H01F27/00

INTEGRATED CIRCUIT
20210375520 · 2021-12-02 ·

An integrated circuit includes a first coil and a second coil. The first coil is disposed on the first side of the integrated circuit. The second coil is disposed on the second side of the integrated circuit, and is partially overlapped with the first coil at a junction. The first coil is not interlaced with the second coil at the junction.

MULTILAYER LC FILTER
20220209736 · 2022-06-30 ·

A multilayer LC filter includes a multilayer body in which insulator layers, a ground electrode, capacitor electrodes, a planar electrode, and via electrodes includes open-side via electrodes connecting the capacitor electrodes and the planar electrode and short-circuit side via electrodes connecting the planar electrode and the ground electrode, an inductor is provided by a conductive path extending from the capacitor electrodes to the ground electrode through the open-side via electrodes, the planar electrode, and the short-circuit side via electrodes, a capacitor is provided by capacitance generated between the ground electrode and the capacitor electrodes, the inductor and the capacitor are connected in parallel to define LC resonators, and it is assumed that the short-circuit side via electrodes of all of the LC resonators in the multilayer body are made common.

ELECTRICAL SELF-INDUCTION TRANSFORMER
20220199318 · 2022-06-23 ·

The invention relates to a self-induction transformer which includes: At least two magnetic circuits (4 and 5) in connection, and at least three electrical windings (1, 2 and 3): The primary (1) which surrounds the free part of the first magnetic circuit. The secondary (2) which surrounds the linking part of the two magnetic circuits. The tertiary (3) which surrounds the free part of the second magnetic circuit

Inductor laid out on a multi-layer structure
11367560 · 2022-06-21 · ·

An inductor is laid out on a multi-layer structure, the inductor having a multi-turn coil including a plurality of metal traces laid out on at least two metal layers and a plurality of vias configured to provide inter-layer connection, wherein the multi-turn coil includes a first half configured to conduct a current flow between a first end and a center tap and a second half configured to conduct a current flow between a second end and the center tap; and an additional metal laid out on a metal layer below a lowest metal layer of the multi-turn coil, wherein the additional metal is laid out beneath the first half if the second half has a greater parasitic capacitance, or alternatively beneath the second half if the first half has a greater parasitic capacitance.

Valve with temperature compensation

A valve is provided having a circuit that includes an electrical conductor with a temperature-dependent electrical resistance. The electrical conductor is connected in series to an electrical series resistor, which includes a parallel circuit of a non-reactive wire and an NTC resistor. The electrical conductor includes a coil wire wound into a magnetic coil that is operable to move an armature to open or close the valve. The effect of the operation of the valve itself on the magnetic force of the coil is minimized by arranging the NTC resistor to be thermally coupled with the coil wire.

SEMICONDUCTOR DEVICE
20220173056 · 2022-06-02 ·

A semiconductor device has a semiconductor substrate, a first insulating layer, a first inductor, a second insulating layer, a second inductor, a pad and an annular wiring. The first insulating layer is formed on the semiconductor substrate. The first inductor is directly formed on the first insulating layer. The second insulating layer is formed on the first insulating layer such that the second insulating layer covers the first inductor. The second inductor is directly formed on the second insulating layer such that the second inductor faces the first inductor. The pad is directly formed on the second insulating layer. The pad is electrically connected with the second inductor. The annular wiring is electrically connected with the pad. The annular wiring is spaced apart from the second inductor. The annular wiring surrounds the second inductor without forming a vertex in plan view.

Inductance coil with varied geometry

An inductance communication coil, including a conductor having at least one conductive turn, wherein a width of the conductor is wider at a first location relative to that at a second location. The conductor can be made out of metal. In some embodiments, the first location and the second location are on the same turn. In some embodiments, the conductor includes a plurality of turns, wherein the first location is at a first turn and the second location is at a second turn.

Laminated electronic component and method for manufacturing laminated electronic component

Provided is a laminated electronic component in which defective formation is unlikely to cause in a shield conductor layer on a side surface of a laminate. The laminated electronic component includes a laminate 1, in which substrate layers 1a to 1i are laminated, having an outer surface including a first main surface 1B, a second main surface 1T, and a side surface 1S, internal electrodes (a ground electrode 2, coil electrodes 3, capacitor electrodes 4, and wiring electrodes 5), an external electrode 7, and a first plating layer 9 formed on a surface of the external electrode 7.

Planar solenoid inductors with antiferromagnetic pinned cores

A planar magnetic structure includes a closed loop structure having a plurality of core segments divided into at least two sets. A coil is formed about one or more core segments. A first antiferromagnetic layer is formed on a first set of core segments, and a second antiferromagnetic layer is formed on a second set of core segments. The first and second antiferromagnetic layers include different blocking temperatures and have an easy axis pinning a magnetic moment in two different directions, wherein when current flows through the coil, the magnetic moments rotate to form a closed magnetic loop in the closed loop structure.

Electronic unit

An electronic unit includes a first case made of metal; a second case made of metal; a frame made of synthetic resin arranged inside an assembly of the first case and the second case; a relay member made of metal that is separate from the frame and includes a first connection portion electrically connected to the first case, a second connection portion electrically connected to the second case, and a coupling portion coupling the first connection portion and the second connection portion; a first screw that passes through the first case and the first connection portion from the outside of the first case and is fixed to the frame; and a second screw that passes through the second case and the second connection portion from the outside of the second case and is fixed to the frame.