A thermistor element includes: a thermistor film; a first electrode provided in contact with one surface of the thermistor film; and a pair of second electrodes provided in contact with an other surface of the thermistor film, wherein the thermistor film is provided to cover a periphery of the first electrode.

The present invention is provided with a base electrode layer forming step of forming a base electrode layer on both surfaces of a thermistor wafer formed of a thermistor material, a chip forming step of obtaining a thermistor chip with a base electrode layer by cutting the thermistor wafer to form chips, a protective film forming step of forming a protective film formed of an oxide on an entire surface of the thermistor chip with a base electrode layer, a cover electrode layer forming step of forming a cover electrode layer by applying and sintering a conductive paste on an end surface of the thermistor chip with a base electrode layer, and a conduction heat treatment step of performing a heat treatment such that the base electrode layer and the cover electrode layer are electrically conductive, in which the electrode portion is formed.

A shunt resistor including first and second terminals made of an electrically conductive metal material, and a resistive element disposed between the first terminal and the second terminal. Each of the first terminal and the second terminal has a through-hole formed therein. At least one of the first terminal and the second terminal has a protruding portion protruding on a side thereof opposite to a portion bonded to the resistive element.

A shunt resistor including first and second terminals made of an electrically conductive metal material, and a resistive element disposed between the first terminal and the second terminal. Each of the first terminal and the second terminal has a through-hole formed therein. At least one of the first terminal and the second terminal has a protruding portion protruding on a side thereof opposite to a portion bonded to the resistive element.

A three-dimensional thermistor device and a manufacturing method thereof. The three-dimensional thermistor device comprising a thermistor array formed on a base layer extending in first and second directions. Where the thermistor array comprises: thermistor pattern layers and insulating layers stacked alternately on the base layer in a third direction; each thermistor pattern layer including a continuous electrically conductive first trace disposed along a first path extending in both the first and second directions, and each insulating layer including an electrically conductive first via extending through the insulating layer in the third direction to electrically connect the first traces to each other. Where successive electrical connections between the respective first vias on the stacked insulating layers and the respective first traces on the stacked thermistor layers form a continuous electrical first thermistor element extending in the first, second and third directions across multiple of the thermistor pattern layers.

The laminated alumina board for an electronic device includes an alumina board that is made of a sintered body of alumina particles and has an unevenness structure that is formed of the alumina particles on a surface and a flattening film that is provided on an upper surface of the alumina board and contains alumina as a main component.

The laminated alumina board for an electronic device includes an alumina board that is made of a sintered body of alumina particles and has an unevenness structure that is formed of the alumina particles on a surface and a flattening film that is provided on an upper surface of the alumina board and contains alumina as a main component.

A lead-free glass paste, a chip resistor and a method for producing the same are provided. The lead-free glass paste includes 6-7 parts by mass of borosilicate oil, 12-21 parts by mass of aluminum oxide powder, 2-3 parts by mass of glass fiber powder, and 0.1-0.5 parts by mass of a curing agent.

A temperature sensor includes an insulating substrate made of ceramics and having a first surface and a second surface an electrode including a cathode electrode and an anode electrode, which are disposed on the first surface of the insulating substrate; a resistance wire portion including one or more resistance wires inside the insulating substrate, a cathode end portion of the resistance wire portion being electrically connected to the cathode electrode, and an anode end portion of the resistance wire portion electrically connected to the anode electrode; and one or more metal layers connected to a portion in a path through which current flows between the cathode electrode and the anode electrode, and the portion having a potential identical with or lower than that of the resistance wire portion.

A method of manufacturing a sensor include depositing a metal layer on a substrate and fabricating a calibration structure on the metal layer. The calibration structure can include a first calibration portion and a second calibration portion. The method may further include, performing a first calibration of the sensor by modifying the first calibration portion. In addition, the method can include placing a cover layer on a portion of the first calibration portion after the first calibration and then performing a second calibration of the sensor by modifying the second calibration.