A biaxially stretched polypropylene film for a capacitor containing an isotactic polypropylene. The weight average molecular weight (Mw) of the isotactic polypropylene as measured by gel permeation chromatography (GPC) is 250,000 to 450,000, the molecular weight distribution Mw/Mn is 7 to 12 and Mz/Mn is 20 to 40, and the value of a difference obtained by subtracting a differential distribution value when the logarithmic molecular weight Log(M)=6 from a differential distribution value when Log(M)=4.5 on a molecular weight distribution curve thereof is 8% to 20%. The ultrathin biaxially stretched polypropylene film for a capacitor has superior heat resistance performance and withstands voltage performance.

A biaxially stretched polypropylene film for a capacitor containing an isotactic polypropylene. The weight average molecular weight (Mw) of the isotactic polypropylene as measured by gel permeation chromatography (GPC) is 250,000 to 450,000, the molecular weight distribution Mw/Mn is 7 to 12 and Mz/Mn is 20 to 40, and the value of a difference obtained by subtracting a differential distribution value when the logarithmic molecular weight Log(M)=6 from a differential distribution value when Log(M)=4.5 on a molecular weight distribution curve thereof is 8% to 20%. The ultrathin biaxially stretched polypropylene film for a capacitor has superior heat resistance performance and withstands voltage performance.

A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces, and an additional pattern spaced apart from the internal electrodes may be disposed in at least one of a region between the internal electrodes and the fifth surface or a region between the internal electrodes and the sixth surface.

A multilayer electronic component according to an example embodiment of the present disclosure may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer in a first direction, and including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces; and external electrodes disposed on the third and fourth surfaces, and an additional pattern spaced apart from the internal electrodes may be disposed in at least one of a region between the internal electrodes and the fifth surface or a region between the internal electrodes and the sixth surface.

A valve metal powder having a particle shape factor mean value f, as determined by SEM image analysis, of 0.65f1, said powder has an average agglomerate particle size D50 value, as determined with a MasterSizer in accordance with ASTM B 822, of 40 to 200 m and wherein the valve metal powder is niobium.

A valve metal powder having a particle shape factor mean value f, as determined by SEM image analysis, of 0.65f1, said powder has an average agglomerate particle size D50 value, as determined with a MasterSizer in accordance with ASTM B 822, of 40 to 200 m and wherein the valve metal powder is niobium.

The application relates to the field of quantum computing, and discloses a qubit capacitor and a quantum chip, the qubit capacitor including: a first metal plate, a second metal plate, and a Josephson junction; wherein a first end of the Josephson junction is connected with the first metal plate, and a second end of the Josephson junction is connected with the second metal plate; a sub-metal sheet is arranged on the first metal plate and/or the second metal plate; and the length of the sub-metal sheet is smaller than that of the first metal plate and the second metal plate.

The application relates to the field of quantum computing, and discloses a qubit capacitor and a quantum chip, the qubit capacitor including: a first metal plate, a second metal plate, and a Josephson junction; wherein a first end of the Josephson junction is connected with the first metal plate, and a second end of the Josephson junction is connected with the second metal plate; a sub-metal sheet is arranged on the first metal plate and/or the second metal plate; and the length of the sub-metal sheet is smaller than that of the first metal plate and the second metal plate.

A method of determining a lifetime parameter of a capacitor in a failsafe device includes measuring an amount of energy required to return the failsafe device to a failsafe position, measuring an effective capacitance of the capacitor, and comparing the amount of energy to the effective capacitance to determine the lifetime parameter of the capacitor.

An electronic component includes a component main body, an external electrode, and a protective member. The component main body has a lower surface. The external electrode includes a base layer. The base layer is in contact with the lower surface. The protective member is in contact with the lower surface and the base layer, is along an external edge of the base layer so as to surround the base layer, and does not project in a down direction below the lower surface.