An inductor device includes a first trace, a second trace, and a double ring inductor. The first trace is disposed at a first area. The second trace is disposed at a second area. The double ring inductor is located at an outside of the first trace and the second trace. The double ring inductor is respectively coupled to the first trace and the second trace in an interlaced manner.

A base includes a main body and a multilayer metal film disposed on the main body. The multilayer metal film includes a first metal film disposed on the main body, the first metal film having conductivity, second metal film on the first metal film and above the main body, the second metal film having resistance to solder leaching, and a third metal film on the second metal film, the third metal film having wettability. The third metal film includes an inwardly extended portion extending between the second metal film and the main body.

A transformer, a method for manufacturing the same and an electromagnetic device are disclosed. The transformer includes a base plate, a magnetic core, transmission wire layers and conductive parts. The base plate includes a central part defining multiple inner via holes each running through the base plate and a peripheral part defining multiple outer via holes each running through the base plate. An annular accommodating groove is defined between the central pan and the peripheral part. The magnetic core is received in the accommodating groove. The transmission wire layers may be disposed respectively on two opposite sides of the base plate. Each of the transmission wire layers includes multiple wire patterns. Multiple conductive parts are respectively disposed in the inner via holes and the outer via holes.

Disclosed is a tunable inductor device having a substrate, a planar spiral conductor having a plurality of spaced-apart turns disposed over the substrate, and a phase change switch (PCS) having a patch of a phase change material (PCM) disposed over the substrate between and in contact with a pair of adjacent segments of the plurality of spaced-apart turns, wherein the patch of the PCM is electrically insulating in an amorphous state and electrically conductive in a crystalline state. The PCS further includes a thermal element disposed adjacent to the patch of PCM, wherein the thermal element is configured to maintain the patch of the PCM to within a first temperature range until the patch of the PCM converts to the amorphous state and maintain the patch of the PCM within a second temperature range until the first patch of PCM converts to the crystalline state.

A highly reliable coil component having reduced electric resistance and improved bonding strength in a connection portion between a coil conductor and an external electrode. A coil component includes an element body including a coil conductor including a wound conductive wire coated with an insulating film, a magnetic portion containing metal magnetic particles and resin, and an external electrode on a surface of the element body and electrically connected to exposed surfaces, which are exposed on the surface of the element body, of extended portions of the coil conductor. The external electrode includes at least one or more layers. When an average crystal grain size of crystal grains constituting the coil conductor is defined as a and an average crystal grain size of crystal grains constituting a base electrode layer of the external electrode directly connected to the coil conductor is defined as b, a>b is satisfied.

A method of manufacturing a power semiconductor system includes providing a power module having one or more power transistor dies and attaching an inductor module to the power module such that the inductor module is electrically connected to a node of the power module. The inductor module includes a substrate with a magnetic material and windings at one or more sides of the substrate. Further methods of manufacturing power semiconductor systems and methods of manufacturing inductor modules are also described.

In a described example, an integrated circuit includes: a semiconductor substrate having a first surface and an opposite second surface; at least one dielectric layer overlying the first surface of the semiconductor substrate; at least one inductor coil in the at least one dielectric layer with a plurality of coil windings separated by coil spaces, the at least one inductor coil lying in a plane oriented in a first direction parallel to the first surface of the semiconductor substrate, the at least one inductor coil electrically isolated from the semiconductor substrate by a portion of the at least one dielectric layer; and trenches extending into the semiconductor substrate in a second direction at an angle with respect to the first direction, the trenches underlying the inductor coil and filled with dielectric replacement material.

A multilayer substrate includes a stacked body including a first main surface, and a conductor pattern (including a mounting electrode provided on the first main surface, and a first auxiliary pattern provided on the first main surface). The stacked body includes a plurality of insulating base material layers made of a resin as a main material and stacked on one another. The first auxiliary pattern is located adjacent to or in a vicinity of the mounting electrode. The mounting electrode, in a plan view of the first main surface (when viewed in the Z-axis direction), is interposed between a different conductor pattern (the mounting electrode) and the first auxiliary pattern.

A coil electronic component includes a support substrate, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, at least one metal thin plate disposed on an upper portion of the coil pattern and having a shape bent toward the core region, an encapsulant sealing at least a portion of the support substrate, the coil pattern, and the at least one metal thin plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.

A thin film inductor is disclosed, which includes a thin film magnetic core. The thin film magnetic core includes at least one magnetic thin film. In each magnetic thin film, at least one type-1 gap is provided. A length direction of the type-1 gap is parallel to a direction of hard magnetization of the magnetic thin film. If the thin film magnetic core comprises at least two magnetic thin films, the at least two magnetic thin films are laminated and overlap each other. A sum of widths of all type-1 gaps in each magnetic thin film is the same.