A electromechanical relay device (100) comprising a source electrode (102), a beam (104) mounted on the source electrode at a first end and electrically coupled to the source electrode; a first drain electrode (112) located adjacent a second end of the beam, wherein a first contact (110) on the beam is arranged to be separated from a second contact (112) on the first drain electrode when the relay device is in a first condition; a first gate electrode (106 arranged to cause the beam to deflect, to electrically couple the first contact and the second contact such that the device is in a second condition; and wherein the first and second contacts are each coated with a layer of nanocrystalline graphite.

The present invention generally relates to a mechanism for making the anchor of the MEMS switch more robust for current handling. The disclosure includes a modified leg and anchor design that allows for larger currents to be handled by the MEMS switch.

In various embodiments, a measuring arrangement is provided. The measuring arrangement may include a micromechanical sensor including a capacitor, a bridge circuit including a plurality of capacitors, at least one capacitor of which is the capacitor of the micromechanical sensor, an amplifier coupled, on the input side, to an output of the bridge circuit, a DC voltage source configured to provide an electrical DC voltage, a chopper including at least one first charge store and a switch structure, The switch structure is configured to couple the first charge store alternately to the DC voltage and the bridge circuit for the purpose of coupling an electrical mixed voltage into the bridge circuit.

The present disclosure generally relates to the design of a MEMS ohmic switch which provides for a low-impact landing of the MEMS device movable plate on the RF contact and a high restoring force for breaking the contacts to improve the lifetime of the switch. The switch has at least one contact electrode disposed off-center of the switch device and also has a secondary landing post disposed near the center of the switch device. The secondary landing post extends to a greater height above the substrate as compared to the RF contact of the contact electrode so that the movable plate contacts the secondary landing post first and then gently lands on the RF contact. Upon release, the movable plate will disengage from the RF contact prior to disengaging from the secondary landing post and have a longer lifetime due to the high restoring force.

[Object] To provide an electrostatic device capable of improving device characteristics. [Solving Means] An electrostatic device according to an embodiment of the present technology includes an electrically conductive base material, a first conductor layer, a second conductor layer, and a bonding layer. The first conductor layer includes a first electrode portion and a first base portion and is connected to a signal line. The first base portion supports the first electrode portion and is disposed on the base material. The second conductor layer includes a second electrode portion and a second base portion and is connected to a reference potential. The second electrode portion is opposed to the first electrode portion in a first axis direction and configured to be movable relative to the first electrode portion in the first axis direction. The second base portion supports the second electrode portion and is disposed on the base material. The bonding layer is disposed between the base material and the first and second base portions and includes a plurality of first bonding portions that partially support at least the first base portion.

[Object] To provide an electrostatic device capable of improving device characteristics. [Solving Means] An electrostatic device according to an embodiment of the present technology includes an electrically conductive base material, a first conductor layer, a second conductor layer, and a bonding layer. The first conductor layer includes a first electrode portion and a first base portion and is connected to a signal line. The first base portion supports the first electrode portion and is disposed on the base material. The second conductor layer includes a second electrode portion and a second base portion and is connected to a reference potential. The second electrode portion is opposed to the first electrode portion in a first axis direction and configured to be movable relative to the first electrode portion in the first axis direction. The second base portion supports the second electrode portion and is disposed on the base material. The bonding layer is disposed between the base material and the first and second base portions and includes a plurality of first bonding portions that partially support at least the first base portion.

A power relay circuit for switching a load current includes a micro-electro-mechanical system (MEMS) switch and a semiconductor power switch. The MEMS switch and the semiconductor power switch are connected in series with the load current.

An approach includes a method of fabricating a switch. The approach includes forming a first cantilevered electrode over a first fixed electrode, forming a second cantilevered electrode with an end that overlaps the first cantilevered electrode, forming a third cantilevered electrode operable to directly contact the first cantilevered electrode upon an application of a voltage to a second fixed electrode, and forming a hermetically sealed volume encapsulating the first fixed electrode, the second fixed electrode, the first cantilevered electrode, and the second cantilevered electrode.

An approach includes a method of fabricating a switch. The approach includes forming a first cantilevered electrode over a first fixed electrode, forming a second cantilevered electrode with an end that overlaps the first cantilevered electrode, forming a third cantilevered electrode operable to directly contact the first cantilevered electrode upon an application of a voltage to a second fixed electrode, and forming a hermetically sealed volume encapsulating the first fixed electrode, the second fixed electrode, the first cantilevered electrode, and the second cantilevered electrode.

A method of forming a Micro-Electro-Mechanical System (MEMS) includes forming a lower electrode on a first insulator layer within a cavity of the MEMS. The method further includes forming an upper electrode over another insulator material on top of the lower electrode which is at least partially in contact with the lower electrode. The forming of the lower electrode and the upper electrode includes adjusting a metal volume of the lower electrode and the upper electrode to modify beam bending.