According to one embodiment, an electronic device includes a power-supply voltage input terminal, a first capacitor, and a second capacitor. The first capacitor has a fixed capacitance. The second capacitor has a variable capacitance. The first capacitor and the second capacitor are connected in parallel to the power-supply voltage input terminal.

An inverter unit with reduced wiring impedance that includes a switching element unit and a capacitor unit is implemented. A capacitor unit 4 includes first portions 41 with a first length L1 which is a length in a first direction D1 orthogonal to a reference plane R1 of an inverter unit; and second portions 42 with a second length L2 shorter than the first length L1, and the first portions 41 and the second portions 42 are disposed adjacent to each other along the reference plane R1. The switching element unit 3 is disposed so as to overlap the second portions 42 as viewed in the first direction D1, and overlap the first portions 41 as viewed in a second direction D2 which is a direction in which the first portions 41 and the second portions 42 are arranged along the reference plane R1.

An energy storage assembly of capacitors (10) in a housing which is attached to a mounting surface (2). The mounting surface could be the inner surface of the rotary part (hub, (1)) of a wind turbine. The energy storage assembly being characterized in that it comprises a resiliently compressible material (40) situated between the energy storage element (capacitor) and a mounting surface. The resiliently compressible material serves to prevent damage to the energy storage caused by the movement of the wind turbine. The energy storage assembly acting as an emergency power supply for a pitch control mechanism of a wind turbine.

To improve reliability of a power conversion device with an efficient cooling structure. A power conversion device according to the present invention includes a power semiconductor module configured to convert power, a first capacitor configured to smooth the power, a conductor section forming a first power path between a power terminal and the first capacitor and a second power path between the first capacitor and the power semiconductor module, a noise filter section including a second capacitor that smooths power having a higher frequency than a frequency of the power smoothed by the first capacitor, and a cooling section forming a cooling surface, and the noise filter section is connected to the conductor section forming the first power path, and the conductor section forming the first power path is arranged in a space between the cooling surface and the noise filter section.

To improve reliability of a power conversion device with an efficient cooling structure. A power conversion device according to the present invention includes a power semiconductor module configured to convert power, a first capacitor configured to smooth the power, a conductor section forming a first power path between a power terminal and the first capacitor and a second power path between the first capacitor and the power semiconductor module, a noise filter section including a second capacitor that smooths power having a higher frequency than a frequency of the power smoothed by the first capacitor, and a cooling section forming a cooling surface, and the noise filter section is connected to the conductor section forming the first power path, and the conductor section forming the first power path is arranged in a space between the cooling surface and the noise filter section.

To improve reliability of a power conversion device with an efficient cooling structure. A power conversion device according to the present invention includes a power semiconductor module configured to convert power, a first capacitor configured to smooth the power, a conductor section forming a first power path between a power terminal and the first capacitor and a second power path between the first capacitor and the power semiconductor module, a noise filter section including a second capacitor that smooths power having a higher frequency than a frequency of the power smoothed by the first capacitor, and a cooling section forming a cooling surface, and the noise filter section is connected to the conductor section forming the first power path, and the conductor section forming the first power path is arranged in a space between the cooling surface and the noise filter section.

To improve reliability of a power conversion device with an efficient cooling structure. A power conversion device according to the present invention includes a power semiconductor module configured to convert power, a first capacitor configured to smooth the power, a conductor section forming a first power path between a power terminal and the first capacitor and a second power path between the first capacitor and the power semiconductor module, a noise filter section including a second capacitor that smooths power having a higher frequency than a frequency of the power smoothed by the first capacitor, and a cooling section forming a cooling surface, and the noise filter section is connected to the conductor section forming the first power path, and the conductor section forming the first power path is arranged in a space between the cooling surface and the noise filter section.

An inverter unit with reduced wiring impedance that includes a switching element unit and a capacitor unit is implemented. A capacitor unit 4 includes first portions 41 with a first length L1 which is a length in a first direction D1 orthogonal to a reference plane R1 of an inverter unit; and second portions 42 with a second length L2 shorter than the first length L1, and the first portions 41 and the second portions 42 are disposed adjacent to each other along the reference plane R1. The switching element unit 3 is disposed so as to overlap the second portions 42 as viewed in the first direction D1, and overlap the first portions 41 as viewed in a second direction D2 which is a direction in which the first portions 41 and the second portions 42 are arranged along the reference plane R1.

An electronic component includes a capacitor element, an inductor element connected electrically to the capacitor element, and an interlayer-insulation layer between the capacitor and inductor elements. The interlayer-insulation layer has a first principal surface, a second principal surface, and a via hole through the interlayer-insulation layer between the first and second principal surfaces. The capacitor element is at a side of the second principal surface of the interlayer-insulation layer and includes a first electrode layer, a second electrode layer, and a dielectric layer interposed between the first electrode layer and the second electrode layer. The inductor element is at a side of the first principal surface of the interlayer-insulation layer and includes an inductor wire that has an inductor portion disposed on the first principal surface and also has a via portion through the via hole to connect the inductor portion to the second electrode layer.

An electronic component includes a capacitor element, an inductor element connected electrically to the capacitor element, and an interlayer-insulation layer between the capacitor and inductor elements. The interlayer-insulation layer has a first principal surface, a second principal surface, and a via hole through the interlayer-insulation layer between the first and second principal surfaces. The capacitor element is at a side of the second principal surface of the interlayer-insulation layer and includes a first electrode layer, a second electrode layer, and a dielectric layer interposed between the first electrode layer and the second electrode layer. The inductor element is at a side of the first principal surface of the interlayer-insulation layer and includes an inductor wire that has an inductor portion disposed on the first principal surface and also has a via portion through the via hole to connect the inductor portion to the second electrode layer.