A shunt resistor having sufficient bonding strength includes a resistor, a pair of bases which are integrally formed with the resistor so as to sandwich the resistor, recessed holes which are respectively formed in the bases, and measurement terminals which are inserted into the recessed holes and are affixed to the bases. Each measurement terminal has a shaft part and a flange part that protrudes outwardly in the circumferential direction of the shaft part. Each recessed hole is formed to have a diameter smaller than the diameter of the flange part, and the shaft parts are respectively inserted into the recessed holes.

A shunt resistor having sufficient bonding strength includes a resistor, a pair of bases which are integrally formed with the resistor so as to sandwich the resistor, recessed holes which are respectively formed in the bases, and measurement terminals which are inserted into the recessed holes and are affixed to the bases. Each measurement terminal has a shaft part and a flange part that protrudes outwardly in the circumferential direction of the shaft part. Each recessed hole is formed to have a diameter smaller than the diameter of the flange part, and the shaft parts are respectively inserted into the recessed holes.

A resistor includes a resistive element, an insulation plate, a protective film, and a pair of electrodes. The resistive element includes a first face and a second face arranged to face in opposite directions in a thickness direction. The insulation plate is on the first face, and the protective film on the second face. The electrodes are spaced apart in a first direction perpendicular to the thickness direction, and held in contact with the resistive element. Each electrode includes a bottom portion opposite to the insulation plate with respect to the resistive element in the thickness direction. Each bottom portion overlaps with a part of the protective film as viewed in the thickness direction. The resistor further includes a pair of intermediate layers spaced apart in the first direction. The intermediate layers are formed of a material electrically conductive and containing a synthetic resin. Each intermediate layer includes a cover portion covering a part of the protective film. The cover portion of each intermediate layer is disposed between the protective film and the bottom portion of one of the electrodes.

Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.

Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.

This application is directed to dielectric isolation of fluid conveyance systems both Aerospace and Industrial. The dielectric isolator 5 serves to both prevent high voltage surges transitioning down the conveyance distribution system and second as a means to conduct fluid under pressure. This application address the limitations of current art by approaching the challenge as a pure electrical solution. High resistance precision electrical elements 10 are integrated into a one piece high dielectric material housing 15 which embodies the required end fitting interface. Conductive end collars 20 bonded in position to housing 15 and in contact with resistive elements 10, provides the means for conducting electrical energy to the system interface fitting, coupling or connection. The application provides precision resistance from one unit to the next with built in triple redundancy for high life expectation. The application has the ability to withstand high voltage surge up to 30,000 Volts and by virtue of integrated end ferrules eliminates internal arcing and provides a leak proof design.

A component is provided for a human-powered vehicle. The component includes a component body, a single substrate, a resistor, an electric wire, a signal processing unit, a signal output, and an electric power input. The single substrate is provided on the component body. The resistor is formed on the single substrate and forms a strain gauge with part of the single substrate. The electric wire is formed on the single substrate and electrically connected to the resistor. The signal processing unit is formed or directly mounted on the single substrate and electrically connected to the electric wire. The signal output outputs a signal from the signal processing unit. The electric power input is electrically connected to the signal processing unit and supplied with electric power from a power supply provided on at least one of the human-powered vehicle and the component body.

A component is provided for a human-powered vehicle. The component includes a component body, a single substrate, a resistor, an electric wire, a signal processing unit, a signal output, and an electric power input. The single substrate is provided on the component body. The resistor is formed on the single substrate and forms a strain gauge with part of the single substrate. The electric wire is formed on the single substrate and electrically connected to the resistor. The signal processing unit is formed or directly mounted on the single substrate and electrically connected to the electric wire. The signal output outputs a signal from the signal processing unit. The electric power input is electrically connected to the signal processing unit and supplied with electric power from a power supply provided on at least one of the human-powered vehicle and the component body.

A thermal fluid ejection heating element may include a first conductive trace, and an at least partially perforated resistive thin film material electrically coupling the first conductive trace to a second conductive trace. The perforations within the perforated resistive thin film material defines a resistance of the thermal fluid ejection heating element.

Provided is a shunt resistor including: a first terminal and a second terminal each made of an electrically conductive metal material and having a first plane, a second plane, and an outer peripheral surface around the planes; and a resistive body connected to the respective first planes and connecting the first terminal and the second terminal, the first planes of the first terminal and the second terminal opposing each other. A bonding area between the resistive body and the first planes is smaller than an area of the first planes. The first terminal and the second terminal each have a hole penetrating through from the first plane to the second plane. A voltage detection terminal is connected to opposing surface sides of the first terminal and the second terminal.