30 to 800 denier; and a bonding region between the braided, woven, or warp-knit layer and a second surface of the film layer, opposing to the first surface, to adhere at least a portion of the high-melt fibers. The jacket may further comprise an inner film layer in a non-bonded relationship with the film layer.

A jacket for an elongated assembly is disclosed. The jacket, which may be a tubular shape or sheet, comprises a film layer to surround a core member of the elongated assembly, wherein the film layer has a first surface to be arranged abutting the core member in a non-bonded relationship; a braided, woven, or warp-knit layer comprising high-melt filament having a titer from 30 to 800 denier; and a bonding region between the braided, woven, or warp-knit layer and a second surface of the film layer, opposing to the first surface, to adhere at least a portion of the high-melt fibers. The jacket may further comprise an inner film layer in a non-bonded relationship with the film layer.

A wire harness includes a multi-core cable including a group of cables composed of a plurality of cables, and a sheath provided around the group of cables, and a resin mold covering the group of cables at a cable branching portion where the group of cables exposed from an end of the sheath of the multi-core cable are branched. An outermost layer of each cable constituting the group of cables includes polyolefin or thermoplastic polyurethane. When the sheath includes polyolefins, the group of cables includes at least one cable including an outermost layer including thermoplastic polyurethane. When the sheath includes thermoplastic polyurethane, the group of cables includes at least one cable having an outermost layer comprising polyolefin. The resin mold includes a resin composition of a polymer alloy of a first polymer including at least one of polyamide polymer, polyester polymer, and thermoplastic polyurethane and a second polymer including polyolefin.

A wire harness includes a multi-core cable including a group of cables composed of a plurality of cables, and a sheath provided around the group of cables, and a resin mold covering the group of cables at a cable branching portion where the group of cables exposed from an end of the sheath of the multi-core cable are branched. An outermost layer of each cable constituting the group of cables includes polyolefin or thermoplastic polyurethane. When the sheath includes polyolefins, the group of cables includes at least one cable including an outermost layer including thermoplastic polyurethane. When the sheath includes thermoplastic polyurethane, the group of cables includes at least one cable having an outermost layer comprising polyolefin. The resin mold includes a resin composition of a polymer alloy of a first polymer including at least one of polyamide polymer, polyester polymer, and thermoplastic polyurethane and a second polymer including polyolefin.

An electrical insulation device includes an insulator body having a chamber and an electrically insulating material within the chamber. The electrically insulating material includes a dry syntactic foam.

An electrical insulation device includes an insulator body having a chamber and an electrically insulating material within the chamber. The electrically insulating material includes a dry syntactic foam.

A resin producing method is a method of producing a resin with which an insulating structure formed on an outer peripheral portion of a conductor is impregnated, the method including: a filler mixing step of mixing a nanofiller at a ratio of 15 wt % or more with an epoxy resin to form a mixture; a shear mixing step of causing the mixture to be subjected to shear mixing; a diluent mixing step of mixing a reactive diluent that reduces a viscosity of the epoxy resin, with the mixture after the shear mixing step; and a curing agent mixing step of mixing an acid anhydride curing agent with the mixture after the diluent mixing step.

A system and method for forming electrical devices via additive manufacturing processes that utilize starting materials that are in a solid state at least prior to, as well as after, the formation of the electrical device. A first solid starting material can be configured to form one or more insulator layers of the electrical device, while another solid starting material can be applied to form one or more electrically conductive layers. The starting materials canbe applied layer-by-layer during formation of the electrical device such that the electrically conductive layers can become automatically embedded within the insulating layers, and vice versa. The additive manufacturing process(es) utilized to form the electrically conductive layers from solid starting materials can be different than the additive manufacturing process(es) utilized to form the insulator layers.

A system and method for forming electrical devices via additive manufacturing processes that utilize starting materials that are in a solid state at least prior to, as well as after, the formation of the electrical device. A first solid starting material can be configured to form one or more insulator layers of the electrical device, while another solid starting material can be applied to form one or more electrically conductive layers. The starting materials canbe applied layer-by-layer during formation of the electrical device such that the electrically conductive layers can become automatically embedded within the insulating layers, and vice versa. The additive manufacturing process(es) utilized to form the electrically conductive layers from solid starting materials can be different than the additive manufacturing process(es) utilized to form the insulator layers.