Provided is a shunt resistor including: a first terminal and a second terminal each made of an electrically conductive metal material and having a first plane, a second plane, and an outer peripheral surface around the planes; and a resistive body connected to the respective first planes and connecting the first terminal and the second terminal, the first planes of the first terminal and the second terminal opposing each other. A bonding area between the resistive body and the first planes is smaller than an area of the first planes. The first terminal and the second terminal each have a hole penetrating through from the first plane to the second plane. A voltage detection terminal is connected to opposing surface sides of the first terminal and the second terminal.

Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.

Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.

A display device includes a display panel, and a front panel overlapping with the display panel and being switched into a reflection state in which incident light is reflected and a transmission state in which incident light is transmitted. The front panel includes a first substrate, a second substrate facing the first substrate, a liquid crystal layer sealed between the first substrate and the second substrate, a first translucent electrode provided on a side of the first substrate on which the liquid crystal layer is located, a second translucent electrode provided on a side of the second substrate on which the liquid crystal layer is located, a discharge resistor that is electrically coupled to the second translucent electrode and is provided on the second substrate, and a first conductive pillar that electrically couples the first translucent electrode and the discharge resistor.

A display device includes a display panel, and a front panel overlapping with the display panel and being switched into a reflection state in which incident light is reflected and a transmission state in which incident light is transmitted. The front panel includes a first substrate, a second substrate facing the first substrate, a liquid crystal layer sealed between the first substrate and the second substrate, a first translucent electrode provided on a side of the first substrate on which the liquid crystal layer is located, a second translucent electrode provided on a side of the second substrate on which the liquid crystal layer is located, a discharge resistor that is electrically coupled to the second translucent electrode and is provided on the second substrate, and a first conductive pillar that electrically couples the first translucent electrode and the discharge resistor.

Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.

Provided is a semiconductor device which is a facedown mounting, chip-size-package-type semiconductor device and includes: a transistor element including a first electrode, a second electrode, and a control electrode which controls a conduction state between the first electrode and the second electrode; a plurality of first resistor elements each including a first electrode and a second electrode, the first electrodes of the first resistor elements being electrically connected to the second electrode of the transistor element; one or more external resistance terminals to which the second electrodes of the plurality of first resistor elements are physically connected; a first external terminal electrically connected to the first electrode of the transistor element; and an external control terminal electrically connected to the control electrode. The one or more external resistance terminals, the first external terminal, and the external control terminal are external connection terminals provided on a surface of the semiconductor device.

Provided is a shunt resistor mount structure comprising: a shunt resistor including a pair of electrodes and a resistive body; a current detecting substrate having a control circuit mounted thereon, the substrate having a voltage detecting portion to which a pair of voltage detection terminals of the shunt resistor are connected; and a temperature sensor for measuring a temperature of the electrodes.

Provided is a shunt resistor mount structure comprising: a shunt resistor including a pair of electrodes and a resistive body; a current detecting substrate having a control circuit mounted thereon, the substrate having a voltage detecting portion to which a pair of voltage detection terminals of the shunt resistor are connected; and a temperature sensor for measuring a temperature of the electrodes.

A shunt resistor having sufficient bonding strength includes a resistor, a pair of bases which are integrally formed with the resistor so as to sandwich the resistor, recessed holes which are respectively formed in the bases, and measurement terminals which are inserted into the recessed holes and are affixed to the bases. Each measurement terminal has a shaft part and a flange part that protrudes outwardly in the circumferential direction of the shaft part. Each recessed hole is formed to have a diameter smaller than the diameter of the flange part, and the shaft parts are respectively inserted into the recessed holes.