Provided is a wound core formed by laminating a plurality of bent bodies obtained by forming a coated grain-oriented electrical steel sheet in which a coating is formed on at least one surface of a grain-oriented electrical steel sheet so that the coating is on an outside, in a sheet thickness direction, in which the bent body has a bent region obtained by bending the coated grain-oriented electrical steel sheet and a flat region adjacent to the bent region, the number of deformation twins present in the bent region in a side view is five or less per 1 mm of a length of a center line in the sheet thickness direction in the bent region, and when a region extending 40 times a sheet thickness to both sides in a circumferential direction from a center of the bent region on an outer circumferential surface of the bent body is defined as a strain affected region, a proportion of an area where the coating is not damaged at any position along the circumferential direction in a flat region within the strain affected region is 90% or more.

A circuit board is provided, including: a core board, defining a plurality of slots, the plurality of slots including a plurality of first sub-slots and a plurality of second sub-slots disposed beneath the first sub-slots. Each of the second sub-slots is located beneath a corresponding first sub-slot of the first sub-slots; and a plurality of chip assemblies, arranged in the slots and including a plurality of first chips located in the first sub-slots and a plurality of second chips located in the second sub-slots. Each of the first chips is connected in series with one of the second chips at a corresponding position to form a plurality of chipsets; the chipsets are connected in parallel with each other; an end of the chipsets is connected to a first power signal layer, and the other end of the plurality of chipsets is connected to a ground layer.

A new and improved method for producing grain-oriented electrical steel sheet enabling production of grain-oriented electrical steel sheet realizing high magnetic flux density and excellent in magnetic characteristics, that is, as one aspect, a method for producing grain-oriented electrical steel sheet comprising a hot rolling process, cold rolling process, primary recrystallization annealing process, finish annealing process, and flattening annealing process, wherein shot blasting treatment and/or leveling treatment and treatment for contact with a solution are performed, the solution contains Cu etc. in a predetermined amount, the pH is −1.5 or more and less than 7, a solution temperature is 15° C. or more and 100° C. or less, and the time during which the steel sheet is dipped in the solution is 5 seconds or more and 200 seconds or less.

A new and improved method for producing grain-oriented electrical steel sheet enabling production of grain-oriented electrical steel sheet realizing high magnetic flux density and excellent in magnetic characteristics, that is, as one aspect, a method for producing grain-oriented electrical steel sheet comprising a hot rolling process, cold rolling process, primary recrystallization annealing process, finish annealing process, and flattening annealing process, wherein shot blasting treatment and/or leveling treatment and treatment for contact with a solution are performed, the solution contains Cu etc. in a predetermined amount, the pH is −1.5 or more and less than 7, a solution temperature is 15° C. or more and 100° C. or less, and the time during which the steel sheet is dipped in the solution is 5 seconds or more and 200 seconds or less.

A module includes a substrate including a first main surface, a first component mounted on the first main surface, a first sealing resin including a first upper surface, the first component being sealed with the first sealing resin, a first shield film that covers at least a part of the first upper surface of the first sealing resin, and a second shield film that covers a side surface of the first sealing resin and a side surface of the substrate. A step portion lower than the first upper surface of the first sealing resin is provided on an outer periphery of the first sealing resin. The first shield film and the second shield film are electrically connected to each other on a side surface below the step portion.

An electrical induction device includes a housing and a contact arrangement in the housing of the electrical induction device for electrically contacting an electrical conductor. The contact arrangement includes a conductor tube, a receiver contact which is fastened to the conductor tube and configured to receive and electrically connect with the electrical conductor, and a resilient suspension arrangement fastened to the housing and connected to an outside of the conductor tube such that the receiver contact is resiliently movable in a plane which is parallel to a cross section of the conductor tube while being substantially immovable in an axial direction of the conductor tube.

In a method for producing a system for inductively transmitting energy to a mobile part, and a device for performing the method: a stepped bore is introduced into a floor; a sealing element is introduced into the stepped bore; a ring frame is held in place in the stepped bore with the aid of an alignment unit supported on the surface of the floor, the upper edge of the ring frame in particular being aligned with the height of the floor or with the surface of a floor covering applied to the floor, i.e. the upper edge in particular being brought to the same height position as the surface of the floor or the floor covering; the ring frame is set apart from the floor so that a gap region exists between the ring frame and the floor; casting compound is filled into the gap region; the alignment unit is removed; and a primary part is accommodated in the ring frame, in particular connected with the aid of screws.

A coil assembly including a plurality of substantially planar plates interconnected to define a plurality of electrically conductive windings for surrounding a magnetic core. In one example the invention is used for a magnetic core assembly, including a magnetic core and at least two coil assemblies, the coil assemblies each including a plurality of substantially planar plates interconnected to define a plurality of electrically conductive windings for surrounding the magnetic core.

The invention, which relates to the technical field of circuit boards, specifically discloses a method for manufacturing an embedded circuit board, an embedded circuit board, and an application thereof. The method includes: providing a substrate, wherein an electronic component is embedded in the substrate, a pad is arranged on a side surface of the electronic component, and an end surface of the pad is flush with a same side surface of the substrate; forming a metallic layer on a side surface of the substrate adjacent to the pad by sputtering, evaporation, electroplating or chemical vapor deposition; and patterning the metallic layer to obtain a circuit board covered with the metallic layer on the pad, wherein the metallic layer on the pad protrudes beyond the same side surface of the substrate.

A manufacturing method for an electronic component includes: a step of forming an insulating layer on an outer electrode body so as to cover the outer electrode body, the outer electrode body being formed on a chip element which forms the electronic component; and a step of removing the insulating layer in a predetermined region of the outer electrode body by applying laser light to the insulating layer in the predetermined region so as to expose the predetermined region. The insulating layer has a higher absorption coefficient for the laser light than a material forming a surface of the outer electrode body.