A submodule according to the present invention includes a power pack including a plurality of switching modules, first and second input busbars connected to the plurality of switching modules and protruding to a first outer side of the power pack, first and second connection busbars connected to the plurality of switching modules and protruding to a second outer side of the power pack, a capacitor pack including a capacitor element, and first and second connection units provided at both sides of one surface of the capacitor pack. The first and second connection busbars are inserted into the first and second connection units, respectively, such that the power pack and the capacitor pack are electrically connected to each other.

A submodule according to the present invention includes a power pack including a plurality of switching modules, first and second input busbars connected to the plurality of switching modules and protruding to a first outer side of the power pack, first and second connection busbars connected to the plurality of switching modules and protruding to a second outer side of the power pack, a capacitor pack including a capacitor element, and first and second connection units provided at both sides of one surface of the capacitor pack. The first and second connection busbars are inserted into the first and second connection units, respectively, such that the power pack and the capacitor pack are electrically connected to each other.

A circuit for 3D ultrasound imaging systems includes multiple sensor units, multiple unit circuits and multiple row sharing circuits. The unit circuits are connected with the sensor units respectively. Each row of unit circuits share a row sharing circuit. Each unit circuit includes a first electrically controlled switch, a second electrically controlled switch and a control circuit. Each row sharing circuit includes a signal transmission bus, a signal receiving bus and a row main control circuit. The signal transmission bus and the signal receiving bus of each row sharing circuit extend through a corresponding row of unit circuits. The row main control circuit of each row is configured to transmit main control signals, transmission control signals and receiving control signals to a corresponding row of unit circuits so as to select the corresponding sensor units to transmit or receive ultrasound signals.

A switch includes a first electrode layer, a second electrode layer disposed over the first electrode layer, and a selecting element layer interposed between the first electrode layer and the second electrode layer. The selecting element layer includes a gas region in which a current flows or does not flow according to a voltage applied to the switch. When the current flows, the switch is in an on-state, and, when the current does not flow, the switch is in an off-state.

A switch includes a first electrode layer, a second electrode layer disposed over the first electrode layer, and a selecting element layer interposed between the first electrode layer and the second electrode layer. The selecting element layer includes a gas region in which a current flows or does not flow according to a voltage applied to the switch. When the current flows, the switch is in an on-state, and, when the current does not flow, the switch is in an off-state.

A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes disposed to face each other while having each of the dielectric layers interposed therebetween; and external electrodes including a connection portion disposed on end surfaces of the body opposing each other and band portions extending onto portions of upper and lower surfaces of the body from the connection portion, wherein the external electrodes include electrode layers connected to the plurality of internal electrodes, conductive resin layers disposed on the electrode layers, Ni plating layers disposed on the conductive resin layers, and Sn plating layers disposed on the Ni plating layers, and tc1 is 0.5 m or more and tc2/tc1 is 1.2 or less, in which a thickness of the Ni plating layer in the connection portion is tc1 and a thickness of the Ni plating layer in the band portion is tc2.

A protective layer including glass may be disposed between an end of a first electrode layer in contact with one end of an internal electrode and a body thereby blocking a penetration path of external moisture, a plating solution, and hydrogen to improve the moisture resistance reliability of a multilayer electronic component.

A protective layer including glass may be disposed between an end of a first electrode layer in contact with one end of an internal electrode and a body thereby blocking a penetration path of external moisture, a plating solution, and hydrogen to improve the moisture resistance reliability of a multilayer electronic component.

The invention relates to a contact part (20) for electrically connecting end-face contact layers on the end faces of a plastic film capacitor winding (10) of an encased electric single-phase or three-phase capacitor to a terminal wire (18, 34) or a connecting wire, comprising a preferably flat contact support with a terminal region for contacting a terminal wire (18, 34) or a connecting wire; comprising at least one contact piece (26) with at least one contact tip, said contact piece (26) extending upwards or downwards from the contact support in a substantially vertical manner, in order to establish an electric connection to an end-face contact layer (12, 14) by pressing the contact tip into said end-face contact layer (12, 14); and comprising a penetration depth-limiting device for limiting the penetration depth of the contact tip or the contact tips in the end-face contact layer (12, 14). The invention also relates to encased single-phase and three-phase capacitors comprising said contact part.

The invention relates to a contact part (20) for electrically connecting end-face contact layers on the end faces of a plastic film capacitor winding (10) of an encased electric single-phase or three-phase capacitor to a terminal wire (18, 34) or a connecting wire, comprising a preferably flat contact support with a terminal region for contacting a terminal wire (18, 34) or a connecting wire; comprising at least one contact piece (26) with at least one contact tip, said contact piece (26) extending upwards or downwards from the contact support in a substantially vertical manner, in order to establish an electric connection to an end-face contact layer (12, 14) by pressing the contact tip into said end-face contact layer (12, 14); and comprising a penetration depth-limiting device for limiting the penetration depth of the contact tip or the contact tips in the end-face contact layer (12, 14). The invention also relates to encased single-phase and three-phase capacitors comprising said contact part.