Patent classifications
H01G13/00
MULTILAYER CHIP COMPONENT
In a multilayer chip component according to an aspect of the present disclosure, dots of a two-dimensional code provided on a main surface of an element body has a semicircular cross-sectional shape. That is, since substantially no corner portions are present in a cross-sectional shape of the dots, stress is unlikely to remain when the dots are formed, and stress is unlikely to be concentrated after the dots are formed. Therefore, cracking is unlikely to occur in the foregoing multilayer chip component.
FORK STRUCTURE FOR POSITIVE RETENTION AND CENTERING A WIRE FOR ELECTRICAL CONNECTION
An electronic device includes a fork structure having a pair of arms disposed in spaced relation and defining an open-ended channel therebetween. A surface of channel defines a seat opposite the open end. The channel has a width W.sub.1 at its narrowest section. A rigid wire of an electrical component is disposed in the channel generally adjacent to the seat. The wire has a width W.sub.2 that is greater than the width W.sub.1 so surfaces of the channel at the narrowest section defined by width W.sub.1 interfere with the wire, preventing the wire from moving towards the open end of the channel. The pair of arms are constructed and arranged to be moved toward each other so as to crimp the wire to the fork structure.
Structural Lead Frame
Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.
Structural Lead Frame
Provided is an improved electronic component package. The electronic component package comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination and a second external termination. The electronic component package also includes a structural lead frame comprising multiple leads wherein each lead is mounted to at least one first external termination and the structural lead frame comprises at least one break away feature between adjacent leads.
MULTI-LAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF PRODUCING THE SAME
A multi-layer ceramic electronic component includes a ceramic body and an external electrode. The ceramic body includes a first side surface facing in a direction of a first axis, a second side surface facing in a direction of a second axis orthogonal to the first axis, a ridge that connects the first side surface and the second side surface to each other, and internal electrodes laminated along a third axis orthogonal to the first axis and the second axis and led out in a lead-out region. The external electrode includes a protrusion provided at a position along the ridge and protruding in the directions of the first axis and the second axis, and a first base portion and a second base portion extending from the protrusion along the first side surface and the second side surface, respectively, the external electrode covering the lead-out region.
Ceramic electronic device and manufacturing method of ceramic electronic device
A ceramic electronic device includes: a ceramic main body having a parallelepiped shape in which edges of first internal electrode layers are led out to a first edge face and edges of second internal electrode layer are led out to a second edge face facing the first edge face; and external electrodes respectively formed on the first edge face and the second edge face and extending to at least one side face of the ceramic main body, wherein a distance in a length direction between first conductive layers of the respective external electrodes on the at least one side face is shorter between locations corresponding to corner portions of the ceramic main body, respectively, than between center portions of the first conductive layers of the respective external electrodes in a width direction orthogonal to the length direction on the at least one side face.
ANALYSIS PROCESSING METHOD USING IMPEDANCE SPECTRUM DATA, IMPEDANCE SPECTRUM DATA ANALYSIS PROCESSING SYSTEM, AND IMPEDANCE SPECTRAL ANALYSIS PROCESSING PROGRAM
This method for analysis processing by using measured impedance spectrum data includes: a step for determining whether to reset the maximum value and/or the minimum value of logarithmic relaxation time corresponding to a measured logarithmic frequency on the basis of the measured impedance spectrum data; a step for setting the number of equal-interval divisions within the range of the logarithmic relaxation time set in the determination step; and a step for analyzing parameters R∞, T, L, and Rl for the range of the set logarithmic relaxation time so as to satisfy a prescribed expression (A) by applying a regularized least-squares method.
CAPACITOR LIFESPAN ESTIMATION METHOD, LIFESPAN ESTIMATION PROGRAM THEREOF, INFORMATION PROCESSING DEVICE, AND CAPACITOR
A method includes processes of (a processing part 8) calculating an estimated heat generation temperature by using drive conditions (22, a storage part 6) at least including drive timing information (18) and drive current value information (20), and temperature change characteristic information (24) of a capacitor, calculating state change information (28) of the capacitor after elapse of a reference time by using the estimated heat generation temperature, and calculating a lifespan estimation value (lifespan estimation result 30) of the capacitor by using the state change information. This enables capacitor lifespan estimation corresponding to fluctuations of a drive current value flowing through the capacitor, the applicability of the capacitor is confirmed, and the safety of equipment using the capacitor is improved.
Electrolytic Capacitor Components and Manufacturing Methods
The invention relates to methods for manufacturing an energy storage of an electrolytic capacitor, to a method for manufacturing a foil electrode of an aluminum electrolytic capacitor, to a device for manipulating a component of an aluminum electrolytic capacitor, to specifically designed foil electrodes for an aluminum electrolytic capacitor, to a method and a device for analyzing a quality of a section of paper to be used as separator of an electrolytic capacitor, and to a specifically designed electrolytic capacitor.
AN ELECTROCHEMICAL CELL AND METHOD OF MAKING THE SAME
This invention relates to an electrochemical cell comprising an anode structure comprising an element selected from the group consisting of group 1, group 2, group 8, group 12 and group 13 of the Periodic Table of Elements; a cathode structure comprising a catalyst; and a hydrogel located between the anode structure and the cathode structure. In a preferred embodiment, the cell comprises the anode of Zinc, the catalyst of CoOx/C, the hydrogel of free-standing alkaline polyacrylamide hydrogel, wherein said hydrogel was first synthesized via UV-initiated radical polymerization of acrylamides, followed by exchange of water with an alkaline electrolyte of potassium hydroxide (KOH). The invention further relates to a method of manufacturing such an electrochemical cell and the use of a hydrogel in a metal/air battery.