A fall impact reducing apparatus for reducing an impact on a falling chip component includes a wire assembly which is formed by stacking a plurality of wire jigs. The wire jig includes a plurality of wires arranged parallel to each other at intervals which allows the chip component C to pass through the wire jig, and the wire jig is formed of an integral body by working a base material having a predetermined thickness, the integral body constituted of a pair of frame portions and the plurality of wires extending parallel to each other between the frame portions. When the chip component is made to fall on the wire assembly, the chip component collides with the wire of any one of wire jigs.

A fall impact reducing apparatus for reducing an impact on a falling chip component includes a wire assembly which is formed by stacking a plurality of wire jigs. The wire jig includes a plurality of wires arranged parallel to each other at intervals which allows the chip component C to pass through the wire jig, and the wire jig is formed of an integral body by working a base material having a predetermined thickness, the integral body constituted of a pair of frame portions and the plurality of wires extending parallel to each other between the frame portions. When the chip component is made to fall on the wire assembly, the chip component collides with the wire of any one of wire jigs.

A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, and first to sixth surfaces, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface; first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body; first and second external electrodes; a first step-compensating portion disposed on a margin portion in a width direction on the second dielectric layer on which the second internal electrode is formed on the first internal electrode; and a second step-compensating portion disposed on another margin portion in the width direction on the first dielectric layer on which the first internal electrode is disposed on the second internal electrode.

A multilayer capacitor and a board having the same mounted thereon are provided. The multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, and first to sixth surfaces, the first internal electrode being exposed through the third surface and the fifth surface and the second internal electrode being exposed through the fourth surface and the sixth surface; first and second side portions disposed on the fifth and sixth surfaces, respectively, of the capacitor body; first and second external electrodes; a first step-compensating portion disposed on a margin portion in a width direction on the second dielectric layer on which the second internal electrode is formed on the first internal electrode; and a second step-compensating portion disposed on another margin portion in the width direction on the first dielectric layer on which the first internal electrode is disposed on the second internal electrode.

A ceramic body is prepared that includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode is led to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer containing a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A heating step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that contains the first and second metal components and a metal contained in the inner electrode.

A ceramic electronic device includes: a ceramic main body that has internal electrode layers inside thereof and has a parallelepiped shape in which a part of one of the internal electrode layers is extracted to a first edge face of the parallelepiped shape and a part of another internal electrode layer is extracted to a second edge face of the parallelepiped shape facing the first edge face; external electrodes that are respectively formed on the first edge face and the second edge face and extend to at least one of side faces of the ceramic main body, wherein an interval between side edge portions of the external electrodes on the at least one of side faces is shorter than center portions of the external electrodes on the at least one of side faces.

An electrode manufacturing apparatus dopes an active material in a strip-shaped electrode precursor having a layer including the active material with alkali metal. The electrode manufacturing apparatus includes a doping bath configured to store a solution including alkali metal ions; a conveyor unit configured to convey the electrode precursor along a path passing through the doping bath; a counter electrode unit housed in the doping bath and comprising a conductive base material and an alkali metal-containing plate arranged on the conductive base material; and a connection unit configured to electrically connect the electrode precursor and the counter electrode unit. A distance between the alkali metal-containing plate and the electrode precursor becomes greater as a measurement position of the distance becomes closer to a connection position in which the electrode precursor and the connection unit connect each other.

A textile pressure sensor for the capacitive measuring of a pressure distribution of objects of any shape, in particular body parts, on a surface is proposed, having a first structure (30a) which is conductive at least in regions and a second structure (30b) which is conductive at least in regions, wherein the first and the second structure which are conductive at least in regions are separated from each other by a dielectric intermediate element (48), and wherein conductive regions of the first structure (30a) form capacitors with opposite conductive regions of the second structure (30b). The textile pressure sensor is distinguished in that the first and/or the second structure (30a, 30b) which is conductive at least in regions is designed as a knitted fabric.

A conveyance apparatus for electronic components capable of suppressing the adhesion of electronic components to a storing member by static electricity. The conveyance apparatus for electronic components includes: a storing member which includes cavities for storing electronic components respectively; an electronic component supply mechanism which supplies the electronic components in a state where the electronic components are brought into contact with the storing member; and a moving unit which moves the storing member in a predetermined moving direction in a relative relationship with the electronic component, wherein a recessed portion for reducing a contact area of the storing member with the electronic components is formed in a region where the cavities are not formed on a main surface of the storing member on a side where the electronic components are supplied.

An energy storage system includes, in an exemplary embodiment, a first current collector having a first surface and a second surface, a first electrode including a plurality of carbon nanotubes on the second surface of the first current collector. The plurality of carbon nanotubes include a polydisulfide applied onto a surface of the plurality of nanotubes. The energy storage system also includes an ionically conductive separator having a first surface and a second surface, with first surface of the ionically conductive separator positioned on the first electrode, a second current collector having a first surface and a second surface, and a second electrode including a plurality of carbon nanotubes positioned between the first surface of the second current collector and the second surface of the ionically conductive separator.