Various embodiments of the teachings herein include an electronic module comprising a microelectromechanical system (MEMS) switch with a substrate and a semiconductor component. The semiconductor component is formed with the substrate and connected to MEMS switch. The semiconductor component includes a diode. The substrate is formed from or with a silicon-on-insulator-wafer and/or silicon-on-insulator substrate.

Various embodiments of the teachings herein include an electronic module comprising a microelectromechanical system (MEMS) switch with a substrate and a semiconductor component. The semiconductor component is formed with the substrate and connected to MEMS switch. The semiconductor component includes a diode. The substrate is formed from or with a silicon-on-insulator-wafer and/or silicon-on-insulator substrate.

This electrical protection device (300) is configured to be reversibly mounted on a distribution device (110) comprising a power bus (124). The device for protecting the incoming terminals (302), connectable to the power bus, and a switching mechanism (310) with a movable contact (370) and a tripping device (372). The protection device comprises a safety mechanism (500), which comprises a support portion (502), which is movable and which is configured to be pushed back, against a return member (504), into a retracted position when the protection device is mounted on the distribution device. When the protection device is dismantled, the support portion moves and the safety device activates the tripping device (372), causing the switching mechanism to switch to an isolation configuration before each incoming terminal is disconnected from the power bus.