A common mode choke coil includes a differential transmission line including first and second signal lines, a main circuit including a first coil provided in the first signal line, and a second coil provided in the second signal line and connected to the first coil by magnetic field coupling, and a parallel resonance circuit including a third coil connected to both the first and second coils by magnetic field coupling, and a first capacitor electrically connected in parallel to the third coil. In the common mode choke coil, a first resonant frequency of the main circuit is equal or substantially equal to a second resonant frequency of the parallel resonance circuit.

A coil component includes a body having one surface and another surface opposing each other and a plurality of wall surfaces each connecting the one surface to the other surface of the body. A pair of recesses are disposed in a respective end surface of a pair of opposing end surfaces of the body and each extend to the one surface. A coil portion includes first and second lead-out portions disposed on a surface of an internal insulating layer embedded in the body, and the coil portion is exposed to an internal wall and a bottom surface of each of the pair of recesses. First and second external electrodes are each disposed along the internal wall of a respective recess and along the one surface of the body to be connected to the coil portion, and are spaced apart from each other on the one surface of the body.

An electronic module is provided. The electronic module includes: a magnetic device having a magnetic body, electronic devices, and a substrate, wherein a first lead extends out from a first lateral surface and a second lead extends out from a second lateral surface opposite to the first lateral surface of the magnetic body and the substrate and the second lead of the magnetic device are located at a same lateral side of the magnetic body and the second lead is extended from the second lateral surface of the magnetic body to the substrate to electrically connect the magnetic device and the substrate.

There is provided a coil component including a coil portion that has at least one layer of planar coil including a coil-wound portion and an insulative layer which covers the periphery of the coil-wound portion, a covering portion that covers the coil portion and is constituted of a mixture including magnetic fillers and resin, and a conductor post that is penetratingly provided inside the covering portion and extends from the coil-wound portion to an upper surface of the covering portion along an axial direction of the planar coil. The conductor post has a post portion which extends from the coil-wound portion in the axial direction of the planar coil, and a lid portion which is exposed from the covering portion and extends from an end portion of the post portion on the upper surface side along a surface direction of the upper surface.

Solid state components having an air core and methods of producing such components are presented. An air core component preferably has lower conducting bands, upper conducting, and conducting posts that collectively form a conducting coil. A coating material placed at least over the upper bands of the coil provides structural support for the coil. The coil can be built around or in a sacrificial core material that can be removed leaving an air core behind.

Surface mount components and related methods involve thin film circuits between first and second insulating substrates. The thin film circuits may include passive components, including resistors, capacitors, inductors, arrays of such components, networks, or filters of multiple passive components. Such thin film circuit(s) can be sandwiched between first and second insulating substrates with internal conductive pads which are exposed to the outside of the surface mount component and electrically connected to external terminations. External terminations may include at least one layer of conductive polymer. Optional shield layers may protect the surface mount components from signal interference. A cover substrate may be formed with a plurality of conductive elements that are designed to generally align with the conductive pads such that conductive element portions are exposed in groups along surfaces of a device.

A highly reliable winding part is provided which is capable of providing insulation with reliability. A core is attached to a bobbin along a first direction. First terminals and second terminals are disposed along the first direction. A first terminal group and a second terminal group are disposed with the core interposed between the groups. A first insulation portion or a recess along a second direction that is not parallel to the first direction is provided between the first terminals and the second terminals, and a second insulation portion or a core groove along the first direction is provided between the first terminal group and the second terminal group.

An electrical system including a body may have a structure resembling a double helix having twisted conductive wires wound around both helical structures. The electrical system may be used to produce useful electromagnetic effects for various applications, including providing therapy and promoting growth of living organisms.

An electrical system including a body may have a structure resembling a double helix having twisted conductive wires wound around both helical structures. The electrical system may be used to produce useful electromagnetic effects for various applications, including providing therapy and promoting growth of living organisms.

A coil device includes a board, a first pattern formed on one surface of the board, and a second pattern formed on the other surface of the board. At least one pattern via electrically connects the first pattern and the second pattern to each other. A via region, corresponding to a region in which the pattern via is formed in the first pattern, includes n first conducting wires (where n is a natural number of 1 or more). At least a portion of the first pattern, excluding the via region in the first pattern, includes m first conducting wires (where m is greater than n and is a natural number of 2 or more).