A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.

Fabricating composite monolithic structures to achieve optimal electrical, thermal, and mechanical properties through the elimination of air is discussed herein. A method of fabricating a composite structure includes coating an insulating layer with an uncured binding material and performing a first curing process on the uncured binding material to form a first stage cured binding material on the insulating layer without introduction of air pockets in a conventional manufacturing atmospheric environment. The method further includes disposing the insulating layer on an array of conductive structures. The first stage cured binding material is positioned between the insulating layer and the array of conductive structures. The method further includes performing a second curing process on the first stage cured binding material to form a cured binding material, and forming cured regions between adjacent conductive structures of the array of conductive structures.

Fabricating composite monolithic structures to achieve optimal electrical, thermal, and mechanical properties through the elimination of air is discussed herein. A method of fabricating a composite structure includes coating an insulating layer with an uncured binding material and performing a first curing process on the uncured binding material to form a first stage cured binding material on the insulating layer without introduction of air pockets in a conventional manufacturing atmospheric environment. The method further includes disposing the insulating layer on an array of conductive structures. The first stage cured binding material is positioned between the insulating layer and the array of conductive structures. The method further includes performing a second curing process on the first stage cured binding material to form a cured binding material, and forming cured regions between adjacent conductive structures of the array of conductive structures.

Provided is a semiconductor device that has a configuration provided with: a driving unit for driving an upper switching element and a lower switching element according to a control signal for controlling the driving of the upper switching element and the lower switching element, which are connected in series to constitute a bridge circuit; an insulating unit having an insulating transformer; and a package for sealing at least a part of the insulating unit and the driving unit. The insulating unit transmits a signal corresponding to the control signal to the driving unit side while insulating the signal.

A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.

A coil component may include a body having a support member including a through hole, a coil disposed on at least one of an upper surface and a lower surface of the support member, and a magnetic material encapsulating the coil and the support member, and filling the through hole. The coil includes a coil pattern. The coil component further includes an external electrode connected to the coil. At least one of the upper surface and the lower surface of the support member includes a groove, having a shape corresponding to a shape of the coil pattern, and at least a portion of the coil pattern is embedded in the groove.

A coil component including an element assembly that includes a support substrate having a cavity, a first coil disposed on a first principal surface of the support substrate, a second coil disposed on a second principal surface of the support substrate, and a magnetic portion. The coil component further includes first and second outer electrodes electrode electrically coupled to the first coil, and third and further outer electrodes electrically coupled to the second coil. Each outer electrode is disposed on the surface of the element assembly. The cavity of the support substrate, the core portion of the first coil, and the core portion of the second coil overlap at least one another when viewed in the direction perpendicular to the principal surface. The magnetic portion is disposed in at least the cavity and the two core portions. Also, the support substrate is formed of sintered ferrite.

A common mode noise filter includes a laminated body including first to fourth insulating layers stacked on one another, first to fourth coil conductors spirally extending and disposed on upper surfaces of the first to fourth insulating layers, respectively, a first via-electrode connecting the first coil conductor to the second coil conductor, a second via-electrode connecting the third coil conductor to the fourth coil conductor, first and second connection parts connecting the first via-electrode to first and second inner ends of the first and second coil conductors, respectively, and third and fourth connection parts connecting the second via-electrode to third and fourth inner ends of the third and fourth coil conductors, respectively. The first connection part overlaps the second connection part when viewed from above. The third connection part overlaps the fourth connection part when viewed from above. The common mode noise filter is operable in high frequencies.

A resonant power converter for operation in the radio frequency range, preferably in the VHF, comprises at least one PCB-embedded transformer. The transformer is configured for radio frequency operation and comprises a printed circuit board defining a horizontal plane, the printed circuit board comprising at least two horizontal conductive layers separated by an isolating layer, a first embedded solenoid forming a primary winding of the transformer and a second embedded solenoid being arranged parallel to the first solenoid and forming a secondary winding of the transformer, wherein the first and second embedded solenoids are formed in the conductive layers of the printed circuit board, wherein each full turn of an embedded solenoid has a horizontal top portion formed in an upper conductive layer, a horizontal bottom portion formed in a lower conductive layer, and two vertical side portions formed by vias extending between the upper and the lower conducting layers.

A resonant power converter for operation in the radio frequency range, preferably in the VHF, comprises at least one PCB-embedded transformer. The transformer is configured for radio frequency operation and comprises a printed circuit board defining a horizontal plane, the printed circuit board comprising at least two horizontal conductive layers separated by an isolating layer, a first embedded solenoid forming a primary winding of the transformer and a second embedded solenoid being arranged parallel to the first solenoid and forming a secondary winding of the transformer, wherein the first and second embedded solenoids are formed in the conductive layers of the printed circuit board, wherein each full turn of an embedded solenoid has a horizontal top portion formed in an upper conductive layer, a horizontal bottom portion formed in a lower conductive layer, and two vertical side portions formed by vias extending between the upper and the lower conducting layers.