The present invention relates to provide a hot air supplying head for transferring a micro LED and a micro LED transfer system using the same, the hot air supplying head effectively transferring micro LEDs.

In various embodiments, controlled heating and/or cooling conditions are utilized during the fabrication of aluminum nitride single crystals and aluminum nitride bulk polycrystalline ceramics. Thermal treatments may also be utilized to control properties of aluminum nitride crystals after fabrication.

A display substrate includes a drive substrate and a welding pad provided on the drive substrate and electrically connected with the drive substrate. The display substrate further includes an insulating construction layer provided on the welding pad. The insulating construction layer is provided with a groove for exposing the welding pad. A bonding material is accommodated in the groove, and a micro light emitting diode is electrically connected with the welding pad through the bonding material.

A display device includes a substrate, an interlayer insulating layer over the substrate, a metal layer over the interlayer insulating layer, and a light emitting element over the metal layer. The interlayer insulating layer includes a plurality of a first depressed portions. The metal layer includes a first region bonding to the light emitting element and a second region surrounding the first region. The second region, a plurality of second depressed portions is provided along the plurality of first depressed portions.

A micro-LED display device and a manufacturing method thereof are disclosed. The method comprises: forming micro-LEDs (202) on a carrier substrate (201), wherein the carrier substrate (201) is transparent for a laser which is used in laser lifting-off; filling trenches between the micro-LEDs (202) on the carrier substrate (201) with a holding material (209); performing a laser lifting-off on selected ones of the micro-LEDs (202) to lift off them from the carrier substrate (201), wherein the selected micro-LEDs (202) are held on the carrier substrate (201) through the holding material (209); bonding the selected micro-LEDs (202) onto a receiving substrate (207) of the micro-LED display device; separating the selected micro-LEDs (202) from the carrier substrate (201) to transfer them to the receiving substrate (207).

The present disclosure provides a light emitting device including a substrate, a conductive layer, first and second reflective layers, a light emitting element, and an encapsulation layer. The conductive layer is disposed on the substrate. The first reflective layer covers the conductive layer and has an opening exposing a portion of the conductive layer. The light emitting element is disposed in the opening and electrically connects to the conductive layer. The second reflective layer is disposed on the first reflective layer and surrounds the light emitting element, and the second reflective layer has an outer diameter. The encapsulation layer covers the light emitting element. There is a height between a highest point of the encapsulation layer and an upper surface of the first reflective layer, and the height is 0.1 to 0.5 times the outer diameter. The present disclosure also provides a backlight and a display panel.

Discussed is a method of manufacturing a display device, the method including: introducing semiconductor light emitting devices including a magnetic material into a fluid chamber; transferring a substrate to the fluid chamber, the substrate including assembly electrodes, an insulating layer covering the assembly electrodes, and open holes in the insulating layer and exposing portions of both ends of the assembly electrodes; applying a magnetic force to the semiconductor light emitting devices introduced into the fluid chamber to move the semiconductor light emitting devices in one direction; and forming an electric field so that the moving semiconductor light emitting devices are disposed at preset positions of the substrate, wherein a probe pin is in contact with the assembly electrodes exposed through the open holes to individually apply a voltage to the assembly electrodes to form the electric field.

A self-assembly apparatus can include a fluid chamber for accommodating a fluid and semiconductor light-emitting elements, a conveyor to convey an assembly substrate so one surface of the assembly substrate is immersed in the fluid, the assembly substrate having a plurality of assembly electrodes, a magnet array spaced apart from the fluid chamber to apply a magnetic force to the semiconductor light-emitting elements, a power supply to apply power to the plurality of assembly electrodes disposed on the assembly substrate so that the semiconductor light-emitting elements are seated in a preset region on the assembly substrate, and a repair substrate disposed to face the one surface of the assembly substrate and including a plurality of pair electrodes on which an electric field is generated as power is supplied. The plurality of pair electrodes can be disposed at the same interval as the plurality of assembly electrodes.

The present application provides display panels, transparent display panels and manufacturing methods therefor. A transparent display panel includes a light transmitting substrate, pixel structures, second electrode connecting portions, and a nano-material layer. A display region of the light transmitting substrate includes alternately distributed pixel regions and non-pixel regions. The pixel structures are located in the pixel regions, each including: a first electrode close to the light transmitting substrate, a second electrode away from the light transmitting substrate, and a light emitting block between the first electrode and the second electrode. The second electrode connecting portions are located in the non-pixel regions, and connect adjacent second electrodes, and one or more materials for the second electrode connecting portions are the same as the one or more materials for the second electrodes, both including transflective materials. The nano-material layer includes a plurality of nano-island structures separated from each other, and is located at least on a side of the second electrode connecting portions away from the light transmitting substrate, and is configured to excite surface plasma polaritons corresponding to infrared light and scatter the infrared light.

A display panel includes a substrate, at least two repeating units, and a light-shielding layer. Each repeating unit includes a plurality of sub-pixels including a first color sub-pixel and a second color sub-pixel. As a viewing angle increases, a luminance decay rate of the first color sub-pixel is greater than a luminance decay rate of the second color sub-pixel. The light-shielding layer includes a plurality of opening portions including first opening portions respectively corresponding to first color sub-pixels and second opening portions respectively corresponding to second color sub-pixels. Along a first direction, a difference between a length of a first opening portion and a length of a portion of the first color sub-pixel exposed from the first opening portion is greater than a difference between a length of a second opening portion and a length of a portion of the second color sub-pixel exposed from the second opening portion.