Patent classifications
H01G15/00
Multilayer electronic component and board having the same
A multilayer electronic component includes a ceramic body having stacked dielectric layers to form a first capacitor part and a second capacitor part, wherein the first capacitor has a constant capacitance, and the second capacitor part has a variable capacitance; a voltage control terminal formed on a lateral surface of the ceramic body; an input terminal disposed on another lateral surface of the ceramic body corresponding to the first capacitor part; and an output terminal disposed on the other lateral surface of the ceramic body corresponding to the second capacitor part separate from the input terminal.
VOLTAGE CONTROLLED OSCILLATOR USING VARIABLE CAPACITOR AND PHASE LOCKED LOOP USING THE SAME
A variable capacitor is provided. The variable capacitor includes a plurality of capacitor segments. The plurality of capacitor segments are connected in parallel within the variable capacitor. When a plurality of candidate capacitances allowable to the variable capacitor according to a connection state of the plurality of capacitor segments connected in parallel are sorted in a magnitude sequence, the plurality of candidate capacitances form a geometric series. The variable capacitor is used for a Voltage Controlled Oscillator (VCO), and the VCO is used for a Phase Locked Loop (PLL).
VOLTAGE CONTROLLED OSCILLATOR USING VARIABLE CAPACITOR AND PHASE LOCKED LOOP USING THE SAME
A variable capacitor is provided. The variable capacitor includes a plurality of capacitor segments. The plurality of capacitor segments are connected in parallel within the variable capacitor. When a plurality of candidate capacitances allowable to the variable capacitor according to a connection state of the plurality of capacitor segments connected in parallel are sorted in a magnitude sequence, the plurality of candidate capacitances form a geometric series. The variable capacitor is used for a Voltage Controlled Oscillator (VCO), and the VCO is used for a Phase Locked Loop (PLL).
Composite electronic component and board having the same
A composite electronic component includes a multilayer capacitor; a tantalum capacitor; a lead frame disposed between the multilayer capacitor and the tantalum capacitor and electrically connecting the multilayer capacitor and the tantalum capacitor to each other; and an encapsulation member encapsulating the multilayer capacitor and the tantalum capacitor so that a portion of the lead frame is exposed.
Composite electronic component and board having the same
A composite electronic component includes a multilayer capacitor; a tantalum capacitor; a lead frame disposed between the multilayer capacitor and the tantalum capacitor and electrically connecting the multilayer capacitor and the tantalum capacitor to each other; and an encapsulation member encapsulating the multilayer capacitor and the tantalum capacitor so that a portion of the lead frame is exposed.
Composite electronic component, board having the same, and power smoother including the same
A composite electronic component includes a composite body formed by combining a multilayer ceramic capacitor (MLCC) and a tantalum capacitor. The composite electronic component has an excellent acoustic noise reduction effect, low equivalent series resistance (ESR)/equivalent series inductance (ESL), enhanced DC-bias characteristics, and a reduced chip thickness.
Composite electronic component, board having the same, and power smoother including the same
A composite electronic component includes a composite body formed by combining a multilayer ceramic capacitor (MLCC) and a tantalum capacitor. The composite electronic component has an excellent acoustic noise reduction effect, low equivalent series resistance (ESR)/equivalent series inductance (ESL), enhanced DC-bias characteristics, and a reduced chip thickness.
Composite electronic component and board having the same
A composite electronic component includes an insulation sheet, a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire, a portion of which is embedded in the body part, and disposed on the insulation sheet, a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second internal electrodes, and first and second external electrodes, and disposed on the insulation sheet, and a molded portion enclosing the tantalum capacitor and the multilayer ceramic capacitor. The first internal electrode includes a first lead portion led out to upper and lower surfaces and a first end surface of the ceramic body in a length direction, and the second internal electrode includes a second lead portion led out to the upper and lower surfaces and a second end surface of the ceramic body in the length direction.
Composite electronic component and board having the same
A composite electronic component includes an insulation sheet, a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire, a portion of which is embedded in the body part, and disposed on the insulation sheet, a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second internal electrodes, and first and second external electrodes, and disposed on the insulation sheet, and a molded portion enclosing the tantalum capacitor and the multilayer ceramic capacitor. The first internal electrode includes a first lead portion led out to upper and lower surfaces and a first end surface of the ceramic body in a length direction, and the second internal electrode includes a second lead portion led out to the upper and lower surfaces and a second end surface of the ceramic body in the length direction.
AIRFLOW COOLING FOR AN ENERGY STORAGE SYSTEM
The present disclosure is directed to systems and methods for providing a cooling airflow to an energy storage system. The energy storage system can include one or more energy storage devices positioned within a defined thermal zone. The energy storage system can include a thermal control system configured to provide a cooling airflow to the one or more energy storage devices. The thermal control system can include a heat exchanging device configured to provide a cooled airflow to the defined thermal zone. The thermal control system can also include a moveable element configured to adjust a distribution of airflow within the defined thermal zone.