H01F5/00

Laminated electronic component

A laminated electronic component includes an element body and a conductor. The element body is formed by laminating a plurality of element-body layers. The element body has a first face, a second face, and a pair of third faces. The conductor is disposed on the element body and has an L shape. The conductor has an exposed face exposed on the first face and the second face. The exposed face includes a plurality of divided regions divided by the element body. The length of each divided region in a dividing direction is longer than a distance with which the plurality of divided regions is separated from each other and longer than a distance with which the exposed face and the pair of third faces are separated from each other.

Chip inductor and method of manufacturing the same

A chip inductor includes a body having a coil and an insulating member on which the coil is disposed, and external electrodes disposed on external surfaces of the body. The insulating layers are disposed on one surface of the insulating member in the body and another surface opposing the one surface, respectively, and are made of a material different from a material of the insulating member. The insulating member and the insulating layers constitute a multilayer structure. The coil includes a top coil and a bottom coil disposed on a top surface and a bottom surface of the multilayer structure, respectively. The top and bottom coils are connected by a via penetrating through the top and bottom surfaces of the multilayer structure.

Slow wave inductive structure and method of forming the same

A slow wave inductive structure includes a first substrate. The slow wave inductive structure further includes a first conductive winding over the first substrate. The slow wave inductive structure further includes a second substrate over the first substrate, wherein a distance between the first conductive winding and the second substrate ranges from about 1 micron (μm) to about 2 μm, and the second substrate comprises polysilicon or doped silicon. The slow wave inductive structure further includes a second conductive winding on an opposite side of the second substrate from the first conductive winding.

Coil component

A coil component includes a support substrate, a first coil and a second coil disposed on the support substrate to be spaced apart from each other, and a body including a first core and a second core penetrating through the first coil portion and the second coil portion and spaced apart from each other. The first coil portion has a first winding portion, forming at least one turn about the first core, and a first extension portion extending from one end portion of the first winding portion to surround the first core and the second core. The second coil has a second winding portion, forming at least one turn about the second core, and a second extension portion extending from one end portion of the second winding portion to surround the first core and the second core. A separation distance between a given turn of the first coil portion and an adjacent turn of the second coil portion is different from a separation distance between adjacent turns of the first coil portion.

Electronic component

An electronic component includes: an element body in which a plurality of insulator layers are stacked; a coil in which a plurality of inner conductors installed in the element body are electrically connected to each other; and an outer electrode that is disposed on an outer surface of the element body, is electrically connected to the coil, and includes at least a baked electrode layer. The inner conductor connected to the outer electrode includes a connection conductor that electrically connects the baked electrode layer to the inner conductor. The connection conductor includes a protruding portion that protrudes from the outer surface of the element body to the outer electrode. The protruding portion includes a metal having a smaller diffusion coefficient than a metal of a main component included in the baked electrode layer. The inner conductors have a lower electric resistance value than the metal included in the protruding portion.

ANTENNA FOR TRANSFER OF INFORMATION OR ENERGY

An antenna for transfer of information or energy is described. The antenna includes an electrically conductive first layer having a width in a thickness direction of the antenna and extending longitudinally along a length of the first layer between first and second longitudinal ends of the first layer, and an electrically insulative thermally conductive second layer bonded to the first layer along the length of the first layer. The first and second layers are wound to form a plurality of substantially concentric loops. A width and a length of the second layer are substantially co-extensive with the respective width and length of the first layer so as to expose opposing longitudinal edge surfaces of the first layer along the length of the first layer. Coils and assemblies useful for making coils are also described.

Multilayer coil component

A component main body has a multilayer structure having a thickness and in which a first dielectric glass layer in which an internal conductor is embedded and having a thickness is interposed between a pair of magnetic layers containing a ferrite material as a primary component, and each of a pair of second dielectric glass layers is disposed on one of principal surfaces of the pair of magnetic layers. First to fourth outer electrodes are disposed on both end portions of the component main body. The thickness of at least one of the pair of second dielectric glass layers that faces a mounting substrate is about 10 μm to 64 μm.

Coil electronic component
11482370 · 2022-10-25 · ·

A coil electronic component includes a body comprising a magnetic material, an insulating substrate comprising a support portion disposed inside the body, and a tip extending from the support portion and exposed from an external surface of the body, a coil portion disposed on the support portion, and a lead-out portion extending from one end of the coil portion, disposed on the tip, and exposed from the external surface of the body. The lead-out portion has a slit exposed from the external surface of the body.

Metal layer for inductive power transfer
11606119 · 2023-03-14 · ·

An inductive charging system for inductive charging of electronic devices is disclosed. In accordance with an embodiment, the system includes a substantially planar inductive charging coil parallel to the surface of the inductive charger or the electronic device. The system further includes a metallic layer positioned proximate to and substantially parallel to the inductive coil to cover a surface of the inductive coil. The metallic layer comprises multiple substantially concentric rings or polygons, with each of the concentric rings or polygons having multiple sections separated by gaps such that each concentric ring or polygon is discontinuous. Adjacent sections of each concentric ring or polygon are electrically isolated from one another to avoid eddy current generation and heating of the metallic layer during inductive power transfer.

Coil component

Disclosed herein is a coil component that includes a first coil part spirally wound in a plurality of turns, the first coil part including a first turn positioned at an innermost periphery and a second turn positioned on an outer peripheral side relative to the first turn; and a second coil part spirally wound in a plurality of turns, the second coil part including a third turn positioned at an innermost periphery and a fourth turn positioned on an outer peripheral side relative to the third turn. The first turn and the fourth turn are connected to each other, and the second turn and the third turn are connected to each other.