A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.

A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.

An alloy particle contains: total content of Fe and Co: from 82.2 to 96.5 parts by mass; Co: 0 to 30.0 parts by mass; P: 0 to 4.5 parts by mass; B: more than 0 to 5.0 parts by mass; C: 0 to 3.0 parts by mass; Si: 0 to 6.7 parts by mass; Ni: more than 0 to 12.0 parts by mass; Cr: more than 0 to 4.2 parts by mass; total content of Mo, W, Zr, and Nb: 0 to 4.2 parts by mass; total content of P and Cr: 7.4 parts by mass or less; multiplication product of the parts by mass of Ni and Cr: 0.5 or more; and total content of Fe, Co, and Ni: 97.0 parts by mass or less. The alloy particle contains an amorphous phase, and a volume percentage of the amorphous phase is 70% or higher.

An alloy particle contains: total content of Fe and Co: from 82.2 to 96.5 parts by mass; Co: 0 to 30.0 parts by mass; P: 0 to 4.5 parts by mass; B: more than 0 to 5.0 parts by mass; C: 0 to 3.0 parts by mass; Si: 0 to 6.7 parts by mass; Ni: more than 0 to 12.0 parts by mass; Cr: more than 0 to 4.2 parts by mass; total content of Mo, W, Zr, and Nb: 0 to 4.2 parts by mass; total content of P and Cr: 7.4 parts by mass or less; multiplication product of the parts by mass of Ni and Cr: 0.5 or more; and total content of Fe, Co, and Ni: 97.0 parts by mass or less. The alloy particle contains an amorphous phase, and a volume percentage of the amorphous phase is 70% or higher.

A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed from a surface of the body, and a connection portion including a plurality of connecting conductors each having a bent portion to increase lengths of the plurality of connecting conductors embedded in the body, the plurality of connecting conductors being spaced apart from each other, the connection portion connecting an end of the coil portion to the lead-out portion to each other.

A microelectronics package comprising a package core and an inductor over the package core. The inductor comprises a dielectric over the package core. The dielectric comprises a curved surface opposite the package core. At least one conductive trace is adjacent to the package core. The at least one conductive trace is at least partially embedded within the dielectric and extends over the package core. A magnetic core cladding is over the dielectric layer and at least partially surrounding the conductive trace.

A coiled electronic component includes: an electronic component body which includes a coil portion having a spiral structure and formed of an electrically conductive material, and electrically conductive connection portions arranged on both ends of the coil portion; and a pair of electrodes for respectively connecting the electrically conductive connection portions to assembly portions arranged on an assembly object. The electrode includes a pair of pinching pieces for pinching the electrically conductive connection portion, and the pair of pinching pieces is opened in a manner that the electrically conductive connection portion is received and fitted therebetween.

A coiled electronic component includes: an electronic component body which includes a coil portion having a spiral structure and formed of an electrically conductive material, and electrically conductive connection portions arranged on both ends of the coil portion; and a pair of electrodes for respectively connecting the electrically conductive connection portions to assembly portions arranged on an assembly object. The electrode includes a pair of pinching pieces for pinching the electrically conductive connection portion, and the pair of pinching pieces is opened in a manner that the electrically conductive connection portion is received and fitted therebetween.

An inductor includes a first conductor, a second conductor, an insulation film, and a magnetic body. The first conductor spirally extends in a plane. The second conductor spirally extends in a plane. The second conductor is stacked on and joined to the first conductor. The insulation film covers a surface of the first conductor and a surface of the second conductor. The magnetic body covers a surface of the insulation film and embeds the first conductor and the second conductor. The first conductor and the second conductor are connected to form a helical coil.

A superconductor magnetic field effect transistor. The superconductor magnetic field effect transistor may include a sheet of a superconducting material; and a solenoid. The sheet may be substantially flat, and the solenoid may include a plurality of turns, each of the turns being substantially parallel to the sheet. The superconducting material may be a type-II superconducting material.