A film for manufacturing an electronic component includes: a polymer layer; and metal nanowires dispersed in the polymer layer. The polymer layer may include a polyester-based compound such as polyethylene terephthalate. The metal nanowire may include a ferromagnetic metal such as at least one of nickel (Ni), cobalt (Co), and iron (Fe), or alloys thereof.

A film for manufacturing an electronic component includes: a polymer layer; and metal nanowires dispersed in the polymer layer. The polymer layer may include a polyester-based compound such as polyethylene terephthalate. The metal nanowire may include a ferromagnetic metal such as at least one of nickel (Ni), cobalt (Co), and iron (Fe), or alloys thereof.

A method for manufacturing a ceramic electronic component includes: forming a ceramic laminate by stacking ceramic green sheets on which internal electrode patterns are formed; obtaining an image of an upper portion of the ceramic laminate; determining cutting regions based on the image; and cutting the ceramic laminate by irradiating the cutting regions with a laser.

A method of manufacturing a multilayer electronic component includes forming a ceramic laminate in which a plurality of ceramic green sheets and a plurality of internal electrode patterns are stacked in a first direction; cutting the ceramic laminate into individual multilayer chips, by irradiating a laser onto one surface of the ceramic laminate and irradiating a laser onto the other surface opposing the one surface of the ceramic laminate in the first direction; firing one of the multilayer chips so as to form a ceramic body including an internal electrode and a dielectric layer; and forming external electrodes on a first side and a second side of the ceramic body.

A method for manufacturing a multilayer ceramic electronic component includes: forming a pair of side margin portions on side surfaces of each of a plurality of unfired laminates, respectively, by thermocompression bonding a ceramic sheet containing 10% by mass or more of a binder resin to one of the side surfaces of the laminate for forming each of the side margin portions, performing a first heat treatment on the plurality of laminates having the pair of side margin portions formed thereon in a first condition so as to remove a portion of the binder resin contained in the side margin portions; and thereafter, performing a second heat treatment on the plurality of laminates having the pair of side margin portions formed thereon in a second condition that is different from the first condition so as to remove a remaining binder resin from the side margin portions.

A ceramic electronic component includes a multilayer chip having a rectangular parallelepiped shape and including dielectric layers and internal electrode layers alternately stacked, the dielectric layers being mainly composed of ceramic, the internal electrode layers being alternately exposed to two edge faces of the multilayer chip opposite to each other, and external electrodes respectively formed on the two edge faces, wherein an average crystal grain size of the ceramic in a cross section is 200 nm or less in a dielectric portion, and a CV value of a grain size distribution of crystal grains of the ceramic in the cross section is less than 38% in the dielectric portion, the dielectric portion being defined as a region made of the ceramic in the multilayer chip that is in contact with one of the external electrodes and that has a width of 5 μm from said one of the external electrodes.

A capacitor detection system and a passive-type pin-diverging module thereof are disclosed. The passive-type pin-diverging module is applied to two conductive pins of a capacitor, including a base structure and a rotatable structure. The rotatable structure is rotatably disposed on the base structure, and the rotatable structure has a curved surface. The two conductive pins of the capacitor respectively pass through two through holes of a seat board, each conductive pin has a lateral contact surface, the two lateral contact surfaces concurrently slidably contact the curved surface so as to diverge the two conductive pins, and the seat board is held by the two diverged conductive pins so as to prevent the seat board from being separated from the capacitor. The friction resistance between the conductive pin and the rotatable structure is decreased due to the sliding contact between the lateral contact surface and the curved surface.

A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a plurality of internal electrodes disposed inside the ceramic body and each exposed to first and second surfaces of the ceramic body and to one of the third and fourth surfaces, and a first side margin portion and a second side margin portion disposed on sides of the plurality of internal electrodes exposed to the first and second surfaces. The ceramic body includes an active portion including the plurality of internal electrodes disposed to overlap each other with the dielectric layer interposed therebetween to form capacitance, an upper cover portion disposed above the active portion, and a lower cover portion disposed below the active portion. The first and second side margin portions have a dielectric composition different from a dielectric composition of one of the upper cover portion and the lower cover portion.

A multilayer ceramic capacitor includes a ceramic body including a dielectric layer, a plurality of internal electrodes disposed inside the ceramic body and each exposed to first and second surfaces of the ceramic body and to one of the third and fourth surfaces, and a first side margin portion and a second side margin portion disposed on sides of the plurality of internal electrodes exposed to the first and second surfaces. The ceramic body includes an active portion including the plurality of internal electrodes disposed to overlap each other with the dielectric layer interposed therebetween to form capacitance, an upper cover portion disposed above the active portion, and a lower cover portion disposed below the active portion. The first and second side margin portions have a dielectric composition different from a dielectric composition of one of the upper cover portion and the lower cover portion.

A ceramic electronic component includes a multilayer structure having a substantially rectangular parallelepiped shape and including dielectric layers and internal electrode layers that are alternately stacked, the dielectric layers being mainly composed of ceramic, the internal electrode layers being alternately exposed to two edge faces of the multilayer structure opposite to each other, wherein x/y is 0.143 or less where x represents an average concentration of hydrogen in ppm in a capacitance section where the internal electrode layers exposed to one of the two edge faces and the internal electrode layers exposed to the other of the two edge faces are opposed to each other, as measured by secondary ion mass spectrometry (SIMS), and y represents an average concentration of titanium in ppm in the capacitance section, as measured by SIMS at the same time of measuring the average concentration of hydrogen.