A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, and a first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. The first and second input circuits are connected in series. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.

A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, and a first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. The first and second input circuits are connected in series. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.

A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, a first connection line, and a first monitor terminal connected to the first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.

A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, a first connection line, and a first monitor terminal connected to the first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.

An electromagnetic relay includes a base frame including a main body supporting a fixed element, and a bottom plate having a plate thickness direction in an extending direction orthogonal to a central-axis line direction. An intermediate cover includes a covering plate facing a contact mechanism unit. An outer cover includes a top plate facing the bottom plate across the contact mechanism unit, and a first side plate extending from one end of the top plate and facing the covering plate. A first gap between the covering plate and the bottom plate in the extending direction and a second gap between the covering plate and the top plate in the extending direction are arranged to be substantially symmetric across the covering plate in the extending direction, the first gap and the second gap being on the first side plate.

An electromagnetic relay includes a base frame including a main body supporting a fixed element, and a bottom plate having a plate thickness direction in an extending direction orthogonal to a central-axis line direction. An intermediate cover includes a covering plate facing a contact mechanism unit. An outer cover includes a top plate facing the bottom plate across the contact mechanism unit, and a first side plate extending from one end of the top plate and facing the covering plate. A first gap between the covering plate and the bottom plate in the extending direction and a second gap between the covering plate and the top plate in the extending direction are arranged to be substantially symmetric across the covering plate in the extending direction, the first gap and the second gap being on the first side plate.

Systems and methods for forming a magnetostatic MEMS switch include forming a movable beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A shunt bar on the movable plate may close the switch when lowered onto the contacts. The switch may generally be closed, with the shunt bar resting on the contacts. However, a magnetically permeable material may also be inlaid into the movable plate. The switch may then be opened by placing either a permanent magnet or an electromagnet in proximity to the switch.

A system may include a relay device that includes armatures associated with phases of voltage signals. The system may also include relay coils, such that each relay coil may receive a respective voltage that magnetizes a respective relay coil, thereby causing the respective armature to move from a respective first position to a respective second position. The system may also include a control system that receive an indication that a fault condition is present, identify a first phase of the phases of voltage signals that is expected to be the next phase of the phases to cross zero, and send a signal to the relay device in response to identifying the first phase. The signal is configured to cause a first relay coil of the relay coils to energize or deenergize.

Systems and methods for contact erosion mitigation are provided. To perform contact erosion mitigation, an order of opening/closing poles and/or contact relays of particular poles is altered, resulting in a sharing of potential arcing conditions amongst the poles/contact relays of these poles.

A point-on-wave relay device includes a first contact relay and a second contact relay in series with the first contact relay. A first state of the first contact relay in conjunction with a first state of the second contact relay causes a point-on-wave open operation and second state of the first contact relay in conjunction with a second state of the second contact relay causes a point-on-wave close operation.