A magnetic wiring circuit board includes an insulating layer; a wire disposed on a one-side surface in a thickness direction of the insulating layer and having a one-side surface in the thickness direction disposed to face the one-side surface in the thickness direction of the insulting layer at spaced intervals thereto, an other-side surface in the thickness direction in contact with the one-side surface in the thickness direction of the insulating layer, and side surfaces each connecting an end edge of the one-side surface in the thickness direction to an end edge of the other-side surface in the thickness direction; and a magnetic layer containing a magnetic particle having a shape of an aspect ratio of 2 or more and embedding the wire.

Disclosed herein is a coil component that includes first and second substrates, a first coil pattern formed on one surface of the first substrate, a second coil pattern formed on one surface of the second substrate, a first terminal electrode connected to one end of the first coil pattern and protruding from the first substrate, and a second terminal electrode connected to one end of the second coil pattern and protruding from the second substrate. The first and second substrates are laminated such that the first and second terminal electrodes overlap each other and are connected to each other.

A multilayer filter may include a signal path having an input, an output, and a conductive layer overlying at least one of a plurality of dielectric layers. The conductive layer may be elongated in the first direction and may have a first edge aligned with the first direction and a second edge parallel with the first edge. The conductive layer may include a protrusion extending in the second direction and having an end edge that is parallel with the first edge and offset from the first edge in the second direction by a protrusion length that is greater than about 50 microns. The multilayer filter may include an inductor that is electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground.

A multilayer inductor component includes an element body that is an insulator and a coil in which a plurality of coil conductor layers that extend along planes in the element body are electrically connected to each other. Also, each of the coil conductor layers includes metal part and glass part, and the glass part include internal glass portion that is entirely included in the metal part.

The present disclosure relates to a coil assembly. According to a first embodiment of the present disclosure, there is provided a coil assembly including a coil including a multilayer film which is extended between a first longitudinal end and a second longitudinal end of the multilayer film, which are opposite to each other, and which is wound to form a plurality of loops which are substantially concentric, wherein the multilayer film includes: cut edges which are extended between the first longitudinal end and the second longitudinal end, and are opposite to each other and are substantially parallel to each other; a metal layer; and a magnetic layer disposed on the metal layer, wherein, at one or more of the first longitudinal end and the second longitudinal end of the multilayer film, the metal layer is electrically connected to a conductive terminal.

An inductor device includes a first trace, a second trace, and a connection member. The first inductor includes a first trace and a second trace. The shape of one of the first trace and the second trace is spiral. The second inductor includes a third trace and a fourth trace. The connection member is configured to couple the first inductor and the second inductor.

A semiconductor device includes an interposer disposed on a substrate. A first major surface of the interposer faces the substrate. A system on a chip is disposed on a second major surface of the interposer. The second major surface of the interposer opposes the first major surface of the interposer. A plurality of first passive devices is disposed in the first major surface of the interposer. A plurality of second passive devices is disposed on the second major surface of the interposer. The second passive devices are different devices than the first passive devices.

An electronic component includes a body having a side surface, coil conductor layers wound along main surfaces parallel to the side surface, and capacitor conductor layers each having a substantially plate-like shape parallel to the side surface. The coil conductor layers and the capacitor conductor layers are arranged in a widthwise direction perpendicular to the side surface. The capacitor conductor layers include first and second capacitor conductor layers adjacent to each other in the widthwise direction. The coil conductor layers include a first coil conductor layer that is in the same layer as the first capacitor conductor layer and a second coil conductor layer that is in the same layer as the second capacitor conductor layer. The shortest distance between the first coil conductor layer and the first capacitor conductor layer is larger than the shortest distance between the second coil conductor layer and the second capacitor conductor layer.

An inductor device includes first, second, third and fourth wire, first and second connector, and eight-shaped inductor structure. First and second wires are disposed in first and second areas. Third wire is disposed in first area and partially overlapped with first wire in a vertical direction, and third wire is coupled to second wire. Fourth wire is disposed in second area and partially overlapped with second wire in the vertical direction, and fourth wire is coupled to first wire. First connector is partially overlapped with first wire or third wire in the vertical direction, and is coupled to inner wire and outer wire of third wire. Second connector is partially overlapped with second wire or fourth wire in the vertical direction, and is coupled to inner and outer wire of fourth wire. Eight-shaped inductor structure is disposed on outer side of third wire and fourth wire.

An inductor device includes a first wire, a second wire, an input terminal, a third wire, a fourth wire, and an eight-shaped inductor structure. The first wire is disposed in a first area. The second wire is disposed in a second area. The input terminal is disposed on a first side of the second area. The third wire is disposed in the first area and at least partially overlapped with the first wire in a vertical direction, in which the third wire is coupled to the first wire. The fourth wire is disposed in the second area and at least partially overlapped with the second wire in the vertical direction, in which the fourth wire is coupled to the second wire. The eight-shaped inductor structure is disposed on an outer side of the third wire and the fourth wire.