The present disclosure relates to the technical field of circuit boards, and provides an embedded circuit board and a method for manufacturing the embedded circuit board. The embedded circuit board includes: a first outer wiring board, a base board, and a second outer wiring board. The base board has at least one groove, the first outer wiring board, the base board and the second outer wiring board define through holes to form a resonant chamber. A minimal distance between the side walls of the groove and the side walls of the adjacent through holes is 50 um-400 um. An electronic device is received in the groove.

A semiconductor package substrate with embedded passive devices and methods of forming the same is provided. Embedded passive devices include inductors and inductor modules and methods of forming the same are provided. Embedded inductors may be formed by deposition of magnetic core material, trenching of one or more channels, and placement of conductive wires to form an module embeddable in the semiconductor package substrate core. Provided are methods and apparatus for formation of embeddable pot-core, toroidal, and helical inductors.

A winding apparatus, includes a winding core, a wire rod being wound on the winding core; a pair of flyers arranged across the winding core in an axial direction; flyer rotation means for rotating either one or both of the pair of flyers; wire storage tools respectively detachably provided on the pair of flyers, the wire rod to be wound on the winding core being stored on the wire storage tools; and tension devices respectively provided on the pair of flyers, the tension devices applying a tension to the wire rod fed from the wire storage tools and introduced to the winding core.

A magnetic-induced stiffness changed soft robot drive module includes magnetic-induced stiffness changed layer, two-degree-of-freedom pneumatic driver, magnetic core and sealing fixing device. The magnetic-induced stiffness changed layer and two-degree-of-freedom pneumatic driver are printed and formed. The magnetic core can be deformed together with the driver, and a magnetic field can be generated when it is energized. After the magnetic core is installed into the two-degree-of-freedom pneumatic driver, then assembled with the sealing fixing device, a soft robot drive module with one end fixed is finished. The magnetic-induced stiffness changed layer has the fast, reversible and controllable stiffness adjustment ability under the action of electromagnetic field. As its hardness is greater than that of the two-degree-of-freedom pneumatic driver and its position is outside the air cavity, the two-degree-of-freedom pneumatic driver can be restricted from over-expansion and over-extension in the axial direction, making its pneumatic bending deformation controllable.

A circuit board is provided, including: a core board, defining a plurality of slots, the plurality of slots including a plurality of first sub-slots and a plurality of second sub-slots disposed beneath the first sub-slots. Each of the second sub-slots is located beneath a corresponding first sub-slot of the first sub-slots; and a plurality of chip assemblies, arranged in the slots and including a plurality of first chips located in the first sub-slots and a plurality of second chips located in the second sub-slots. Each of the first chips is connected in series with one of the second chips at a corresponding position to form a plurality of chipsets; the chipsets are connected in parallel with each other; an end of the chipsets is connected to a first power signal layer, and the other end of the plurality of chipsets is connected to a ground layer.

The present disclosure relates to the technical field of circuit boards, and provides an embedded circuit board and a method for manufacturing the embedded circuit board. The embedded circuit board includes: a first outer wiring board, a base board, and a second outer wiring board. The base board has at least one groove, the first outer wiring board, the base board and the second outer wiring board define through holes to form a resonant chamber. A minimal distance between the side walls of the groove and the side walls of the adjacent through holes is 50 um-400 um. An electronic device is received in the groove.

The invention, which relates to the technical field of inductance embedding, specifically discloses an embedded circuit board. The embedded circuit board includes: at least layer of sub-body, where preset positions of the sub-bodies are provided with through slots; and an inductance element embedded within the slots and configured to be spaced apart from sidewalls of the slots. In the above manner, it is possible to make the embedded circuit board of the present application structurally compact, highly integrated, widely applicable, and safe and reliable.

The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.

A manufacturing method of a coil component including the steps of: holding a plurality of semi-finished products, each of which includes a base and a coil before forming the coil component, with a jig having a holding portion; setting the plurality of semi-finished products held by the jig to the setting positions of the jig in a mold; and sealing at least a portion within the base and the coil with resin by filling the resin into a cavity of the mold.

A mold apparatus is provided for manufacturing a coil component. The mold apparatus includes a support plate, a die on the support plate, a lid, and a press member that presses the lid toward the support plate. The die has a peripheral side wall defining an opening opposite the support plate. The coil component is placeable in an inner space of the die interior of the side wall. The lid is insertable via the opening into the inner space with an outer peripheral edge of the lid slidably received by the side wall of the die.