Antenna structures including two anti-symmetrically wound transformers to compensate for stray radiation. In one example an antenna structure includes a transformer assembly connected between an antenna and first and second balanced signal contacts, the transformer assembly including first and second transformer cores independently positionable in space relative to one another, a pair of primary windings connected to the antenna in parallel with one another, and a pair of balanced secondary windings connected in parallel with one another between the first and second balanced signal contacts.

An inductor having a first coil of metal trace configured in an open loop topology and placed in a first metal layer; a second coil of metal trace configured in an open loop topology and placed in the first metal layer; and a third coil of metal trace configured in a closed loop topology and placed in a second metal layer, wherein: the first coil of metal trace is laid out to be substantially symmetrical with respect to a first axis, the second coil of metal trace is laid out to be approximately a mirror image of the first coil of metal trace with respect to a second axis, and the third coil of metal trace is laid out to enclose a majority portion of both the first coil of metal trace and the second coil of metal trace from a top view perspective.

In a particular embodiment, a device includes a low-loss substrate, a first inductor structure, and an air-gap. The first inductor structure is between the low-loss substrate and a second inductor structure. The first inductor structure is aligned with the second inductor structure to form a transformer. The air-gap is between the first inductor structure and the second inductor structure.

In a particular embodiment, a device includes a low-loss substrate, a first inductor structure, and an air-gap. The first inductor structure is between the low-loss substrate and a second inductor structure. The first inductor structure is aligned with the second inductor structure to form a transformer. The air-gap is between the first inductor structure and the second inductor structure.

An electronic circuit device includes a board and a transformer that is provided at the board and that has a primary winding member and a secondary winding member. The primary winding member is configured with a primary winding that is provided at the board and a primary side element that is electrically connected to the primary winding member. The secondary winding member is configured with a secondary winding that is provided at the board and a secondary side element that is electrically connected to the secondary winding member.

Magnetic devices, and associated methods of manufacture, using flex circuits. Conductive flex circuit traces, or combinations of such traces with conductive printed circuit board or other substrate traces, form windings around toroidal ferromagnetic cores. Bending the flex circuit into a partial loop or a full loop forms partial or full windings respectively. Bonding or flow soldering electrically connects the windings together and to a printed circuit board or other substrate. The methods yield transformers with high conversion efficiency, are compatible with conventional printed circuit boards and readily available high-volume assembly equipment, and avoid the higher cost of manually made windings.

Magnetic devices, and associated methods of manufacture, using flex circuits. Conductive flex circuit traces, or combinations of such traces with conductive printed circuit board or other substrate traces, form windings around toroidal ferromagnetic cores. Bending the flex circuit into a partial loop or a full loop forms partial or full windings respectively. Bonding or flow soldering electrically connects the windings together and to a printed circuit board or other substrate. The methods yield transformers with high conversion efficiency, are compatible with conventional printed circuit boards and readily available high-volume assembly equipment, and avoid the higher cost of manually made windings.

Fabricating composite monolithic structures to achieve optimal electrical, thermal, and mechanical properties through the elimination of air is discussed herein. A method of fabricating a composite structure includes coating an insulating layer with an uncured binding material and performing a first curing process on the uncured binding material to form a first stage cured binding material on the insulating layer without introduction of air pockets in a conventional manufacturing atmospheric environment. The method further includes disposing the insulating layer on an array of conductive structures. The first stage cured binding material is positioned between the insulating layer and the array of conductive structures. The method further includes performing a second curing process on the first stage cured binding material to form a cured binding material, and forming cured regions between adjacent conductive structures of the array of conductive structures.

Fabricating composite monolithic structures to achieve optimal electrical, thermal, and mechanical properties through the elimination of air is discussed herein. A method of fabricating a composite structure includes coating an insulating layer with an uncured binding material and performing a first curing process on the uncured binding material to form a first stage cured binding material on the insulating layer without introduction of air pockets in a conventional manufacturing atmospheric environment. The method further includes disposing the insulating layer on an array of conductive structures. The first stage cured binding material is positioned between the insulating layer and the array of conductive structures. The method further includes performing a second curing process on the first stage cured binding material to form a cured binding material, and forming cured regions between adjacent conductive structures of the array of conductive structures.

An electronic device includes a multilevel lamination structure having a core layer, dielectric layers and conductive features formed in metal layers on or between respective ones or pairs of the dielectric layers. The core layer and the dielectric layers extend in respective planes of orthogonal first and second directions and are stacked along an orthogonal third direction. The conductive features include a first patterned conductive feature having multiple conductive turns in each of a first pair of the metal layers to form a first winding having a first turn and a final turn adjacent to one another in the same metal layer of the first pair, and a second patterned conductive feature having multiple conductive turns in a second pair of the metal layers to form a second winding having a first turn and a final turn.