Patent classifications
H01F5/00
Carbon nanotube-based integrated power inductor for on-chip switching power converters
An inductor has a substrate and at least one coil of carbon nanotubes. A trench is formed in the substrate, and the carbon nanotubes are grown in the trench in order to form a coil for the inductor. In some embodiments, multiple coils may be formed in the trench as may be desired.
Carbon nanotube-based integrated power inductor for on-chip switching power converters
An inductor has a substrate and at least one coil of carbon nanotubes. A trench is formed in the substrate, and the carbon nanotubes are grown in the trench in order to form a coil for the inductor. In some embodiments, multiple coils may be formed in the trench as may be desired.
Line filter and electric power supply device comprising same
Disclosed are a line filter and a power supply apparatus including the line filter. The line filter includes a first inductor having a first coil wound around a first bobbin; and a second inductor having a second coil wound around a second bobbin, the second inductor being induced by the first inductor to flow current, wherein the first bobbin and the second bobbin are physically separated from each other. The power supply apparatus includes such a line filter.
Line filter and electric power supply device comprising same
Disclosed are a line filter and a power supply apparatus including the line filter. The line filter includes a first inductor having a first coil wound around a first bobbin; and a second inductor having a second coil wound around a second bobbin, the second inductor being induced by the first inductor to flow current, wherein the first bobbin and the second bobbin are physically separated from each other. The power supply apparatus includes such a line filter.
Transformer and power supply device including the same
A transformer includes a magnetic core, a first coil unit and a second coil unit. The first coil unit is disposed within the magnetic core and includes a laminated board having layers laminated therein and conductive patterns. Respective ones of the conductive patterns are disposed on the laminated layers. The second coil unit includes a conductive wire spaced apart from the conductive patterns of the laminated board by an insulating distance. The conductive wire includes a triple-insulated wire surrounded by three sheets of insulating paper to maintain the insulating distance from the conductive patterns.
Modular transformer system
A transformer system includes a transformer module and a base module. One or more transformer modules are detachably coupled to the base module. The transformer module includes a housing, a transformer, primary-side and secondary-side wires electrically connected to primary and secondary terminals of the transformer, a conductive tab electrically connected to a neutral terminal of the transformer, and a first coupling mechanism. The base module includes a base enclosure, a neutral connector electrically connected to a power line neutral connection, and a second coupling mechanism. The second coupling mechanism detachably engages the first coupling mechanism of the transformer module, and the conductive tab of the transformer module is electrically connected to the neutral connector of the base module when the first coupling mechanism is engaged with the second coupling mechanism.
Component arrangement
Various embodiments may relate to a component arrangement, including a carrier, wherein at least one electronic component is formed in the carrier, a first metallization layer over the carrier, wherein the first metallization layer has a first metallic coupling structure, which is electrically coupled to the at least one electronic component, a second metallization layer over the first metallization layer, wherein the second metallization layer has a second metallic coupling structure, wherein the first metallic coupling structure is coupled to the second metallic coupling structure by means of at least one via, and a plurality of additional vias, which extend at least between the first metallization layer and the second metallization layer and are electrically conductively coupled to one another in such a way that they form a coil, which has a coil region which is at an angle to the main processing surface of the carrier.
Component arrangement
Various embodiments may relate to a component arrangement, including a carrier, wherein at least one electronic component is formed in the carrier, a first metallization layer over the carrier, wherein the first metallization layer has a first metallic coupling structure, which is electrically coupled to the at least one electronic component, a second metallization layer over the first metallization layer, wherein the second metallization layer has a second metallic coupling structure, wherein the first metallic coupling structure is coupled to the second metallic coupling structure by means of at least one via, and a plurality of additional vias, which extend at least between the first metallization layer and the second metallization layer and are electrically conductively coupled to one another in such a way that they form a coil, which has a coil region which is at an angle to the main processing surface of the carrier.
Common mode filter and method of manufacturing the same
Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode.
Electronic component
An electronic component includes a device body and first through n-th LC parallel resonators connected in series with each other. The first through n-th LC parallel resonators respectively include first through n-th inductors and first through n-th capacitors. The first through n-th inductors are disposed in a first direction in the device body in this order. The first and n-th inductors are provided with a spiral shape or a helical shape such that they turn around respective winding axes extending along a second direction which is perpendicular or substantially perpendicular or substantially perpendicular or substantially perpendicular to the first direction. At least one of the second through (n−1)-th inductors is provided with a helical shape such that it turns around a winding axis extending along the first direction.