Semiconductor device structures and methods for manufacturing the same are provided. The semiconductor device structure includes a substrate, a first nitride semiconductor layer, a second nitride semiconductor layer, a first electrode, a second electrode, a gate structure and a temperature sensitive component. The first nitride semiconductor layer is disposed on the substrate. The second nitride semiconductor layer is disposed on the first nitride semiconductor layer and has a bandgap greater than that of the first nitride semiconductor layer. The first electrode, the second electrode and the gate structure are disposed on the second nitride semiconductor layer. The temperature sensitive component is disposed external to a region between the gate structure and the first electrode along a first direction in parallel to an interface of the first nitride semiconductor layer and the second nitride semiconductor layer.

Semiconductor device structures and methods for manufacturing the same are provided. The semiconductor device structure includes a substrate, a first nitride semiconductor layer, a second nitride semiconductor layer, a first electrode, a second electrode, a gate structure and a temperature sensitive component. The first nitride semiconductor layer is disposed on the substrate. The second nitride semiconductor layer is disposed on the first nitride semiconductor layer and has a bandgap greater than that of the first nitride semiconductor layer. The first electrode, the second electrode and the gate structure are disposed on the second nitride semiconductor layer. The temperature sensitive component is disposed external to a region between the gate structure and the first electrode along a first direction in parallel to an interface of the first nitride semiconductor layer and the second nitride semiconductor layer.

A forming method for a heating element of an electronic cigarette and a manufacturing method for an atomization assembly are provided, the forming method comprises coiling a heating wire into a heating coil, dividing the heating coil into sections including a plurality of heating sections and connecting sections; providing a deposition preventing layer on an external surface of the heating section; electroplating the heating coil, coating outer peripheral faces of all of the connecting sections of the heating coil with coatings having an electrical resistivity lower than that of the heating wire; removing the deposition preventing layer; and cutting the heating coil electroplated. The present application makes the manufacturing process of the heating element and the atomization assembly continues automatically, the production efficiency is improved, the resistance of the heating element or atomization assembly manufactured is more stable, and the product quality is higher.

A forming method for a heating element of an electronic cigarette and a manufacturing method for an atomization assembly are provided, the forming method comprises coiling a heating wire into a heating coil, dividing the heating coil into sections including a plurality of heating sections and connecting sections; providing a deposition preventing layer on an external surface of the heating section; electroplating the heating coil, coating outer peripheral faces of all of the connecting sections of the heating coil with coatings having an electrical resistivity lower than that of the heating wire; removing the deposition preventing layer; and cutting the heating coil electroplated. The present application makes the manufacturing process of the heating element and the atomization assembly continues automatically, the production efficiency is improved, the resistance of the heating element or atomization assembly manufactured is more stable, and the product quality is higher.

A heating plate 10 includes: a pair of glass plates 11, 12; a conductive pattern 40, 70 disposed between the pair of glass plates 11, 12 and defining a plurality of opening areas 43, 73; and a joint layer 13, 14 disposed between the conductive pattern 40, 70 and at least one of the pair of glass plates 11, 12; wherein the conductive pattern 40, 70 includes a plurality of connection elements 44, 74 that extend between two branch points 42, 72 to define the opening areas 43, 73; and a total value of lengths of straight line segments connecting the two branch points 42, 72 is less than 20% of a total value of the plurality of connection elements 44, 74.

The present invention provides a chip resistor and a method of making the same for alleviating stress resulted from thermal expansion difference and thus suppressing cracks. A chip resistor includes: a substrate, having a carrying surface and a mounting surface facing away from each other; a pair of upper electrodes, disposed at two ends of the carrying surface; a resistor, disposed on the carrying surface and between the pair of upper electrodes, and electrically connected to the pair of upper electrodes; a stress relaxation layer having flexibility and formed on the mounting surface of the substrate; a metal thin film layer, formed on a surface of the stress relaxation layer opposite to the substrate; a side electrode for electrically connecting the upper electrodes and the metal thin film layer; and a plating layer covering the side electrode and the metal thin film layer.

A manufacturing method for a temperature sensor includes a disposing step and a fixing step. The disposing step includes disposing a thermistor element so that a distal end portion of a first lead wire extends along a first side surface and passes by the first side surface, and a distal end portion of a second lead wire extends along a second side surface. The fixing step includes electrically connecting and fixing the first lead wire to a first outer electrode, and electrically connecting and fixing the second lead wire to a second outer electrode, in a state in which a first corner and a second corner are respectively supported by the first lead wire and the second lead wire.

A manufacturing method for a temperature sensor includes a disposing step and a fixing step. The disposing step includes disposing a thermistor element so that a distal end portion of a first lead wire extends along a first side surface and passes by the first side surface, and a distal end portion of a second lead wire extends along a second side surface. The fixing step includes electrically connecting and fixing the first lead wire to a first outer electrode, and electrically connecting and fixing the second lead wire to a second outer electrode, in a state in which a first corner and a second corner are respectively supported by the first lead wire and the second lead wire.

A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an embodiment of the present invention includes: a substrate having a circuit formed thereon; first to third pads laminated and separated from one another on the substrate; first to third terminals connected to the first to third pads, respectively; and first and second resistors formed between the first and second terminals and between the second and third terminals, respectively, and serially connected to each other and configured to adjust electric current flowed into the circuit.

An electronic component includes a ceramic element, glass-containing Au layers formed on both surfaces of the ceramic element, and an Au—Sn alloy layer formed on at least one of the glass-containing Au layers; the electronic component further includes a pure-Au layer between the glass-containing Au layer and the Au—Sn alloy layer; furthermore, the Au—Sn alloy layer has an Au—Sn eutectic structure.