H01F19/00

HARMONIC SUPPRESSION IN DISPERSION RESONATORS FOR TRAVELING WAVE PARAMETRIC AMPLIFIERS
20240029932 · 2024-01-25 ·

A Traveling Wave Parametric Amplifier (TWPA) transmission line with improved bandwidth includes one or more unit cell. Each unit cell includes a capacitor to a ground and a Josephson junction in series configured to provide inductance and non-linearity. One or more dispersion resonator is coupled to the transmission line. The dispersion resonator is configured to (i) use a first harmonic mode of the resonator for resonant phase matching in the transmission line and (ii) prevent a second mode of the resonator from interacting with an intermodulation product of the transmission line.

TRANSFORMER AND SIGNAL TRANSMISSION SYSTEM
20200082977 · 2020-03-12 · ·

A transformer includes a first coil disposed on a first surface, a second coil disposed on the first surface so as to surround the first coil, a third coil disposed on a second surface that is vertically adjacent to the first surface with an insulating layer, and a fourth coil disposed on the second surface so as to surround at least a part of the third coil, and when a current is caused to flow through the first coil, the first coil generates magnetic fluxes that pass through the first coil in opposite directions, and when the current is caused to flow through the first coil, the magnetic fluxes generated by the first coil pass through the first coil in opposite directions, and when a current is caused to flow through the second coil, the second coil generates magnetic fluxes that pass through the second coil in a single direction.

TRANSFORMER AND SIGNAL TRANSMISSION SYSTEM
20200082977 · 2020-03-12 · ·

A transformer includes a first coil disposed on a first surface, a second coil disposed on the first surface so as to surround the first coil, a third coil disposed on a second surface that is vertically adjacent to the first surface with an insulating layer, and a fourth coil disposed on the second surface so as to surround at least a part of the third coil, and when a current is caused to flow through the first coil, the first coil generates magnetic fluxes that pass through the first coil in opposite directions, and when the current is caused to flow through the first coil, the magnetic fluxes generated by the first coil pass through the first coil in opposite directions, and when a current is caused to flow through the second coil, the second coil generates magnetic fluxes that pass through the second coil in a single direction.

High isolation integrated inductor and method thereof

An inductor having a first coil of metal trace configured in an open loop topology and placed in a first metal layer; a second coil of metal trace configured in an open loop topology and placed in the first metal layer; and a third coil of metal trace configured in a closed loop topology and placed in a second metal layer, wherein: the first coil of metal trace is laid out to be substantially symmetrical with respect to a first axis, the second coil of metal trace is laid out to be approximately a mirror image of the first coil of metal trace with respect to a second axis, and the third coil of metal trace is laid out to enclose a majority portion of both the first coil of metal trace and the second coil of metal trace from a top view perspective.

Induction component

The invention proposes an induction component produced using thin film technology which can be used for a variety of functions. It contains, on a magnet core with a ring shape, two coil devices which, for their Part, are in turn constructed from at least two coils. The adjacent end windings of adjacent coils are connected to one another and to a common solder pad within each coil device. This makes it possible to connect individual coils and thus to utilize different functions of the induction component.

Induction component

The invention proposes an induction component produced using thin film technology which can be used for a variety of functions. It contains, on a magnet core with a ring shape, two coil devices which, for their Part, are in turn constructed from at least two coils. The adjacent end windings of adjacent coils are connected to one another and to a common solder pad within each coil device. This makes it possible to connect individual coils and thus to utilize different functions of the induction component.

TRANSFORMER, ELECTROMAGNETIC DEVICE AND MANUFACTURING METHOD OF THE TRANSFORMER
20190341182 · 2019-11-07 ·

A transformer, a method for manufacturing the same and an electromagnetic device are disclosed. The transformer includes a base plate, a magnetic core, transmission wire layers and conductive parts. The base plate includes a central part defining multiple inner via holes each running through the base plate and a peripheral part defining multiple outer via holes each running through the base plate. An annular accommodating groove is defined between the central pan and the peripheral part. The magnetic core is received in the accommodating groove. The transmission wire layers may be disposed respectively on two opposite sides of the base plate. Each of the transmission wire layers includes multiple wire patterns. Multiple conductive pails are respectively disposed in the inner via holes and the outer via holes.

TRANSFORMER, ELECTROMAGNETIC DEVICE AND MANUFACTURING METHOD OF THE TRANSFORMER
20190341182 · 2019-11-07 ·

A transformer, a method for manufacturing the same and an electromagnetic device are disclosed. The transformer includes a base plate, a magnetic core, transmission wire layers and conductive parts. The base plate includes a central part defining multiple inner via holes each running through the base plate and a peripheral part defining multiple outer via holes each running through the base plate. An annular accommodating groove is defined between the central pan and the peripheral part. The magnetic core is received in the accommodating groove. The transmission wire layers may be disposed respectively on two opposite sides of the base plate. Each of the transmission wire layers includes multiple wire patterns. Multiple conductive pails are respectively disposed in the inner via holes and the outer via holes.

COMMON MODE NOISE FILTER
20190333673 · 2019-10-31 ·

A common mode noise filter includes a laminated body including first to fourth insulating layers stacked on one another, first to fourth coil conductors spirally extending and disposed on upper surfaces of the first to fourth insulating layers, respectively, a first via-electrode connecting the first coil conductor to the second coil conductor, a second via-electrode connecting the third coil conductor to the fourth coil conductor, first and second connection parts connecting the first via-electrode to first and second inner ends of the first and second coil conductors, respectively, and third and fourth connection parts connecting the second via-electrode to third and fourth inner ends of the third and fourth coil conductors, respectively. The first connection part overlaps the second connection part when viewed from above. The third connection part overlaps the fourth connection part when viewed from above. The common mode noise filter is operable in high frequencies.

SEMICONDUCTOR DEVICE
20190305689 · 2019-10-03 ·

Provided is a semiconductor device that has a configuration provided with: a driving unit for driving an upper switching element and a lower switching element according to a control signal for controlling the driving of the upper switching element and the lower switching element, which are connected in series to constitute a bridge circuit; an insulating unit having an insulating transformer; and a package for sealing at least a part of the insulating unit and the driving unit. The insulating unit transmits a signal corresponding to the control signal to the driving unit side while insulating the signal.