An electro-technical device includes a first housing portion electrically isolated from a second housing portion with a point source being disposed within the first housing portion. A movable conductor is connected to the first portion and is responsive to an electric field generated by the point source to cause the movable conductor to contact the second housing portion to complete a circuit and send out a control signal.

An electro-technical device includes a first housing portion electrically isolated from a second housing portion with a point source being disposed within the first housing portion. A movable conductor is connected to the first portion and is responsive to an electric field generated by the point source to cause the movable conductor to contact the second housing portion to complete a circuit and send out a control signal.

An electromechanical power switch device and methods thereof. At least some of the illustrative embodiments are devices including a semiconductor substrate, at least one integrated circuit device on a front surface of the semiconductor substrate, an insulating layer on the at least one integrated circuit device, and an electromechanical power switch on the insulating layer. By way of example, the electromechanical power switch may include a source and a drain, a body region disposed between the source and the drain, and a gate including a switching metal layer. In some embodiments, the body region includes a first body portion and a second body portion spaced a distance from the first body portion and defining a body discontinuity therebetween. Additionally, in various examples, the switching metal layer may be disposed over the body discontinuity.

Provided is an electrostatic drive switch, which includes a source plate to which a voltage for driving the electrostatic drive switch is applied and a drain electrode spaced apart from the source plate. The source plate includes a source electrode and an elastic part connected to the source electrode, and a first material and a second material having lower hardness than the first material are provided on the source electrode. When the source electrode and the drain electrode are electrically connected to each other by the voltage, the second material is brought into contact with the drain electrode by the elastic part after the first material is brought into contact with the drain electrode by the elastic part.

According to one embodiment, a MEMS element includes a first member, and an element part. The element part includes a first fixed electrode fixed to the first member, a first movable electrode facing the first fixed electrode, a first conductive member electrically connected to the first movable electrode, and a second conductive member electrically connected to the first movable electrode. The first conductive member and the second conductive member support the first movable electrode to be separated from the first fixed electrode in a first state before a first electrical signal is applied between the second conductive member and the first fixed electrode. The first conductive member and the second conductive member are in a broken state in a second state after the first electrical signal is applied between the second conductive member and the first fixed electrode.

A passive wireless switch circuit and related apparatus are provided. In examples discussed herein, an apparatus includes a smaller number of voltage circuits configured to control a larger number of microelectromechanical systems (MEMS) switches. The voltage circuits passively generate a number of constant voltages based on a number of radio frequency (RF) signals to collectively identify each of the MEMS switches. A decoder circuit decodes the constant voltages to identify a selected MEMS switch and provides a selected constant voltage higher than a defined threshold voltage to close the selected MEMS switch. As such, it may be possible to eliminate active components and/or circuits from the passive wireless switch circuit, thus helping to reduce leakage and power consumption. It may be further possible to reduce conductive traces between the voltage circuits and the MEMS switches, thus helping to reduce routing complexity and footprint of the apparatus.

An approach includes a method of fabricating a switch. The approach includes forming a first cantilevered electrode, forming a second cantilevered electrode over an electrode and operable to contact the first cantilevered electrode upon an application of a voltage to the electrode, and forming an arm on the first cantilevered electrode with an extending protrusion extending upward from an upper surface of the arm.

An approach includes a method of fabricating a switch. The approach includes forming a first cantilevered electrode, forming a second cantilevered electrode over an electrode and operable to contact the first cantilevered electrode upon an application of a voltage to the electrode, and forming an arm on the first cantilevered electrode with an extending protrusion extending upward from an upper surface of the arm.

The present disclosure generally relates to a MEMS device for reducing ESD. A contacting switch is used to ensure that there is a closed electrical contact between two electrodes even if there is no applied bias voltage.

Optically isolated micromachined (MEMS) switches and related methods are described. The optically isolated MEMS switches described herein may be used to provide isolation between electronic devices. For example, the optically isolated MEMS switches of the types described herein can enable the use of separate grounds between the receiving electronic device and the control circuitry. Isolation of high-voltage signals and high-voltage power supplies can be achieved by using an optical isolator and a MEMS switch, where the optical isolator controls the state of the MEMS switch. In some embodiments, utilizing optical isolators to provide high voltages, the need for electric high-voltage sources such as high-voltage power supplies and charge pumps may be removed, thus removing the cause of potential damage to the receiving electronic device. In one example, the optical isolator and the MEMS switch may be co-packaged on the same substrate.