H01H49/00

Integrated cantilever switch
10861984 · 2020-12-08 · ·

An integrated transistor in the form of a nanoscale electromechanical switch eliminates CMOS current leakage and increases switching speed. The nanoscale electromechanical switch features a semiconducting cantilever that extends from a portion of the substrate into a cavity. The cantilever flexes in response to a voltage applied to the transistor gate thus forming a conducting channel underneath the gate. When the device is off, the cantilever returns to its resting position. Such motion of the cantilever breaks the circuit, restoring a void underneath the gate that blocks current flow, thus solving the problem of leakage. Fabrication of the nano-electromechanical switch is compatible with existing CMOS transistor fabrication processes. By doping the cantilever and using a back bias and a metallic cantilever tip, sensitivity of the switch can be further improved. A footprint of the nano-electromechanical switch can be as small as 0.10.1 m.sup.2.

Method of manufacturing MEMS switches with reduced switching voltage

An approach includes a method of fabricating a switch. The approach includes forming a first cantilevered electrode over a first electrode, forming a second cantilevered electrode over a second electrode and operable to directly contact the first cantilevered electrode upon an application of a voltage to at least one of the first electrode and a second electrode, and the first cantilevered electrode includes an arm with an extending protrusion which extends upward from an upper surface of the arm.

Method of manufacturing MEMS switches with reduced switching voltage

An approach includes a method of fabricating a switch. The approach includes forming a first cantilevered electrode over a first electrode, forming a second cantilevered electrode over a second electrode and operable to directly contact the first cantilevered electrode upon an application of a voltage to at least one of the first electrode and a second electrode, and the first cantilevered electrode includes an arm with an extending protrusion which extends upward from an upper surface of the arm.

Integrated mounting post and heat sink for contactor arrangement in power distribution system

A contactor post for an electrical contactor may comprise a body comprising an electrically and thermally conductive material, and a heat sink shunt extending from the body and comprising the electrically and thermally conductive material, wherein the body and the heat sink shunt are comprised of a single piece of the electrically and thermally conductive material.

Integrated mounting post and heat sink for contactor arrangement in power distribution system

A contactor post for an electrical contactor may comprise a body comprising an electrically and thermally conductive material, and a heat sink shunt extending from the body and comprising the electrically and thermally conductive material, wherein the body and the heat sink shunt are comprised of a single piece of the electrically and thermally conductive material.

ELECTRICAL CONTACT ASSEMBLY USING SILVER GRAPHITE
20200343066 · 2020-10-29 ·

According to one embodiment, an electrical contact assembly is disclosed. The assembly includes a layer of a conducting metal, a layer of copper adjacent to the layer of conducting metal, and a face layer comprising silver graphite adjacent to the layer of copper.

ELECTRICAL CONTACT ASSEMBLY USING SILVER GRAPHITE
20200343066 · 2020-10-29 ·

According to one embodiment, an electrical contact assembly is disclosed. The assembly includes a layer of a conducting metal, a layer of copper adjacent to the layer of conducting metal, and a face layer comprising silver graphite adjacent to the layer of copper.

Wall-mounted smart switches and outlets for use in building wiring for load control, home automation, and/or security purposes

Electrical switch devices are installed at in-wall electrical boxes of a building. Each device features a switch module with multiple electrically controlled switches for respective connection of multiple load circuits. A control panel with a user interface is mountable over the electrical box and is connected or connectable to the switch module. A communications transceiver of each device is operable to transmit and receive communications to and from each of the other devices. The control panel has a touch-screen display, and is configured to display virtual on-screen switches, including at least one virtual switch whose output is assigned to a respective one of the electrically controlled switches of the other devices. The at least one virtual switch at one device is thereby operable to control at least one load at another of said devices. User selected names are assignable to the switches, and used to label the virtual switches.

Wall-mounted smart switches and outlets for use in building wiring for load control, home automation, and/or security purposes

Electrical switch devices are installed at in-wall electrical boxes of a building. Each device features a switch module with multiple electrically controlled switches for respective connection of multiple load circuits. A control panel with a user interface is mountable over the electrical box and is connected or connectable to the switch module. A communications transceiver of each device is operable to transmit and receive communications to and from each of the other devices. The control panel has a touch-screen display, and is configured to display virtual on-screen switches, including at least one virtual switch whose output is assigned to a respective one of the electrically controlled switches of the other devices. The at least one virtual switch at one device is thereby operable to control at least one load at another of said devices. User selected names are assignable to the switches, and used to label the virtual switches.

Electromechanical Power Switch Integrated Circuits And Devices And Methods Thereof

An electromechanical power switch device and methods thereof. At least some of the illustrative embodiments are devices including a semiconductor substrate, at least one integrated circuit device on a front surface of the semiconductor substrate, an insulating layer on the at least one integrated circuit device, and an electromechanical power switch on the insulating layer. By way of example, the electromechanical power switch may include a source and a drain, a body region disposed between the source and the drain, and a gate including a switching metal layer. In some embodiments, the body region includes a first body portion and a second body portion spaced a distance from the first body portion and defining a body discontinuity therebetween. Additionally, in various examples, the switching metal layer may be disposed over the body discontinuity.