Exemplary embodiments of the present disclosure are directed to resonant transformers (or reactors) and coil arrangements associated with resonant transformers. The coil arrangements can include a grounding coil configured to generate a net-zero induced voltage between a first end of the grounding coil and a second end of the grounding coil layer, and one or more step-up coil layers formed by one or more layers of pressure tape, insulating materials, and wire wrapped to form coils about a portions of a split magnetic core. The split magnetic core can include a first core segment and a second core segment, where one of the core segments is disposed within a main housing and one of the core segments is disposed external to the main housing. A gap between the first and second core segments can be manipulated to control an inductance of the resonant transformer.

Exemplary embodiments of the present disclosure are directed to resonant transformers (or reactors) and coil arrangements associated with resonant transformers. The coil arrangements can include a grounding coil configured to generate a net-zero induced voltage between a first end of the grounding coil and a second end of the grounding coil layer, and one or more step-up coil layers formed by one or more layers of pressure tape, insulating materials, and wire wrapped to form coils about a portions of a split magnetic core. The split magnetic core can include a first core segment and a second core segment, where one of the core segments is disposed within a main housing and one of the core segments is disposed external to the main housing. A gap between the first and second core segments can be manipulated to control an inductance of the resonant transformer.

A chip component includes a chip component main body, an electrode pad formed on a top surface of the main body, a protective film covering the top surface of the main body and having a contact hole exposing the pad, and an external connection electrode electrically connected to the pad via the hole and having a protruding portion, which, in a plan view looking from a direction perpendicular to a top surface of the pad, extends to a top surface of the film and protrudes further outward than a region of contact with the pad over the full periphery of an edge portion of the hole. A method for manufacturing the component includes forming the pad on the main body's top surface, forming the protective film, forming the hole in the film so as to expose the pad, and forming the electrode electrically connected to the pad via the hole.

Exemplary embodiments of the present disclosure are directed to resonant transformers (or reactors) and coil arrangements associated with resonant transformers. The coil arrangements can include a grounding coil configured to generate a net-zero induced voltage between a first end of the grounding coil and a second end of the grounding coil layer, and one or more step-up coil layers formed by one or more layers of pressure tape, insulating materials, and wire wrapped to form coils about a portions of a split magnetic core. The split magnetic core can include a first core segment and a second core segment, where one of the core segments is disposed within a main housing and one of the core segments is disposed external to the main housing. A gap between the first and second core segments can be manipulated to control an inductance of the resonant transformer.

Exemplary embodiments of the present disclosure are directed to resonant transformers (or reactors) and coil arrangements associated with resonant transformers. The coil arrangements can include a grounding coil configured to generate a net-zero induced voltage between a first end of the grounding coil and a second end of the grounding coil layer, and one or more step-up coil layers formed by one or more layers of pressure tape, insulating materials, and wire wrapped to form coils about a portions of a split magnetic core. The split magnetic core can include a first core segment and a second core segment, where one of the core segments is disposed within a main housing and one of the core segments is disposed external to the main housing. A gap between the first and second core segments can be manipulated to control an inductance of the resonant transformer.

A current limiting device including a transformer including an element made from a magnetothermal material, a primary conductor, and a secondary winding. Heat is generated by the current flowing through the primary conductor and when the current exceeds a certain threshold it modifies the coupling coefficient of the transformer, which makes it possible to limit the current in the primary conductor.

A current limiting device including a transformer including an element made from a magnetothermal material, a primary conductor, and a secondary winding. Heat is generated by the current flowing through the primary conductor and when the current exceeds a certain threshold it modifies the coupling coefficient of the transformer, which makes it possible to limit the current in the primary conductor.

A chip component includes a substrate, an element circuit network including a plurality of element parts formed on the substrate, an external connection electrode provided on a surface of the substrate to provide external connection for the element circuit network, a plurality of fuses formed on the substrate and disconnectably connecting each of the plurality of element parts to the external connection electrode, a solder layer formed on an external connection terminal of the external connection electrode and a resin film which covers the surface of the substrate and other surface which intersects the surface of the substrate.

A chip component includes a substrate, an element circuit network including a plurality of element parts formed on the substrate, an external connection electrode provided on a surface of the substrate to provide external connection for the element circuit network, a plurality of fuses formed on the substrate and disconnectably connecting each of the plurality of element parts to the external connection electrode, a solder layer formed on an external connection terminal of the external connection electrode and a resin film which covers the surface of the substrate and other surface which intersects the surface of the substrate.

A composite electronic component may include: a composite body including a capacitor and an inductor coupled to each other, the capacitor having a ceramic body in which dielectric layers and internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor having a magnetic body in which magnetic layers having conductive patterns are stacked; an input terminal disposed on a first end surface of the composite body; an output terminal including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on any one or more of upper and lower surfaces and a second side surface of the capacitor; and a ground terminal disposed on any one or more of the upper and lower surfaces and a first side surface of the capacitor and connected to the internal electrodes.